JPH0314051Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to an electronic component mounting structure in which heat-generating electronic components such as transistors are placed against a heat sink and fixed to a board by soldering.

Conventional Technology Conventionally, when attaching a heat-generating electronic component 1 such as a transistor to a board (see Fig. 4), screws, etc. are attached to a heat dissipation plate 2 made of copper, brass, etc., which has good thermal conductivity and good heat dissipation efficiency. Generally, the heat dissipation plate 2 is fixed on the board surface by screws, soldering, etc., similar to the electronic component 1.

Problems that the invention aims to solve: However, in this mounting structure for electronic components, the heat sink occupies a relatively large area on the board, so it becomes an obstacle when forming a conductive pattern, etc. Sometimes it is necessary to take a detour. Furthermore, when placing electronic components on the heat sink, extremely labor-intensive work such as fixing them with screws is required, and moreover, when the heat sink 2 is made of a metal plate that cannot be soldered, such as an aluminum plate, It is also necessary to take the trouble of forming the legs 4, 4 from solderable dissimilar metals and fixing them to the board by soldering or fixing them with screws inserted from the back side of the board.

Means for solving the problems In the mounting structure for electronic components according to the present invention,
Electronic components and a heat sink are attached to the board via a pedestal made of electrically insulating resin with good heat deformation resistance, and the heat sink is planted and fixed on the pedestal.
Electronic components that heat up, such as transistors, are sandwiched between this heat sink and the rising part of the pedestal, and the electronic components are placed on the heat sink, and then the pedestal is placed on the surface of the board and placed below the pedestal. The lead wire of the electronic component protruding from the board is inserted into the board and fixed by soldering.

Function In this mounting structure for electronic components, the heat sink is mounted on a pedestal that occupies a small area, floating above the surface of the board, and the heat sink is supported by the pedestal so that it can be attached to the board via the pedestal, so the heat sink is made of aluminum. It can be easily attached even if a non-solderable item such as a plate is used, and since the electronic components are simply held between the heat sink and the rising part of the pedestal, it is possible to easily and securely attach and arrange the electronic components. .

Embodiments The following description will be made with reference to FIGS. 1 to 3.

In this embodiment, an electronic component 10 such as a transistor that heats up is placed on a heat dissipation plate 11 such as an aluminum plate and attached to a substrate 12 . In mounting, the electronic component 10 and the heat sink 11 are mounted on the board 12 via the pedestal 13.

The pedestal 13 is made of an insulating resin that is resistant to thermal deformation, such as polyacetal resin or polyamide resin, and has a notch 13a formed on its back side into which the lower end of the heat sink 11 is inserted. By inserting a tongue-like leg portion 11a integrally formed with the heat sink 11 into this notch 13a, the heat sink 11 can be planted and fixed on the pedestal 13, and the heat sink 11 can be fixed. To prevent this, a protrusion 13d provided on the pedestal 13 and a hole 11b provided in the leg portion 11a of the heat sink 11 can be fitted into each other. Alternatively, the heat dissipation plate 11 may be provided with a cut-and-raised portion, and the pedestal may be provided with a hole so that they fit therein. A slit 13b into which the lead wire 10a of the electronic component 10 can be inserted is provided on the middle side of the pedestal 13, and the electronic component
A rising portion 13c that inserts and supports 0 is formed integrally with the main body of the base 13. With respect to this pedestal 13, the electronic component 10 connects the lead wire 10a to the slit 1.
3b and protrudes downward, and can be assembled by inserting and supporting the heat sink 11 between the notch 13a and the rising portion 13c.

The electronic component 10 and heat sink 11 assembled in this way are assembled by inserting the lead wire 10a of the electronic component 10 with the pedestal 13 placed on the surface of the board 12 into the board 12, and soldering it to the tip of the shaft of the lead wire 10a. Then, it can be attached to the board 12.

Note that not only one electronic component 10 is placed on one heat sink 11, but also a plurality of electronic components 10, 10, etc. are placed side by side when using a relatively horizontal heat sink 11. You can also. Even in this case, the pedestals 13, 13...
In order to attach the heat sink 11 via...
An extremely small area corresponding to the lower end surface range of the pedestals 13, 13, . . . is sufficient. Further, the pedestal 13 can be changed into various forms depending on the shape of the electronic component 10, and moreover, the pedestal 13 can be changed into various forms depending on the shape of the electronic component 10 and
It may be molded integrally with 1.

Effects of the invention As described above, according to the electronic component mounting structure of the present invention, the heat sink is mounted on the board surface via the pedestal, so the area occupied by the board can be reduced, and the heat sink can be attached to the board. The mounting work is made extremely simple since there is no need to directly attach the electronic component, and furthermore, the electronic component can be tightly applied and fixed to the heat sink by simply holding it between the rising part of the pedestal and the heat sink.

[Brief explanation of drawings]

Figure 1 is a side view showing a mounting structure for electronic components according to the present invention, Figure 2a is a perspective view of a pedestal used in the mounting structure, and Figure 2b is an example of a heat sink used in the mounting structure. FIG. 3 is a perspective view showing an electronic component mounting structure according to another embodiment, and FIG. 4 is an explanatory diagram showing an electronic component mounting structure according to an example of a conventional example. 10: electronic component, 10a: lead wire, 11: heat sink, 12: board, 13: pedestal, 13c: rising portion.

Claims (1)

[Scope of utility model registration request] A heat dissipation plate is planted and fixed on a pedestal made of electrically insulating resin with good heat deformation resistance, and electronic components that heat up, such as transistors, are inserted and supported between the heat dissipation plate and the rising part of the pedestal. A structure for mounting an electronic component to a board, characterized in that a pedestal is placed on the board surface of the board, and lead wires of the electronic component protruding downward from the pedestal are inserted into the board and fixed by soldering.