JPH0431741Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a high frequency connector for interconnecting strip conductors on first and second substrates constituting a strip line.

[Prior Art] First Conventional Example In FIG. 4, which is a cross-sectional view, and FIG. 5, which is a plan view, showing an example of a conventional high-frequency connector, 1
2 is a printed circuit board, and 2 is a hybrid IC board, which are made of boards capable of forming a microstrip line. On each board 1, 2, strip conductors 3, 4 are connected using printed wiring technology.
is provided, and a grounding plate 5 is arranged on the back surface of each substrate 1, 2, so that each substrate 1, 2, which is a dielectric material,
A microstrip line having a characteristic impedance Z ₀ is formed by the combination of the strip conductors 3 and 4 and the ground plate 5.

placed within the opening 6 of the printed circuit board 1
The IC board 2 has a circuit element portion 7 in addition to the strip conductor 4, and constitutes a hybrid IC 8.

A contact piece 9 is a metal piece that electrically connects the strip conductor 3 of the printed circuit board 1 and the strip conductor 4 of the IC board 2. This contact piece 9 is pressed by a pressing member 11 through an insulating elastic body 10 such as silicone rubber, thereby achieving electrical connection between the two strip conductors 3 and 4.

However, it is extremely difficult to arrange the minute contact piece 9 so that it coincides with the strip conductors 3, 4, and as shown in FIG. 5, it sometimes protrudes from the strip conductors 3, 4. When such a protruding portion occurs, the capacitance between the protruding portion and the ground increases, resulting in a decrease in impedance. Furthermore, the reliability of the connection is reduced due to the reduction in the contact area between the contact piece 9 and the strip conductors 3, 4. Furthermore, if there are other conductors nearby, there is a risk of short circuits.

Second Conventional Example Utility Model Application No. 1987-74155 was filed by the applicant of the present invention as a connector for solving the drawbacks of the connection using the contact piece 9 in the first conventional example. This is shown in FIG.

The connector shown in FIG. 6 comprises a connecting flexible printed circuit board 20, an insulating elastic body 21 made of silicone rubber, a pressing member 22, a screw 23, and a grounding plate 5. The connecting flexible printed circuit board 20 has a striped printed conductor 25 on its back surface extending perpendicularly to the edge of the rectangular opening 24. a first substrate;
That is, a printed circuit board 1 and a second board,
That is, each strip conductor 3, 4 of the hybrid IC board 2 is formed to have a width of 1.5 mm, while the printed conductor 25 of the flexible printed circuit board 20 is formed to have a width and an interval of 0.3 mm. The printed conductor 25 for connection is 1
A plurality of them are provided corresponding to each connection point.

When electrically connecting the strip conductors 3 and 4 of the two substrates 1 and 2, the grounding plate 5, the first and second substrates 1 and 2, the connecting flexible printed circuit board 20, the elastic body 21, and The pressing member 22 is inserted into the through hole 2 between the pressing member 22 and the first substrate 1.
6, 27 and into the screw hole 28 of the ground plate 5.
Screw in 3 and tighten to secure. Note that since the flexible printed circuit board 20 and the elastic body 21 are provided with openings 24 and 29, the circuit element portion 7 can be mounted thereon.

In this second conventional example, a plurality of strip-shaped printed conductors 25 are provided at one connection point, and the strip conductors 3 and 4 and the printed conductor 25 are arranged in a direction perpendicular to the boundary edge of the two substrates 1 and 2. Since the flexible printed circuit board 20 extends in both directions, it has the advantage that even if the flexible printed circuit board 20 is misaligned, there is no deterioration in high frequency characteristics or connection reliability, which eliminates the drawbacks of the first conventional example. It was hot. However, there were still unresolved issues.

[Problems to be solved by the invention] In the first conventional example and the second conventional example which is an improvement thereof, the printed circuit board 1 has variations in thickness, warpage, etc., and it is difficult to incorporate high-frequency circuits. Since there is also an error in the thickness of the hybrid IC board 2, as is clear from FIGS. 4 and 6, the printed circuit board 1 and the hybrid IC board 2 are placed on the same plane with the ground board 5 as a reference. If they were laminated, the strip conductors 3 and 4 would not be on the same plane, and a difference in level would easily occur. Because of this level difference, the pressing force applied to the printed circuit board 1 and the hybrid IC board 2 through the insulating elastic body 10 or 21 becomes uneven, and the pressure applied to the strip conductor 3 through the contact piece 9 or the printed conductor 25 becomes uneven. ,4
Because it is difficult to obtain good contact between the It was becoming a problem in terms of.

Furthermore, in order to obtain good contact, the elastic body 1
Since a large pressing force is applied through the pins 0 and 21, cracks may occur in the hybrid IC board 2. This problem is particularly likely to occur when quartz glass is used as the substrate material for ultra-high frequencies, and has become a major problem.

[Means for Solving the Problems] The present invention has been made to solve these problems, and the cause of the problems in the conventional example is that the bottom surfaces of the printed circuit board 1 and the hybrid IC board 2 This was an attempt to solve this problem since the ground plate 5 would have caused the two to be on the same plane.

Therefore, we placed a grounding spring plate with many divided frills around the bottom of the hybrid IC board so that the frills were in contact with the printed circuit board, and placed a heat sink at the bottom of the grounding spring plate. I tried to support it by leaning on it. In addition, flexible printed circuit boards for connection were stacked on the surfaces of both boards, and pressing force was applied via an elastic body.

[Function] With this configuration, the surfaces of the printed circuit board and the hybrid IC board are substantially aligned on the same plane, and a step is created on the bottom surfaces of both boards. This level difference acts to be absorbed by the many frilled portions on the periphery of the earth spring plate. This allows hybrid IC
This prevents the board from cracking, and the good contact between the strip conductors between both boards and the frilled ground spring plate on the bottom of both boards ensure good grounding.
Extremely stable high-frequency characteristics can be obtained, and heat can also be radiated to the heat sink via the earth spring plate.

[Embodiment] An embodiment of the present invention is shown and described in FIGS. 1 to 3. In FIGS. 1 to 3, parts corresponding to those in FIGS. 4 to 6 are given the same symbols.

In FIG. 1, there are four through holes in the printed circuit board 1, through which a support 34 with threads on the inner and outer surfaces is inserted, and a nut 37 is screwed to the screw on the outer surface, depending on the height of the support. The positioning in the thickness direction of each component that is laminated and assembled can be performed accurately.

Opening 6 of printed circuit board 1 which is the first board
The second board, hybrid IC board 2, is
A flexible printed circuit board 30 for connection, which has been fitted and whose four corners have been cut out to match the four pillars 34, is mounted. The back side of this flexible printed circuit board 30 is shown in the second enlarged detailed view.
A pair of strip conductors 3 and 4 as shown in the figure
The plurality of printed conductors 35 are lined up in a direction perpendicular to the outer edge with narrow line widths and intervals so as to be in contact with each other. Here, the corner portion 39 is provided so that its position is determined by the support column 34.

FIG. 3a shows the assembled state of the connector having the configuration shown in FIG.
A sectional view is shown in the right half of FIG. 3b, and the left half shows the pressing member 32 seen from the front left in FIG. 3a.
FIG. 3 is a front view including a partial cross-sectional view for showing the relationship between the elastic body 31 and the elastic body 31;

Here, there is a fitting part 36 around the upper part of the elastic body 31 made of elastomer, and the pressing member 32
As shown in Figure 3b, an elastic body 3 is placed around the lower part of the
There is a groove into which the fitting part 36 of the first part is press-fitted, and this allows the elastic body 31 to fit into the pressing member 32.
It is fitted and fixed.

The pressing member 32 to which the elastic body 31 is attached in this manner is screwed into the inner surface of the support column 34 by screws 33 through holes at its four corners. In this way, the connecting flexible printed circuit board 30 is pressed onto both boards 1 and 2 by the elastic body 31, and the strip conductors 3 and 4 of both boards 1 and 2 are connected.

On the other hand, there is a ground spring plate 40 on the bottom surface of the printed circuit board 1.
The lower surface is in contact with the heat sink 45, and the lower surface of the hybrid IC board 2 is supported by screwing the screws 38 through holes at the four corners of the heat sink 45 into the screws on the inner surface of the support 34.

Since the surface on which the elastic body 31 presses the connecting flexible printed circuit board 30 is a flat surface, the pressing force is applied so that the upper surfaces of both the substrates 1 and 2 are substantially in the same plane.

A number of divided frills 41 are provided around the ground spring plate 40, and the tips of the frills contact the back surface of the printed circuit board 1 with spring properties, as can be seen from FIG. 3b. are doing. Therefore, even if a level difference occurs on the back surfaces of both substrates 1 and 2, the many frills 41 ensure that both substrates 1 and 2 are connected to the ground.

[Effects of the invention] As is clear from the above explanation, according to the invention, the surfaces of both substrates with strip conductors to be connected can be made substantially on the same plane, and a step can be generated on the lower surface, thereby making it possible to To secure grounding and dissipate heat, a grounding spring plate with many frills around its periphery was pressed by a heat radiating stand, and many effects were obtained as shown below.

That is, since the strip conductors of both substrates can be connected substantially on the same plane, stable contact is ensured and good high frequency characteristics are obtained.

Since no excessive pressing force is applied to the hybrid IC board, there is no risk of cracking the board, and materials with good high frequency characteristics, which were difficult to use in the past, can be used as the board.
Additionally, it has become possible to use a thinner substrate than a printed circuit board.

As a result, the standards required for hybrid boards have been relaxed, making them easier to mass produce, easier to assemble, and more reliable.

The many frills provided around the ground spring plate ensure that the surrounding area is grounded, resulting in good high frequency characteristics, making the ground spring plate well suited for hybrid ICs. Since heat is well dissipated to the heat sink through the heat sink, it has become possible to apply it to high-frequency hybrid ICs that generate a large amount of heat.

Furthermore, due to the effects of both the frilled earth spring plate and the elastic body 31, it has excellent impact resistance and vibration resistance.

As described above, the effects of the present invention are extremely large.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view showing an embodiment of the present invention, FIG. 2 is a partially enlarged view of a flexible printed circuit board for connection used in FIG. 1, and FIG.
FIG. 1 is a perspective view and a cross-sectional view of the high-frequency connector after assembly, FIGS. 4 and 5 are a cross-sectional view and a plan view of the first conventional example, and FIG. 6 is a
FIG. 3 is an exploded perspective view of a second conventional example. 1...Printed circuit board, 2...Hybrid
IC, 3, 4... Strip conductor, 5... Ground plate,
6... Opening, 7... Circuit element, 8... Hybrid IC, 9... Contact piece, 10... Insulating elastic body, 1
1...Press member, 20...Flexible connector for connection
Printed circuit board, 21... Elasticity, 22... Pressing member, 23... Screw, 24... Opening, 25... Printed conductor, 26, 27... Through hole, 28... Screw hole, 29... Opening Part, 30... Flexible printed circuit board for connection, 31... Elastic body, 32...
Pressing member, 33...screw, 34...post, 35...
...Printed conductor, 36...Inset part, 37...
...Nut, 38...Screw, 39...Corner, 40...
...Earth spring plate, 41...Frill, 45...Heat radiation stand.

Claims (1)

[Claims for Utility Model Registration] (1) A strip conductor disposed on the first and second substrates for connecting strip conductors on the first and second substrates disposed on substantially the same plane. a flexible printed circuit board for connection, in which a plurality of printed conductors for connection are provided with a width narrower than the width of the strip conductors on the first and second substrates, and a plurality of connection printed conductors are provided with mutual spacing; The connecting printed conductor of the flexible printed circuit board for
a connecting means for pressing and connecting the surfaces of the strip conductors on substantially the same plane; and a connecting means located so as to be in contact with the back surface of the second substrate, and having many spring-like frills around the periphery. ,
The tip of the frill is brought into contact with the back surface of the first substrate, absorbing a step difference on the back surface between the first and second substrates, and ensuring grounding between the first and second substrate plates. a ground spring plate means for grounding; and a pressing force is applied from the back side of the ground spring plate means to ground the ground. 1. A high-frequency connector comprising: a heat dissipation means for dissipating heat conducted through the spring plate means. (2) A utility model registration in which a plurality of supports are fixed to the first board, and the distance between the connection means, the heat dissipation means, and the first board is set by the posts. A high frequency connector according to claim 1. (3) The high-frequency connector according to claim 2, wherein the position of the flexible printed circuit board in a planar direction is determined by the pillar.