JPH054311Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a shield structure for electronic equipment.

[Technical background of the invention and its problems]

Usually, in electronic devices equipped with a high frequency circuit, such as radio equipment, the high frequency circuit is covered with a metal shielding case to prevent electromagnetic waves leaking from the high frequency circuit from having a negative effect on other electronic components. It's on. The third example shows an example of this.
It is a diagram.

A high frequency circuit section C is constituted by a large number of discrete components B arranged on the left side of the front surface of the board A, and wiring patterns (not shown) formed on the front and back left sides of the board A. , the discrete component B is covered by an upper shield case D attached to the board.

On the other hand, on the back side of the board A, a lower shield case E is attached to cover the wiring pattern and the like in order to prevent electromagnetic waves from leaking from the wiring pattern and the portion where the discrete components are soldered.

Further, a ground pattern (not shown) is formed on the board A, and by attaching the board A to the die-cast chassis F, the high frequency circuit section C and other circuits are grounded via the ground pattern. .

By the way, when housing the board A in the die-cast chassis F, since the shield cases D and E are attached to the front and back sides of the board A, respectively, as described above, a deep storage space is required in the die-cast chassis F. This resulted in the inconvenience of increasing the external size of the electronic device. Further, since each of the shield cases D and E is constructed from a separate body, the number of parts increases, resulting in an increase in cost and a complicated assembly process.

[Purpose of invention]

In view of the above-mentioned circumstances, the present invention provides a shielding structure for electronic devices that enables shielding of electronic components through simple assembly work and also achieves miniaturization of electronic devices and reduction in the number of components. The purpose is to

[Summary of the idea]

Therefore, in the present invention, an electronic component is mounted in a predetermined area on one side, and a sheet-like ground pattern is formed at least at a location corresponding to the predetermined area on the other side, and further, the electronic component is mounted in a predetermined area on one side, and A substrate comprising a plurality of through holes connected to the ground pattern and reaching the one surface at a boundary with an area other than the area, forming an electronic device casing, having conductivity, and having a bottom plate. and a protrusion for defining a recess on the bottom plate, and the board is housed and installed in a state in which the electronic component is accommodated in the recess and the through hole is in contact with an end face of the protrusion. The above objective is achieved by providing a casing that is

[Example of idea]

Hereinafter, the achievements of the present invention will be explained in detail based on the drawings showing one embodiment.

FIG. 1 shows an example in which the shield structure according to the present invention is applied to a structure for shielding a high frequency circuit section of a radio device.

A wiring pattern (not shown) is formed in a predetermined area set on the left side of one side (back side) 1a of the substrate 1, and this wiring pattern includes:
Some electronic components are mounted as microstriplines.

Furthermore, chipped electronic components (chip components) 2 are placed at predetermined positions on the wiring pattern.
a, 2b, 2c are mounted by soldering,
This constitutes the high frequency circuit section 3.

On the other hand, the other surface (surface) 1b of the substrate 1, that is, the left side of the surface other than the one surface, in other words, the sheet A ground pattern 4 having the shape of a shape is formed, and the ground pattern 4 is formed over the entire left half of the substrate surface as shown in the figure.

Further, at the right edge of the ground pattern 4, in other words, at the boundary between the predetermined area on the substrate 1 and an area other than the predetermined area (area where the earth pattern 4 is not formed on the substrate 1), the above-mentioned A plurality of through holes 5, 5, . . . connected to the ground pattern 4 and reaching one side of the substrate 1 are formed along the boundary (right edge of the ground pattern 4). Note that the reference numeral 6 in FIG. 1 is an electronic component constituting a circuit other than the high frequency circuit 3.

On the other hand, a die-cast chassis 10 serving as a casing that accommodates the substrate 1, in other words, a casing constituting an electronic device housing, has a bottom plate 11, left and right side plates 12, 13, and an end plate 14. In this example, the die-cast chassis 10 is integrally formed of a conductive aluminum material.

Further, pedestals 15 for fixing the substrate 1 are protruded from the four corners of the bottom plate 11, and a protrusion 16 is formed approximately at the center of the bottom plate 11.

As shown in the figure, this protrusion 16 extends along the width direction of the bottom plate 11 at the right edge of the above-mentioned ground pattern 4, in other words, the plurality of through holes 5, 5...
, and both ends thereof are fused with the side plates 12 and 13.

A substrate 1 is attached to the die-cast chassis 10 having the above configuration.
As shown in FIG.
a, 13a, the surface 14a of the end plate, and the protrusion 16
It is accommodated in a recess 17 defined by a side surface 16a of.

Moreover, at this time, one surface 1a of the substrate 1 is
6, the ground pattern 4 and the die-cast chassis 10 are electrically connected to each other via the plurality of through holes 5, 5, . . . .

Therefore, by attaching the substrate 1 to the die-cast chassis 10, the electronic components mounted on the substrate 1 are surrounded by the recess 17 of the die-cast chassis 10 and the ground pattern 4, which are electrically connected to each other. It will be shielded.

Note that by connecting the die-cast chassis 10 and the ground pattern 4 through the through hole 5, it is possible to effectively ground the die-cast chassis 10 and the ground pattern 4.

Also, the plurality of through holes 5, 5, . This means that the area is electrically disconnected from the area.

As a result, the electronic components constituting the high frequency circuit section 3 mounted in a predetermined area on the substrate 1,
Intrusion and leakage of electromagnetic waves from electronic components mounted in areas other than the predetermined area are prevented, and the electronic components constituting the high frequency circuit section 3 are reliably shielded.

In this example, the electronic components were arranged on one side of the board, but parts that can be operated from the outside, such as a volume, or electronic parts that cannot be made into a chip, such as a filter, are placed on one side of the board. It may also be placed on the other side of the.

[Effect of idea]

As detailed above, according to the shielding structure for electronic equipment according to the present invention, the electronic component is surrounded by the recess formed in the casing and the ground pattern formed in the board, and the electronic component is shielded. Since the casing is used as a member, shielding can be achieved without using a separate shield case, and the number of parts can be reduced.

In addition, multiple through holes formed on the board,
The structure is such that the ground pattern and the casing are electrically connected to each other by abutting against the protrusions formed on the casing, so simply attaching the board to the casing allows the ground pattern and the casing to become electrically conductive, making for easy assembly. The work made it possible to shield electronic components.

Furthermore, a plurality of through holes formed in the board are configured to electrically isolate a predetermined area from other areas on the board, allowing electronic components that are sensitive to electromagnetic waves to be separated from other electronic components. 1
Since the electronic device can be mounted on a single board, it is possible to downsize the electronic device.

[Brief explanation of drawings]

Fig. 1 is an exploded perspective view showing an example in which the shield structure for electronic equipment related to the present invention is applied to the shield structure for radio equipment, Fig. 2 is an enlarged sectional view of the main part of the above shield structure, and Fig. 3 is a conventional shield. FIG. 2 is an exploded perspective view of an electronic device employing the structure. 1... Board, 1a... One side, 1b... Other side (other side), 2a, 2b, 2c... Chip parts (electronic parts), 3... High frequency circuit section, 4...
Earth pattern, 5... Through hole, 10...
Die-cast chassis (casing), 11...bottom plate, 16...projection, 16b...end surface, 17...recess.

Claims (1)

[Claims for Utility Model Registration] An electronic component mounted on a predetermined area on one side of a board, and a sheet-like ground pattern formed on a surface other than the one side of the board at least at a location corresponding to the predetermined area. a plurality of through holes formed along the boundary between the predetermined region and a region other than the predetermined region on the substrate, connected to the ground pattern and reaching one side of the substrate; and an electronic device casing. The electronic component is accommodated in the recess, and the through hole is applied to the end face of the protrusion while the electronic component is accommodated in the recess. A shield structure for an electronic device, comprising: a casing in which the board is housed and placed in contact with the board;