JPH01100451U - - Google Patents
Info
- Publication number
- JPH01100451U JPH01100451U JP1987195453U JP19545387U JPH01100451U JP H01100451 U JPH01100451 U JP H01100451U JP 1987195453 U JP1987195453 U JP 1987195453U JP 19545387 U JP19545387 U JP 19545387U JP H01100451 U JPH01100451 U JP H01100451U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- heat sink
- lead wire
- led out
- wire connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000725 suspension Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
第１図は、本考案に係る絶縁型半導体装置の平
面図、第２図は、第１図のＡ―Ａ線に沿う断面図
、第３図は、従来の絶縁型半導体装置の第２図相
当の断面図、第４図は、樹脂封止方法を説明する
ための断面図である。
１……放熱板、２……つりピン、３１，３２…
…リード線、４……素子、６……樹脂、６１……
突出部、６２……突出薄片。
FIG. 1 is a plan view of an insulated semiconductor device according to the present invention, FIG. 2 is a sectional view taken along line AA in FIG. 1, and FIG. 3 is a second diagram of a conventional insulated semiconductor device. A corresponding cross-sectional view, FIG. 4, is a cross-sectional view for explaining the resin sealing method. 1... Heat sink, 2... Hanging pin, 3 1 , 3 2 ...
...Lead wire, 4...Element, 6...Resin, 6 1 ...
Protruding portion, 6 2 ...Protruding thin piece.
Claims (1)
面のみは両端に突出部を形成して樹脂封止し、樹
脂の突出部を形成した側面には、放熱板の一側面
より延長するつりピンが導出され、又、樹脂の突
出部を形成した側面とは反対の側面には、素子に
接続するリード線と放熱板に接続するリード線と
が導出されたものにおいて、樹脂の突出部間で、
且つ、つりピンの下側に、樹脂より一体的に延長
した突出薄片を形成したことを特徴とする絶縁型
半導体装置。 The entire circumference of the heat sink with elements attached to its surface is sealed with resin by forming protrusions on both ends of only one side, and the side with the resin protrusion formed extends from one side of the heat sink. A suspension pin is led out, and a lead wire connected to the element and a lead wire connected to the heat sink are led out on the side opposite to the side surface where the resin projection is formed, and the resin projection Between,
An insulated semiconductor device characterized in that a protruding thin piece integrally extended from resin is formed on the lower side of the suspension pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987195453U JPH01100451U (en) | 1987-12-22 | 1987-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987195453U JPH01100451U (en) | 1987-12-22 | 1987-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01100451U true JPH01100451U (en) | 1989-07-05 |
Family
ID=31486131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987195453U Pending JPH01100451U (en) | 1987-12-22 | 1987-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01100451U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009135444A (en) * | 2007-10-15 | 2009-06-18 | Power Integrations Inc | Package for power semiconductor device |
-
1987
- 1987-12-22 JP JP1987195453U patent/JPH01100451U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009135444A (en) * | 2007-10-15 | 2009-06-18 | Power Integrations Inc | Package for power semiconductor device |