JPS6377353U - - Google Patents

Info

Publication number
JPS6377353U
JPS6377353U JP17016086U JP17016086U JPS6377353U JP S6377353 U JPS6377353 U JP S6377353U JP 17016086 U JP17016086 U JP 17016086U JP 17016086 U JP17016086 U JP 17016086U JP S6377353 U JPS6377353 U JP S6377353U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
attached
semiconductor
power semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17016086U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17016086U priority Critical patent/JPS6377353U/ja
Publication of JPS6377353U publication Critical patent/JPS6377353U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図は本考案に係わる電力用半導
体の取付構造の一実施例を示す正面図及び一部拡
大図である。 1……印刷配線板、2……電力用半導体、3…
…端子、3a……折り曲げ部、4……放熱板、4
a……傾斜部、6……半田付け部。
1 and 2 are a front view and a partially enlarged view showing an embodiment of a power semiconductor mounting structure according to the present invention. 1... Printed wiring board, 2... Power semiconductor, 3...
...terminal, 3a...bending part, 4...heat sink, 4
a... Inclined part, 6... Soldering part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 印刷配線板に取付けた放熱板に電力用半導体を
取付け、該半導体の端子を前記印刷配線板に半田
付けしてなる電子装置において、前記放熱板に傾
斜部を設け、該傾斜部に電力用半導体を取付け、
該半導体の端子の先端を前記印刷配線板に鉛直に
埋め込んで半田付けすると共に、該端子の中間部
に折り曲げ部を設けたことを特徴とする電力用半
導体の取付け構造。
In an electronic device in which a power semiconductor is attached to a heat sink attached to a printed wiring board, and terminals of the semiconductor are soldered to the printed wiring board, the heat sink is provided with an inclined portion, and the power semiconductor is attached to the inclined portion. Install the
A structure for mounting a power semiconductor, characterized in that a tip of a terminal of the semiconductor is vertically embedded in the printed wiring board and soldered thereto, and a bent part is provided in the middle of the terminal.
JP17016086U 1986-11-07 1986-11-07 Pending JPS6377353U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17016086U JPS6377353U (en) 1986-11-07 1986-11-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17016086U JPS6377353U (en) 1986-11-07 1986-11-07

Publications (1)

Publication Number Publication Date
JPS6377353U true JPS6377353U (en) 1988-05-23

Family

ID=31104638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17016086U Pending JPS6377353U (en) 1986-11-07 1986-11-07

Country Status (1)

Country Link
JP (1) JPS6377353U (en)

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