JP4625774B2 - Electronic component short-circuit prevention spacer - Google Patents

Description

  The present invention relates to an electronic component short-circuit prevention spacer that is mounted on an electronic component to prevent a short circuit between terminals.

  2. Description of the Related Art Conventionally, some electronic components mounted on a circuit board of an electronic device are soldered by inserting a lead into a mounting hole of the circuit board, such as a power transistor. Furthermore, in order to absorb heat generated by electronic components and stabilize the operation, there are electronic devices that are forced to cool by blowing outside air with a fan. In these cases, dust contained in the air introduced from the outside In other words, it adheres to the electronic components attached to the surface of the substrate and the soldering surface of the substrate, and may be deposited between the leads. When the dust or the like gets wet, there is a risk of causing a short circuit between the leads which are the conductive parts and causing a failure. In addition, conductive dust such as metal scrap may fly and cause a short circuit. Therefore, various methods are known as measures for preventing the adhesion of dust between the leads.

  For example, an insulating tube was inserted into the exposed lead portion between the electronic component and the substrate, or an insulating resin such as silicon rubber was applied to cover the entire exposed lead between the electronic component and the substrate. . In addition, the entire electronic component is covered with an insulating cap, or an insulating material molded from an insulating resin is attached to a lead portion exposed from the substrate to insulate the leads from each other. In addition, on the soldering surface of the substrate, when the lead and solidified solder are covered with silicon rubber or when the lead is inserted into the substrate, a sufficient insulation distance is maintained between the leads protruding to the substrate soldering surface. It was possible to form the lead before inserting the lead.

Further, Patent Document 1 discloses a method in which a connection portion between a high-frequency device surface and each lead is covered with an insulating resin and sealed in an airtight state. Furthermore, Patent Document 2 proposes a method in which a cover member is attached so as to wrap the entire substrate, and a sealing material is filled into a mating portion of the substrate with the base member, so that the substrate is hermetically sealed. In addition, Patent Document 3 discloses a method of protecting the connection terminals and contacts of the substrate from the coating agent when the entire substrate is coated.
Japanese Patent Laid-Open No. 10-41420 Japanese Patent Laid-Open No. 11-243283 JP-A-63-24574

  In the above conventional technique, in the method of inserting the insulating tube into the lead on the electronic component side, if the tube length and the lead length of the portion exposed from the substrate are not aligned with high accuracy, the substrate or the electronic component main body and the insulating tube are not aligned. There was no close contact and a slight gap was generated. Then, if foreign matter, dust, or the like that has entered adheres to the gap and gets wet, there is a possibility that the leads are short-circuited. Further, in the method of applying an insulating resin such as silicon rubber so as to cover the entire lead on the electronic component side, the mounting density of the substrate has recently been increased, and the workability has been poor. In addition, in this case, if the necessity of replacing parts occurs, the labor for peeling off the applied resin is increased, and the number of work steps is increased. In addition, in the method of attaching the insulating cap to the entire electronic component, high accuracy is required for the length of the insulating cap, and if the accuracy is low, a gap may be formed between the substrate and the substrate. In addition, in the case of electronic parts with high heat generation, a heat sink may be mounted, but a dedicated part for fixing to the heat sink is required, which is costly and laborious to attach. In addition, the method of attaching the resin-molded insulating material to the lead protruding from the substrate requires a highly accurate insulating material that matches the protruding lead length, and if the accuracy is low, between the substrate or the main body, There was a possibility that a gap would occur. In addition, there is a restriction on lead molding.

  In addition, these conventional methods increase the number of additional work during assembly work, which is not efficient and leads to protruding leads when an insulating tube or insulating material is attached or an insulating cap is attached. It was necessary to prepare in advance according to the length and the size of the electronic component.

  Further, in the method of applying silicon rubber or the like to the substrate soldering surface, additional work is increased, so that the work efficiency is not good. Furthermore, in the method of forming when the component leads are inserted into the board, the space efficiency of the board is deteriorated, and it is impossible to completely prevent foreign matter from adhering between the leads protruding to the opposite side, which causes a short circuit. The possibility remained. Furthermore, since the above measures need to be applied to each of the lead exposed portion between the main body of the electronic component and the board and the board soldering surface, it takes time and work efficiency is not good.

  On the other hand, in Patent Document 1, the surface of the high-frequency device is hermetically sealed by dropping resin together with the connected lead end, and the terminal when the electronic component is attached to the substrate in a state exposed to the outside air There is no disclosure of insulation between the substrate and the soldering surface. Further, in Patent Document 2, since the cover member is attached to the base material so as to cover the entire substrate, the cost is high and the size for housing the substrate is required, and the space efficiency is not good. In addition, Patent Document 3 discloses a method for protecting the connection terminals and contacts of the substrate from the coating agent when the entire substrate is coated. However, coating the entire substrate is costly and additional The work efficiency was not good because of the increased work.

  The present invention has been made in view of the above-mentioned problems of the prior art, and aims to provide a short-circuit prevention spacer for an electronic component that is inexpensive and reliably insulated between leads of the electronic component and has high work efficiency. And

The present invention is made of an insulating resin, is formed so as to be attachable to an electronic component, and one of the three leads protruding in parallel from the lead protruding surface of the electronic component is formed to form a protruding direction. A spacer main body that accommodates the electronic component extended by shifting the position in parallel, and formed on the bottom surface of the spacer main body, so that two leads at both ends of the three leads of the electronic component can be individually inserted. A plurality of insertion holes provided, and protruding from the bottom surface of the spacer body , projecting to the opposite side of the circuit board through the through holes for partition walls of the circuit board on which the electronic component is mounted , and positioned at the center This is a short-circuit preventing spacer for an electronic component comprising a plate-like partition wall partitioning the lead between the lead and the lead at both ends in the parallel direction of the leads at both ends .

The partition wall is formed longer than the lead length protruding from the insertion hole. Further, the spacer body may be those adhered portion upper end is formed in a substantially rectangular parallelepiped opened to accommodate the electronic components are formed.

  According to the electronic component short-circuit preventing spacer of the present invention, the portion exposed from the substrate of the electronic component mounted on the circuit board and the lead protruding from the soldering surface of the substrate are simultaneously insulated by the partition portion of the insulating resin. The structure for ensuring the power consumption is simple, and the cost for that is reduced. Thereby, a short circuit between leads due to dust or conductive foreign matter can be prevented. In addition, since the short-circuit prevention spacer is mounted on the circuit board before component mounting or at the same time as the electronic component, no additional work or the like is required, and the work efficiency is good.

  Hereinafter, a first embodiment of a short-circuit preventing spacer for an electronic component according to the present invention will be described with reference to FIGS. As shown in FIG. 1, the electronic component short-circuit preventing spacer 10 of this embodiment has a spacer body 12 formed in a rectangular parallelepiped with insulating resin, for example, a cover that is open so as to accommodate the bottom of the body 14 a of the electronic component 14. A landing portion 16 is formed. The adherent portion 16 is formed so as to be able to adhere to an appropriate height of the main body 14 a when attached to the electronic component 14. Moreover, the horizontal cross-sectional shape of the adherend portion 16 is formed in a substantially rectangular shape. As shown in FIGS. 2A and 2B, the spacer body bottom surface 12a, which is the bottom surface of the adherend, is provided with the same number of insertion holes 20 as the number of leads 18 so that the leads 18 of the electronic component 14 can be inserted. ing. As shown in FIG. 2B, the horizontal cross-sectional shape of the insertion hole 20 is formed in a substantially rectangular shape so that the lead 18 can be inserted.

  Plate-shaped partition walls 22 projecting integrally with the spacer body 12 are provided in parallel to each other at intermediate positions between the respective insertion holes 20 opened in the spacer body bottom surface 12a. Further, as shown in FIG. 2B, the partition wall portion 22 has the same width as the width direction of the spacer body 12 and the end portion is flush with the long side surface of the spacer body 12 and has an appropriate thickness. is doing. Furthermore, as shown in FIG. 1, it is desirable that the lead 18 is formed slightly longer than the length of the protruding lead 18 when the lead 18 is inserted into the insertion hole 20.

  Next, the usage method of the short circuit prevention spacer 10 of this electronic component is demonstrated. As shown in FIG. 1, the substrate 24 on which the electronic component 14 is mounted has mounting holes 26 in the substrate 24 in which the number of leads 18 of the electronic component and the partition wall portion 22 provided between the leads 18 are inserted in advance. Is provided. First, the electronic component 14 to be mounted is inserted into the attachment portion 16 formed in the spacer body 12 through the insertion hole 20 of the attachment portion 16 first from the lead 18. Subsequently, the electronic component 14 is inserted into the adherend portion 16 and inserted until the lead protruding surface 14 b comes into close contact with the bottom surface of the adherend portion 16. Then, the lead 18 and the partition wall portion 22 are respectively inserted into the mounting hole 26 and the partition wall through hole 27 provided in the substrate 24, and the lead 18 protruding from the substrate soldering surface 28 is soldered. The attachment of the substrate 24 to the electrode land is completed.

  According to the electronic component short-circuit prevention spacer 10 of this embodiment, the lead 18 portion protruding from the substrate 24 of the electronic component 14 mounted on the substrate 24 is insulated by the spacer body 12, and at the same time, the substrate soldering surface 28 is A wall is formed between the leads 18 by the partition wall 22 to ensure insulation. This eliminates the need for additional work for insulation between the leads 18 and improves work efficiency. Further, since the structure is simple, the cost is reduced. Thereby, a short circuit between the leads 18 due to dust or conductive foreign matter can be prevented.

  Next, a second embodiment of the present invention will be described with reference to FIG. Here, the same members as those in the above embodiment are denoted by the same reference numerals, and the description thereof is omitted. The short-circuit preventing spacer 10 of this embodiment is formed so as to be insertable only in the lead 18 portion without providing the adherend portion 16 in the spacer body 12. Also in this case, the spacer body 12 formed in a rectangular parallelepiped shape with insulating resin is provided with the same number of insertion holes 20 as the number of leads 18 formed so that the leads 18 of the electronic component 14 can be inserted, and the spacer body bottom surface 12a has A plate-like partition wall 22 is projected in parallel at each intermediate position between the insertion holes 20. And it inserts so that the lead protrusion surface 14b of the electronic component 14 and the spacer main body 12 end surface may be in a close contact state, and inserts into the mounting hole 26 and the partition insertion hole 27 provided in advance in the substrate 24, respectively. As a result, a wall is formed between the leads 18 at the partition wall 22 and is insulated, so that no additional work is required, work efficiency is high, and the structure is simple and the cost is reduced.

  Next, a third embodiment of the present invention will be described with reference to FIG. Here, the same members as those in the above embodiment are denoted by the same reference numerals, and the description thereof is omitted. In the short-circuit preventing spacer 10 of this embodiment, as shown in FIG. 4B, the side surfaces of the insertion holes 20 formed on both ends in the longitudinal direction of the spacer body 12 shown in FIG. It is cut | disconnected toward each side surface adjacent to the longitudinal direction, and is formed in the open state. In this case, when being inserted into the electronic component 14, the restriction due to the shape of the insertion hole 20 at both ends is reduced, the insertion into the lead 18 is easy, and the restriction of the shape of the lead 18 at both ends can be reduced. Furthermore, a plate-shaped partition wall portion 22 having an appropriate thickness protrudes in parallel at an intermediate position of each insertion hole 20 opened in the spacer main body bottom surface 12a to form a wall, and the leads 18 are insulated. The partition wall 22 may be formed to have a width slightly narrower than the width direction of the spacer body 12. In addition, it is further preferable that the partition wall 22 is formed longer than the length of the lead 18 protruding through the insertion hole 20 because dust hardly adheres between the leads 18.

  Next, a fourth embodiment of the present invention will be described with reference to FIGS. Here, the same members as those in the above embodiment are denoted by the same reference numerals, and the description thereof is omitted. The short-circuit preventing spacer 10 of this embodiment is configured such that the insertion hole 21 of the lead 18 at the center of the electronic component 14 protrudes from one side surface in the longitudinal direction of the spacer body 12. In this case, as shown in FIG. 5D, one lead 18 of the electronic component 14 is bent and inserted into the insertion hole 21.

  The side surface of the spacer body 12 on the side where the insertion hole 21 is formed extends downward longer than the protruding length of the lead 18 by the width of the side surface, and constitutes a partition 22 that separates the terminals. In this case, it is necessary to form one of the leads 18 of the electronic component 14. However, by arranging the leads 18 in the front-rear direction, the width in the direction in which the leads 18 are arranged is suppressed, and a short circuit between adjacent leads 18 is prevented. Can be performed reliably.

  The short-circuit prevention spacer of the electronic component according to the present invention is not limited to the above embodiment, and is formed so as to be able to be closely attached to the lead projecting surface of the electronic component, and a partition wall is projected between the leads. Therefore, the shape and the like of the insertion hole and the spacer body can be set as appropriate. Furthermore, if the electronic component has resistance and insulation against heat generation and can be inserted into the electronic component or the lead, the shape, material, and the like can be appropriately changed.

It is a schematic side view which shows the use condition of the short circuit prevention spacer of the electronic component of 1st embodiment of this invention. They are the side view (a) which shows the short circuit prevention spacer of the electronic component of this embodiment, and a bottom view (b). It is a side view which shows the use condition of the short circuit prevention spacer of the electronic component of 2nd embodiment of this invention. They are the side view (a) which shows the short circuit prevention spacer of the electronic component of 3rd embodiment of this invention, and a bottom view (b). It is the top view (a), front view (b), bottom view (c), and right view (d) which show the short circuit prevention spacer of the electronic component of 4th embodiment of this invention. It is a perspective view which shows the short circuit prevention spacer of the electronic component of this embodiment.

DESCRIPTION OF SYMBOLS 10 Short-circuit prevention spacer 12 Spacer main body 12a Spacer main body bottom surface 14 Electronic component 16 Adhered part 18 Lead 20 Insertion hole 22 Partition part 24 Circuit board 26 Mounting hole 27 Through hole for partition

Claims (3)

It is made of an insulating resin and is formed so as to be attachable to an electronic component. One of the three leads protruding in parallel from the lead protruding surface of the electronic component is formed so as to be positioned parallel to the protruding direction. A plurality of spacer main bodies that accommodate the electronic components extended in a shifted manner and a plurality of two leads formed on the bottom surface of the spacer main body so that two leads at both ends of the three leads of the electronic components can be individually inserted. An insertion hole of the spacer body, and protrudes to the opposite side of the circuit board through a partition wall through-hole of the circuit board on which the electronic component is mounted , and the lead located in the center and the A short-circuit preventing spacer for an electronic component , comprising: a plate-like partition wall partitioning between leads at both ends in a parallel direction of the leads at both ends .   2. The electronic component short-circuit prevention spacer according to claim 1, wherein the partition wall is formed longer than a lead length protruding from the insertion hole. Wherein the spacer body, the electronic component circuit preventing spacer of claim 1, wherein a deposition section for the upper end is formed into a substantially rectangular parallelepiped opened to accommodate the electronic components are formed.

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