JP2007049034A - High-frequency apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high-frequency apparatus which has excellent heat dissipating efficiency and is electrically shielded well. <P>SOLUTION: In a high-frequency apparatus, a thermal conductor 2 is provided as an integral part of a frame 1. The thermal conductor 2 is equipped with a connecting part 2a connected to the frame 1, a plate-like part 2b kept in contact with a heat releasing component 3, and legs 2c which are formed by bending the plate-like part 2b so as to protrude outside of the frame 1 penetrating through a cover 9. The legs 2c are made connectable to a conductive pattern 11 formed on a mother board 10, and heat released from the heat releasing component 3 is dissipated from the conductive pattern 11 through the intermediary of the plate-like part 2b and legs 2c, so that the heat releasing component 3 and the conductive pattern 11 are connected together with the short legs 2c, and heat released from the component 3 is efficiently dissipated outside. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a high-frequency device that is used in a digital television tuner or the like and has good heat dissipation efficiency from heat-generating components.

  FIG. 3 is a cross-sectional view of a main part of a conventional high frequency device. Next, the configuration of the conventional high frequency device will be described with reference to FIG. The frame 51 has a square-shaped side wall 51a surrounding the outer peripheral portion, and openings 51b provided above and below the side wall 51a. In the frame 51, various electronic components including a heat generating component 52 are provided. A circuit board 53 on which components are mounted and a desired electric circuit is formed is disposed.

The cover 54 made of a metal plate is attached to the frame body 51 so as to cover the opening 51b of the frame body 51. Thus, the inside of the frame body 51 is electrically shielded, and one cover 54 is cut and raised. The tongue piece 54a is formed in contact with the upper surface of the heat generating component 52 so that the heat of the heat generating component 52 is dissipated through the tongue piece 54a. However, the frame body 51 is soldered to the conductive pattern of the mother board to form a conventional high-frequency device (see, for example, Patent Document 1).
Japanese Patent Laid-Open No. 11-233982 (second page, FIG. 6)

  However, in the conventional high-frequency device, since the tongue piece 54a cut and raised from the cover 54 comes into contact with the heat generating component 52 to dissipate heat from the heat generating component 52, the distance from the heat generating component 52 to the mother board. And the heat dissipation efficiency to the outside deteriorates, and the formation of the cut-out tongue piece 54a causes a large opening in the cover 54, resulting in a poor electrical shield in the frame 51. There's a problem.

  The present invention has been made in view of the actual situation of the prior art, and an object of the present invention is to provide a high-frequency device having good heat dissipation efficiency and good electrical shielding.

  In order to achieve the above object, as a first solving means of the present invention, a box-shaped frame made of a metal plate and having an opening, a circuit board disposed in the frame and mounted with a heat generating component, And a cover attached to the frame so as to cover the opening, and the frame is provided with a heat conductor formed integrally with the frame, and the heat conductor A connecting portion connected to the body, a plate-like portion that contacts the heat-generating component, and a leg portion bent from the plate-like portion so as to protrude out of the frame body through the cover, The conductive pattern provided on the mother board can be connected, and the heat of the heat generating component can be radiated from the conductive pattern through the plate-like portion and the leg portion.

  As a second solution, the plate portion of the heat conductor is in contact with silicon grease interposed between the heat generating components.

  As a third solving means, a plurality of the leg portions are formed at intervals.

  As a fourth solution, the frame body has a side wall that surrounds the outer peripheral portion and a shield plate provided in the side wall, and the connecting portion of the heat conductor is connected to the shield plate. The configuration was as follows.

  In the high-frequency device of the present invention, the heat conductor provided integrally with the frame body includes a connecting portion connected to the frame body, a plate-like portion in contact with the heat generating component, and a plate projecting out of the frame body through the cover. The leg portion is bent from the shape portion, and the leg portion can be connected to the conductive pattern provided on the mother board so that the heat of the heat generating component is radiated from the conductive pattern through the plate shape portion and the leg portion. As a result, the heat generating component and the conductive pattern are connected by a leg portion with a short distance, the heat radiation efficiency to the outside is good, and the frame body is provided with a heat conductor, so the opening of the cover Can be made extremely small and a good electrical shielding effect can be obtained.

  Further, since the plate-like portion of the heat conductor is in contact with the silicon grease interposed between the heat-generating component, the contact area between the heat-generating component and the plate-like portion is increased, and the heat conduction to the plate-like portion is increased. A good one is obtained.

  In addition, since a plurality of leg portions are formed at intervals, heat conduction from the leg portions to the conductive pattern can be increased, and the heat radiation efficiency to the outside can be further improved.

  In addition, the frame has a side wall that surrounds the outer periphery and a shield plate provided in the side wall, and since the connecting portion of the heat conductor is provided connected to the shield plate, the material removal at the time of frame formation is Get better and get cheaper.

  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the drawings, an embodiment of the present invention will be described. FIG. 1 is a cross-sectional view of a main part according to the high-frequency device of the present invention, and FIG. Next, the configuration of the high-frequency device according to the present invention will be described with reference to FIGS. 1 and 2. A box-shaped frame body 1 made of a metal plate has a square-shaped side wall 1a surrounding an outer peripheral portion. And an opening 1b provided above and below the side wall 1a, a shield plate 1c formed integrally with the side wall 1a and partitioning the inside of the side wall 1a, and a heat conductor 2 provided integrally with the shield plate 1c. .

  The heat conductor 2 includes a connecting portion 2a connected to the shield plate 1c, a plate-like portion 2b that contacts a heat generating component 3 to be described later, and a plurality of legs bent from the plate-like portion 2b and spaced apart from each other. Part 2c. The heat conductor 2 may be formed integrally with the side wall 1a.

  In the frame 1, various electronic components (not shown) including a heat generating component 3 made of an IC component (demodulation IC) are mounted, and a first circuit board 4 on which a demodulation circuit is formed, A second circuit board 6 on which various electronic components 5 are mounted and an RF circuit is formed is disposed across the shield plate 1c. Then, silicon grease 7 is provided between the back surface of the heat generating component 3 and the plate-like portion 2 b of the heat conductor 2. Although 2b is in contact, the plate-like portion 2b may be brought into direct contact with the heat generating component 3.

An upper cover 8 made of a metal plate is attached to the frame 1 so as to cover an opening 1b above the frame 1, and a lower cover 9 made of a metal plate has an opening 1b below the frame 1. It is attached to the frame 1 so as to cover it, thereby electrically shielding the inside of the frame 1, and the leg 2 c of the heat conductor 2 protrudes downward through the hole 9 a provided in the lower cover 9. The leg 2c is soldered together with the frame 1 to the conductive pattern (grounding pattern) 11 of the mother board 10 disposed at the lower part of the frame 1 to form the high-frequency device of the present invention. In the high-frequency device of the present invention having such a configuration, when the heat generating component 3 generates heat, heat is transmitted to the conductive pattern 11 through the silicon grease 7, the plate-like portion 2 b, and the leg portion 2 c, and through the conductive pattern 11. So that heat is dissipated to the outside. In addition, since the heat generating component 3 and the conductive pattern 11 are connected by the linear leg 2c having a short distance, the heat conduction to the conductive pattern 11 is also good.

It is principal part sectional drawing concerning the high frequency apparatus of this invention. It is a perspective view of the principal part which shows the state which concerns on the high frequency equipment of this invention, and removed the lower cover. It is principal part sectional drawing concerning the conventional high frequency apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Frame 1a Side wall 1b Opening part 1c Shield plate 2 Thermal conductor 2a Connection part 2b Plate-shaped part 2c Leg part 3 Heating component 4 1st circuit board 5 Electronic component 6 2nd circuit board 7 Silicon grease 8 Top cover 9 Lower cover 9a Hole 10 Mother board 11 Conductive pattern

Claims (4)

A box-shaped frame made of a metal plate and having an opening, a circuit board disposed in the frame and mounted with a heat generating component, and a cover attached to the frame so as to cover the opening The frame body is provided with a heat conductor integrally formed with the frame body. The heat conductor includes a connecting portion connected to the frame body, a plate-like portion that contacts the heat-generating component, and A leg portion bent from the plate-like portion so as to protrude out of the frame body through the cover, the leg portion being connectable to a conductive pattern provided on the mother board, and heat of the heat-generating component A high frequency device characterized in that heat can be dissipated from the conductive pattern through the plate-like portion and the leg portion. The high-frequency device according to claim 1, wherein the plate-like portion of the heat conductor is in contact with silicon grease interposed between the heat-generating components. The high-frequency device according to claim 1, wherein a plurality of the leg portions are formed at intervals. The frame has a side wall surrounding an outer peripheral part and a shield plate provided in the side wall, and the connecting part of the heat conductor is provided connected to the shield plate. The high frequency device according to any one of 1 to 3.

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