JPS6197846U - - Google Patents
Info
- Publication number
- JPS6197846U JPS6197846U JP18264284U JP18264284U JPS6197846U JP S6197846 U JPS6197846 U JP S6197846U JP 18264284 U JP18264284 U JP 18264284U JP 18264284 U JP18264284 U JP 18264284U JP S6197846 U JPS6197846 U JP S6197846U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- view
- attaching
- hole
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
第１図ａ：本考案による半導体パツケージの外
観図。第１図ｂ：第１図ａにおける側面図。第１
図ｃ：第１図ａにおける側面断面図。第２図：第
１図における本考案の半導体パツケージの機器取
り付け状態の断面図。第３図ａ：整流用ダイオー
ドブリツジである従来の半導体パツケージの外観
図。第３図ｂ：第３図ａにおける側面図。第３図
ｃ：第３図ａにおける側面断面図。第４図：従来
の半導体パツケージの機器取り付け状態の断面図
。
符号、１，８：外形ケース、１ａ，８ａ：外形
ケース厚さ、２，１１：固定用ネジ、３：径大部
、４，９：取り付け用孔、５，１２：締結部品、
６，１０：放熱フイン、７，１４：デバイス出力
端子、１３：突出表面。
FIG. 1a: External view of a semiconductor package according to the present invention. Figure 1b: Side view in Figure 1a. 1st
Figure c: Side sectional view in Figure 1a. FIG. 2: A sectional view of the semiconductor package of the present invention shown in FIG. 1 in a state where equipment is attached. FIG. 3a: External view of a conventional semiconductor package that is a rectifying diode bridge. Figure 3b: Side view in Figure 3a. Figure 3c: Side sectional view in Figure 3a. FIG. 4: A sectional view of a conventional semiconductor package in which equipment is attached. Code, 1, 8: External case, 1a, 8a: External case thickness, 2, 11: Fixing screw, 3: Large diameter part, 4, 9: Mounting hole, 5, 12: Fastening parts,
6, 10: heat dissipation fin, 7, 14: device output terminal, 13: protruding surface.
Claims (1)
形成した半導体パツケージにおいて、上記取り付
け用孔の端子側に機器への固定用ネジのネジ頭部
収納用の径大部を設けたことを特徴とする半導体
パツケージ。 A semiconductor package having a hole for attaching to a device formed in the center of the package, characterized in that a large-diameter portion for storing the screw head of a screw for fixing to the device is provided on the terminal side of the attaching hole. Semiconductor package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18264284U JPS6197846U (en) | 1984-11-30 | 1984-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18264284U JPS6197846U (en) | 1984-11-30 | 1984-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6197846U true JPS6197846U (en) | 1986-06-23 |
Family
ID=30740177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18264284U Pending JPS6197846U (en) | 1984-11-30 | 1984-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6197846U (en) |
-
1984
- 1984-11-30 JP JP18264284U patent/JPS6197846U/ja active Pending