JPS5840611Y2 - heat sink - Google Patents
heat sinkInfo
- Publication number
- JPS5840611Y2 JPS5840611Y2 JP1978097725U JP9772578U JPS5840611Y2 JP S5840611 Y2 JPS5840611 Y2 JP S5840611Y2 JP 1978097725 U JP1978097725 U JP 1978097725U JP 9772578 U JP9772578 U JP 9772578U JP S5840611 Y2 JPS5840611 Y2 JP S5840611Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- printed circuit
- circuit board
- attached
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
【考案の詳細な説明】
この考案は、パワートランジスタ等の素子に取付けられ
る放熱板に関する。[Detailed Description of the Invention] This invention relates to a heat sink attached to elements such as power transistors.
従来、パワートランジスタ等の素子に取付けられる放熱
板は、第１図に示すように、プリント基板１上にリード
端子２を垂直状態に固定した素子３に、取付ネジ４等に
よって放熱板５を固定したり、第２図に示すように放熱
板５をプリント基板１に平行に配置し、この放熱板５を
素子２の取付ネジ４により、絶縁用ブツシュ６を介して
プリント基板１に取付けて、一体化された素子２と放熱
板とを、リード端子２およびネジとで支持するようにし
ている。Conventionally, as shown in FIG. 1, a heat sink attached to an element such as a power transistor has a heat sink 5 fixed to an element 3 with lead terminals 2 vertically fixed on a printed circuit board 1 using mounting screws 4 or the like. Alternatively, as shown in FIG. 2, a heat sink 5 is placed parallel to the printed circuit board 1, and this heat sink 5 is attached to the printed circuit board 1 using the mounting screws 4 of the element 2 via the insulating bushings 6. The integrated element 2 and heat sink are supported by lead terminals 2 and screws.
上述した第１図の従来のものでは、通電部がリード端子
２のみによって行なわれるためパワーが取れないという
欠点がある。The conventional device shown in FIG. 1 described above has the disadvantage that power cannot be obtained because the current-carrying portion is carried out only by the lead terminal 2.
第２図に示す従来のものでは、基板上のスペースを巾広
く取る取付は方法のために基板のスペース利用効率が悪
いという欠点がある。The conventional device shown in FIG. 2 has the disadvantage that the mounting method requires a wide space on the board, and therefore the space on the board is inefficiently utilized.
そこで、この考案は、上述した従来例の欠点をなくシ、
パワートランジスタ等の素子のパワーを充分に活用する
ことができて、かつ基板のスペース利用効率をも向上さ
せることができる放熱板を提供することを目的とする。Therefore, this invention eliminates the drawbacks of the conventional example mentioned above.
It is an object of the present invention to provide a heat sink that can fully utilize the power of elements such as power transistors and improve the space utilization efficiency of a substrate.
そして、この考案によれば、放熱板に脚部を設け、この
脚部を基板の導電部に接続されるように配線するので、
パワー素子のパワーを充分に取り出すことができるとと
もに、基板のスペースを有効に活用することができる。According to this invention, the heat sink is provided with legs, and the legs are wired to be connected to the conductive part of the board.
The power of the power element can be sufficiently extracted, and the space on the substrate can be used effectively.
以下、この考案の一実施例を図面に基づいて説明する。An embodiment of this invention will be described below based on the drawings.
第３図はこの考案の一実施例を示す図で、第３図におい
て、１５は放熱部１５ ａを備えたパワートランジスタ
等の素子で、そのリード端子１６はプリント基板１７に
設けた穴１７ Ｈに挿入されるようになっている。FIG. 3 is a diagram showing an embodiment of this invention. In FIG. 3, reference numeral 15 denotes an element such as a power transistor equipped with a heat radiation part 15a, and its lead terminal 16 is connected to a hole 17H provided in a printed circuit board 17. It is designed to be inserted into.
１８は上記素子１５の形状に対応した、たとえば、銅等
の導電部材で構成した短形状の放熱板で、放熱部１５
ａに挿入した取付ネジ１９により素子１５と一体的に取
り付けられている。Reference numeral 18 denotes a short-shaped heat sink made of a conductive material such as copper, corresponding to the shape of the element 15, and the heat sink 18
It is integrally attached to the element 15 by a mounting screw 19 inserted in a.
この放熱板１８の下部１８ ａには二叉状に形成した脚
部２０が形成されており、上記プリント基板１７の穴１
７ ａ近傍、すなわち、素子１５と放熱板１８の取り付
は間隔に対応した間隔の位置で、かつ、放熱板１８の各
脚部２０と対応する、たとえば、短形状の穴１７ ｂに
挿入し、放熱板１８の上部を図示しない適宜支持装置で
支持するとともに、放熱板１８の脚部２０をプリント基
板１７の下側から押打して、脚部２０を内方あるいは外
方に折曲げ、プリント基板１７の穴１７ ｂに圧着させ
る。A fork-shaped leg portion 20 is formed in the lower part 18 a of the heat sink 18 , and the leg portion 20 is formed in a forked shape, and the hole 1 of the printed circuit board 17 is connected to the leg portion 20 .
7a, that is, the element 15 and the heat sink 18 are attached at a position corresponding to the spacing, and are inserted into, for example, a rectangular hole 17b corresponding to each leg 20 of the heat sink 18. , the upper part of the heat sink 18 is supported by an appropriate support device (not shown), and the legs 20 of the heat sink 18 are pressed from below the printed circuit board 17 to bend the legs 20 inward or outward; Press it into the hole 17b of the printed circuit board 17.
つぎに、上記素子１５のリード端子１６をプリント基板
１７に設けた穴１７ ａに挿入した後、図示しないハン
ダ等によって固定するとともにパターン３０と接続する
。Next, the lead terminals 16 of the element 15 are inserted into the holes 17a provided in the printed circuit board 17, and then fixed with solder or the like (not shown) and connected to the pattern 30.
したがって、取付ネジ１９によって一体化された素子１
５と放熱板１８とは、リード端子１６と放熱板１８の下
部１８ ａとの２点でプリント基板１７にほぼ垂直に確
実に固定することができ、耐振動性および耐衝撃性を向
上できる。Therefore, the element 1 integrated by the mounting screw 19
5 and the heat sink 18 can be reliably fixed almost perpendicularly to the printed circuit board 17 at two points: the lead terminal 16 and the lower part 18a of the heat sink 18, thereby improving vibration resistance and impact resistance.
なお、放熱板１８のプリント基板１７への取付方法は上
記のものに限らずカシメ方法であってもよい。Note that the method of attaching the heat sink 18 to the printed circuit board 17 is not limited to the above method, and a caulking method may also be used.
また、上記プリント基板１７の穴１７ｂの周囲には導電
部３１が形威しである。Further, a conductive portion 31 is formed around the hole 17b of the printed circuit board 17.
したがって、放熱板１８がプリント基板１７への取り付
は時に導電部３１と接続し、あるいは、取り付は後に放
熱板１８と導電部３１とをハンダ等によって接続する。Therefore, the heat sink 18 is sometimes attached to the printed circuit board 17 by connecting it to the conductive part 31, or the heat sink 18 and the conductive part 31 are connected later by soldering or the like.
これにより、放熱板１８を取り付けた素子１５がトラン
ジスタである場合は、上記導電部３１がコレクタ端子と
同電位となり、また、素子１５がＳＣＲの場合は、アノ
ードと同電位となる。As a result, if the element 15 to which the heat sink 18 is attached is a transistor, the conductive portion 31 has the same potential as the collector terminal, and if the element 15 is an SCR, it has the same potential as the anode.
したがって、導電部３１に適宜な導電パターン３２を一
体に形成しておけば、導電パターン３２とコレクタ端子
あるいはアノード端子とを接続でき、不要な配線を施さ
ずに所定の配線を合理的に行なうことができる。Therefore, if a suitable conductive pattern 32 is integrally formed on the conductive part 31, the conductive pattern 32 can be connected to the collector terminal or the anode terminal, and predetermined wiring can be performed rationally without unnecessary wiring. Can be done.
第１図、第２図は従来例を示す図、第３ａ図、第３ｂ図
はこの考案の一実施例の正面図、および側面図、第３ｃ
図は底面図である。
１５・・・・・・素子、１６・・・・・・リード端子、
１７・曲・プリント基板、１７ａ、１７ｂ・・凹穴、１
８・・開放熱板、２ｏ・・曲脚部、３１・・・・・・導
電部、３２・・曲導電パターン。Figures 1 and 2 show a conventional example, Figures 3a and 3b are front and side views of an embodiment of this invention, and Figure 3c
The figure is a bottom view. 15...Element, 16...Lead terminal,
17・Track・Printed circuit board, 17a, 17b...concave hole, 1
8... Open hot plate, 2o... Bent leg portion, 31... Conductive portion, 32... Curved conductive pattern.
Claims (1)
って、前記パワートランジスタ等の素子が取付けられる
基板に設けた穴を介して基板に設けた導電部に脚部が接
続されることにより配線の一部とされていることを特徴
とする放熱板。A heat sink to which an element such as a power transistor is attached, and whose legs are connected to a conductive part provided on the substrate through a hole provided in the substrate to which the element such as the power transistor is attached, thereby forming part of the wiring. A heat sink characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978097725U JPS5840611Y2 (en) | 1978-07-14 | 1978-07-14 | heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978097725U JPS5840611Y2 (en) | 1978-07-14 | 1978-07-14 | heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5527903U JPS5527903U (en) | 1980-02-22 |
| JPS5840611Y2 true JPS5840611Y2 (en) | 1983-09-13 |
Family
ID=29032831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978097725U Expired JPS5840611Y2 (en) | 1978-07-14 | 1978-07-14 | heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5840611Y2 (en) |
-
1978
- 1978-07-14 JP JP1978097725U patent/JPS5840611Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5527903U (en) | 1980-02-22 |
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