JPH08153837A - Heat radiating device of electronic part - Google Patents

Abstract

PURPOSE: To enhance the heat radiating effect of electronic part such as ICs generating heat in its application. CONSTITUTION: An auxiliary heat radiation part 5 comprising excellent heat conductive material is fitted to a heat radiating fin 1 to cover the surface of an IC 4 fitted to the heat radiating fin 1. In such a constitution, the heat on the package surface of the IC 4 is directly conducted to the heat radiating fin 1, and is conducted further through the intermediary of auxiliary heat radiating part 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipating device for electronic parts which reduces the temperature rise of electronic parts such as ICs which generate heat when used.

[0002]

2. Description of the Related Art Conventionally, in order to reduce the temperature rise of an IC that generates heat due to use, the IC is attached to a radiation fin,
The close contact between the package and the mounting surface of the radiation fin makes the IC
Was transmitting heat to the heat dissipation fins.

[0003]

However, in the prior art as described above, there is a problem that the heat dissipation efficiency is poor because the heat conduction to the heat dissipation fin is performed only on the mounting surface of the IC.

The present invention solves such a conventional problem, and provides a heat dissipation device capable of reliably reducing the temperature rise by increasing the heat dissipation efficiency of electronic components that generate heat. The purpose is.

[0005]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a radiation fin for mounting an electronic component that generates heat when used, and a surface formed of a material having thermal conductivity. A heat dissipation auxiliary component that is attached to the heat dissipation fin so as to cover it and transmits heat generated from the surface of the electronic component to the heat dissipation fin.

[0006]

Therefore, according to the present invention, heat is radiated from the electronic component by the radiating fin and the radiating auxiliary component, so that the radiating efficiency can be improved.

[0007]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is an explanatory view showing a heat dissipation device in one embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a radiating fin, which is made of a material having excellent thermal conductivity, and is formed in a comb shape in which a plurality of fins 3 are integrally provided in a mounting plate 2 in a substantially parallel manner. Are attached in contact. Reference numeral 5 denotes a heat dissipation auxiliary component, which is made of a material having excellent thermal conductivity, and the mounting plates 8 on both sides are covered by the surface plate 6 and the side plate 7 so as to cover the surface of the IC 4.
Is attached in contact with the back surface of the mounting plate 2.
A desired means such as a screw can be used as the attaching means.

The heat generated by the use of the IC 4 is directly transferred to the heat dissipation fin 1 by the contact surface between the IC 4 and the heat dissipation fin 1, and further transferred to the heat dissipation fin 1 through the contact surface between the IC 4 and the heat dissipation auxiliary component 5.

As described above, according to the above-described embodiment, the heat dissipation auxiliary component 5 allows the heat from the surface other than the contact surface of the IC 4 with the heat dissipation fin 1 to be transferred to the heat dissipation fin 1, thus increasing the temperature of the IC 4. Has the advantage that it can be reliably reduced.

Regarding the structure of the heat dissipation auxiliary component 5 in the above embodiment, if it is a material having good thermal conductivity (for example, a metal material such as aluminum or copper, or silicon rubber or graphite), a plate shape or a sheet It may be in the shape of a fin or a fin.

[0012]

As described above, according to the present invention, the heat from the surface of the electronic component is directly transferred to the heat radiation fin and further transferred to the heat radiation fin through the heat radiation auxiliary component, so that the heat radiation from the surface of the electronic component is performed. The efficiency can be increased and the temperature of the electronic component can be reliably reduced.

[Brief description of drawings]

FIG. 1 is a perspective view showing a heat dissipation device for an electronic component according to an embodiment of the present invention.

[Explanation of symbols]

 1 Heat dissipation fin 4 IC (electronic parts) 5 Heat dissipation auxiliary parts

Claims (1)

[Claims] 1. A radiating fin for mounting an electronic component that generates heat when used, and a radiating fin formed of a material having thermal conductivity, mounted on the radiating fin so as to cover the surface of the electronic component, and from the surface of the electronic component. A heat dissipation device for electronic parts, which is equipped with a heat dissipation auxiliary part that transmits the heat generation of the above to the heat dissipation fin.