JPS61131838U - - Google Patents
Info
- Publication number
- JPS61131838U JPS61131838U JP1985015704U JP1570485U JPS61131838U JP S61131838 U JPS61131838 U JP S61131838U JP 1985015704 U JP1985015704 U JP 1985015704U JP 1570485 U JP1570485 U JP 1570485U JP S61131838 U JPS61131838 U JP S61131838U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- sealing resin
- main surface
- recess
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ａ，ｂはそれぞれ本考案の半導体装置の
一実施例を示す側面図、Ａ―Ａ断面図、第２図ａ
，ｂはそれぞれ従来の半導体装置の一例を示す側
面図、Ａ―Ａ断面図である。
１，１′……放熱板、２……封止樹脂部、３…
…半導体素子、４……金属細線、５……外部リー
ド、６……ねじ穴、７……凹部、８……切欠部。
1a and 1b are a side view, an AA cross-sectional view, and 2a, respectively, showing an embodiment of the semiconductor device of the present invention.
, b are a side view and a sectional view taken along line AA, respectively, showing an example of a conventional semiconductor device. 1, 1'... Heat sink, 2... Sealing resin part, 3...
...Semiconductor element, 4...Thin metal wire, 5...External lead, 6...Screw hole, 7...Recess, 8...Notch.
Claims (1)
向に導出する外部リードとを金属細線で結線し且
つ前記放熱板の前記一主面と相対する面が露出す
るように前記半導体素子を含む主要部分を封止用
樹脂で封止して成る半導体装置において、前記放
熱板は前記一主面の封止樹脂部の縁部に凹部を備
え、該凹部に前記封止用樹脂を充填したことを特
徴とする半導体装置。 A semiconductor element fixed to one main surface of the heat sink and an external lead led out in one direction are connected with a thin metal wire, and the semiconductor element is included such that a surface facing the one main surface of the heat sink is exposed. In a semiconductor device whose main portion is sealed with a sealing resin, the heat sink has a recess at the edge of the sealing resin portion on the one main surface, and the recess is filled with the sealing resin. A semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985015704U JPS61131838U (en) | 1985-02-06 | 1985-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985015704U JPS61131838U (en) | 1985-02-06 | 1985-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61131838U true JPS61131838U (en) | 1986-08-18 |
Family
ID=30501790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985015704U Pending JPS61131838U (en) | 1985-02-06 | 1985-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61131838U (en) |
-
1985
- 1985-02-06 JP JP1985015704U patent/JPS61131838U/ja active Pending
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