JPH0720940Y2 - Power type electronic circuit device - Google Patents
Power type electronic circuit deviceInfo
- Publication number
- JPH0720940Y2 JPH0720940Y2 JP11066290U JP11066290U JPH0720940Y2 JP H0720940 Y2 JPH0720940 Y2 JP H0720940Y2 JP 11066290 U JP11066290 U JP 11066290U JP 11066290 U JP11066290 U JP 11066290U JP H0720940 Y2 JPH0720940 Y2 JP H0720940Y2
- Authority
- JP
- Japan
- Prior art keywords
- power type
- electronic circuit
- circuit device
- type electronic
- type semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【考案の詳細な説明】 本考案は電子回路装置、特に大電力を必要とする複数半
導体素子の接続構造に関するものである。一般的に電子
部品の実装及接続方法はプリント基板にて実装、はんだ
付けする接続方法が多く用いられている。しかし、この
方法には回路電力に限界が有り大電力半導体素子は殆ど
プリント基板上では回路接続はされず別な方法例えばメ
インラインは太い電線等を用いて電極部を１つ１つ接続
処理している。そのため処理時間が長くなるうえ構造的
に小型化を図り難く、接続の信頼性も低下する欠点があ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic circuit device, and more particularly, to a connection structure for a plurality of semiconductor devices which requires a large amount of power. Generally, as a mounting and connecting method of electronic components, a connecting method of mounting and soldering on a printed circuit board is often used. However, this method has a limit in circuit power, and most high-power semiconductor devices are not connected on the printed circuit board by another method. For example, the main line uses thick wires to connect the electrode parts one by one. ing. Therefore, there are drawbacks that the processing time becomes long, it is difficult to structurally reduce the size, and the connection reliability is reduced.
本考案は係る欠点を解消し電力型電子回路装置の集約
化、高密度化、小型化及低コスト化等を目的とする。以
下本考案を図面を用いて詳述する。SUMMARY OF THE INVENTION The present invention is directed to solving the drawbacks described above and consolidating power type electronic circuit devices, increasing the density, reducing the size, and reducing the cost. The present invention will be described in detail below with reference to the drawings.
第１図、第２図は本考案の実施例をしめす構造図であ
る。1 and 2 are structural views showing an embodiment of the present invention.
図において１は放熱器であり取付けられる素子に応じ、
取付穴８を設けてある。２は電力型半導体素子で、脚部
２−１、２−２、２−３は図の如く直角方法にフォーミ
ングされている。３は電力型半導体素子間を電気的接続
するための接続金属板（センターブスバー）である。セ
ンターブスバーは６ケの電力型半導体素子の脚部がはん
だ接続できるように穴が設けられている。４は電力型半
導体素子の陽極ラインを電気的接続するための陽極用ブ
スバーで、５は陰極用のブスバーである。両ブスバーの
端部には外部と接続可能なクランプ９と、電力型半導体
素子の脚部が挿入接続できるようにラグ状の端子部５−
１が設けてある。In the figure, 1 is a radiator, which corresponds to the attached element
A mounting hole 8 is provided. Reference numeral 2 is a power type semiconductor element, and legs 2-1, 2-2 and 2-3 are formed in a right angle method as shown in the figure. Reference numeral 3 is a connecting metal plate (center bus bar) for electrically connecting the power type semiconductor elements. The center bus bar is provided with holes so that the legs of the six power type semiconductor elements can be connected by soldering. Reference numeral 4 is an anode bus bar for electrically connecting the anode line of the power type semiconductor element, and 5 is a cathode bus bar. A clamp 9 that can be connected to the outside and a lug-shaped terminal portion 5-so that the legs of the power semiconductor device can be inserted and connected to the ends of both bus bars.
1 is provided.
８はプリント基板であり基板上には機能に必要な小型電
子部品（例:R）が搭載されている。又前述各ブスバー等
の端子部が基板上に位置するように開口部が設けてあ
る。更にアツセンブリした際、各部品が移動しないよう
に基板上にも取付穴８があり、ビス７にて固定できるよ
うになっている。この状態で自動はんだ付装置に搬送す
れば全個所が一度にはんだ接続されるため製造が容易と
なる。第２図は完成された電力型回路装置の略図であ
る。Reference numeral 8 is a printed circuit board on which small electronic components (for example, R) necessary for its function are mounted. In addition, openings are provided so that the terminal portions such as the bus bars described above are located on the substrate. Further, there is a mounting hole 8 on the board so that each part does not move when assembled, and can be fixed with a screw 7. If it is transferred to the automatic soldering device in this state, all the parts are connected by soldering at once, which facilitates manufacturing. FIG. 2 is a schematic diagram of the completed power type circuit device.
以上の説明から明らかなように本考案の電力型電子回路
装置は集約化、小型化、低価格などを簡単な構造により
なし得るものであり、電装用をはじめ各種用途に利用し
て効果が著しく実用上極めて有効である。As is clear from the above description, the power-type electronic circuit device of the present invention can be integrated, downsized, and low-priced with a simple structure, and is remarkably effective when used in various applications including electrical equipment. It is extremely effective in practice.
第１図、第２図は本考案の実施例を示す構造図である。
１は放熱器、２は電力型半導体素子、３はセンターブス
バー、４は陽極ラインを接続する陽極用ブスバー、５は
陰極ラインは接続する陰極用ブスバー、６はプリント基
板、７は全体を固定させるためのビス、８は取付穴、９
は外部接続用端子、10はパターン、11はブスバー用穴、
12は外部接続用ランドである。1 and 2 are structural views showing an embodiment of the present invention.
1 is a radiator, 2 is a power type semiconductor element, 3 is a center bus bar, 4 is an anode bus bar for connecting an anode line, 5 is a cathode bus bar for connecting a cathode line, 6 is a printed circuit board, and 7 is a fixed part Screw, 8 is mounting hole, 9
Is an external connection terminal, 10 is a pattern, 11 is a bus bar hole,
12 is a land for external connection.
Claims (1)
電力型半導体素子を接続するに当り、プリント基板、電
力型半導体素子との間にはんだ接続用の金属製接続板を
前記半導体素子の脚部を通してはさみ込み、プリント基
板に設けられた開口部より前記接続板のラグ端子部をく
ぐり出させプリント基板のはんだ付けと同時に電力型半
導体素子の脚部も含め一度にはんだ接続可能な構造とし
たことを特徴とする電力型電子回路装置。1. When connecting two or more power type semiconductor elements in a power type electronic circuit device, a metal connecting plate for solder connection is provided between the printed circuit board and the power type semiconductor elements. It can be sandwiched through the leg of the element, and the lug terminal part of the connection plate can be pushed out from the opening provided in the printed circuit board so that the soldering of the printed circuit board and the leg part of the power type semiconductor element can be performed at the same time by soldering. A power type electronic circuit device having a structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11066290U JPH0720940Y2 (en) | 1990-10-23 | 1990-10-23 | Power type electronic circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11066290U JPH0720940Y2 (en) | 1990-10-23 | 1990-10-23 | Power type electronic circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0467377U JPH0467377U (en) | 1992-06-15 |
| JPH0720940Y2 true JPH0720940Y2 (en) | 1995-05-15 |
Family
ID=31858032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11066290U Expired - Lifetime JPH0720940Y2 (en) | 1990-10-23 | 1990-10-23 | Power type electronic circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0720940Y2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004253759A (en) * | 2002-12-24 | 2004-09-09 | Auto Network Gijutsu Kenkyusho:Kk | Control circuit board and circuit construct |
| JP3969403B2 (en) * | 2004-06-08 | 2007-09-05 | 株式会社デンソー | Electronic component mounting structure |
| JP2006004852A (en) * | 2004-06-21 | 2006-01-05 | Furukawa Electric Co Ltd:The | Connector with built-in electronic part |
-
1990
- 1990-10-23 JP JP11066290U patent/JPH0720940Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0467377U (en) | 1992-06-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |