JPS61123536U - - Google Patents
Info
- Publication number
- JPS61123536U JPS61123536U JP670285U JP670285U JPS61123536U JP S61123536 U JPS61123536 U JP S61123536U JP 670285 U JP670285 U JP 670285U JP 670285 U JP670285 U JP 670285U JP S61123536 U JPS61123536 U JP S61123536U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead frame
- semiconductor manufacturing
- temperature
- pressurizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 2
- 230000009477 glass transition Effects 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
図は本考案の実施例を示し、第１図ａは本考案
のＤＩＬＰ型に適用した例を示す断面図、第１図
ｂは加熱物体のヘツド形状とリードフレームを対
応させて示す斜視図である、
１…半導体チツプ、２…封止樹脂、３…リード
フレーム、４…加熱物体、４ａ…加熱物体主部、
４ｂ…加熱物体ヘツド。
The figures show an embodiment of the present invention. Figure 1a is a sectional view showing an example of the invention applied to a DILP type, and Figure 1b is a perspective view showing the correspondence between the head shape of the heating object and the lead frame. Yes, 1... semiconductor chip, 2... sealing resin, 3... lead frame, 4... heating object, 4a... main part of heating object,
4b...Heating object head.
Claims (1)
る樹脂封止型半導体製造装置においてリードフレ
ーム周囲の樹脂をガラス転移温度以上に加熱した
高温物体で加圧することにより製作することを特
徴とする樹脂封止型半導体製造装置。 A resin-sealed semiconductor manufacturing device that seals a semiconductor element and a lead frame with resin, which is manufactured by pressurizing the resin around the lead frame with a high-temperature object heated to a temperature higher than the glass transition temperature. Semiconductor manufacturing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP670285U JPS61123536U (en) | 1985-01-23 | 1985-01-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP670285U JPS61123536U (en) | 1985-01-23 | 1985-01-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61123536U true JPS61123536U (en) | 1986-08-04 |
Family
ID=30484388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP670285U Pending JPS61123536U (en) | 1985-01-23 | 1985-01-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61123536U (en) |
-
1985
- 1985-01-23 JP JP670285U patent/JPS61123536U/ja active Pending