JPH03182397A - Ic card - Google Patents
Ic cardInfo
- Publication number
- JPH03182397A JPH03182397A JP1321890A JP32189089A JPH03182397A JP H03182397 A JPH03182397 A JP H03182397A JP 1321890 A JP1321890 A JP 1321890A JP 32189089 A JP32189089 A JP 32189089A JP H03182397 A JPH03182397 A JP H03182397A
- Authority
- JP
- Japan
- Prior art keywords
- card
- semiconductor element
- metal panel
- package
- heat conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000126 substance Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、半導体素子を内蔵するＩＣカードの、動作
特電力損失によるＩＣカード内部温度上昇防止に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to prevention of temperature rise inside an IC card that incorporates a semiconductor element due to operating specific power loss.
〔従来の技術」
第２図は従来のＩＣカードを示す断面図であり、図に分
いて（１）は半導体素子、（１Ｂ）はパッケージ（ｌｂ
）はリード、（２）は半導体素子（１）を実装する配線
基板、（３）は配線基板（２）を固定する樹脂成形フレ
ーム、（４）は國脂威形フレーム（３）に接着された金
属パネルであろう
次に従来のＩＣカードの動作時の内部熱伝導について説
明する。動作時に半導体素子（１）の電力損失により発
する熱の、ＩＣカード外部大気への放熱ルートには、主
として次の２つのルートがある。[Prior Art] Figure 2 is a cross-sectional view showing a conventional IC card. In the figure, (1) is the semiconductor element, and (1B) is the package (lb.
) is the lead, (2) is the wiring board on which the semiconductor element (1) is mounted, (3) is the resin molded frame that fixes the wiring board (2), and (4) is glued to the Japanese resin molded frame (3). Next, internal heat conduction during operation of a conventional IC card will be explained. There are mainly two routes for dissipating heat generated by power loss of the semiconductor element (1) during operation to the atmosphere outside the IC card.
１つは半導体チップから半導体素子（１）のパッケージ
（１８）の表面を経て、ＩＣカード内の空気を介して金
属パネル（４）の表面から外部大気へ放散されるＮ−ト
であり、もう１つは、半導体チップから半導体素子（１
）のリード（１ｂ）を通して配Ｍ基板伐）へ熱伝導され
た後、！！！ｉ！線基板（２）の表面からＩＣカード内
空気を介して金属バネＡ／（４）の表面から外部大気へ
放散されるルートである。One is N-t, which is emitted from the semiconductor chip through the surface of the package (18) of the semiconductor element (1), through the air inside the IC card, and from the surface of the metal panel (4) to the outside atmosphere. One is to transfer the semiconductor chip to the semiconductor element (1
) through the lead (1b) to the MMC board ( ), then! ! ! i! This is the route through which the air is dissipated from the surface of the wire board (2) through the air inside the IC card, and from the surface of the metal spring A/(4) to the outside atmosphere.
従来のＩＣカードは以上のように構成されているので、
動作時の発熱源である半導体素子から金属パネル筐での
放熱ルートの途中に、カード内部空気を介しての熱伝導
が介在するので、ＩＣカード内部の温度が上昇し、ＩＣ
カード外部大気温度によっては、ＩＣカード内の回路素
子、及び機構部品の定格温度層くまで温度が上昇するな
どの問題点があった。Conventional IC cards are configured as described above, so
Since heat conduction occurs through the air inside the card during the heat dissipation route from the semiconductor element, which is the heat source during operation, to the metal panel housing, the temperature inside the IC card increases and the IC card
Depending on the atmospheric temperature outside the card, there is a problem in that the temperature of the circuit elements and mechanical parts inside the IC card rises below the rated temperature.
この発明は上記のような問題点を解消するためになされ
たもので、ＩＣカード動作時の、半導体素子の電力損失
による発熱を効率よく金属バネ〜へ伝導し、金属パネル
表面から外部大気へ放熱することにより、内部温度上昇
を抑制することのできるＩＣカードを得ることを目的と
する。This invention was made to solve the above-mentioned problems, and it efficiently conducts the heat generated by the power loss of the semiconductor element during IC card operation to the metal spring, and radiates the heat from the surface of the metal panel to the outside atmosphere. The object of the present invention is to obtain an IC card that can suppress internal temperature rise.
Ｃ課頭金解決するための手段ノ
この発明に係るＩＣカードは、ＩＣカード内の半導体素
子のパッケージ表面とカード外装の金属パネルとの間の
間隙を、高熱伝導率物質で充填したものである。C Means for Solving Charges The IC card according to the present invention is one in which the gap between the package surface of the semiconductor element in the IC card and the metal panel of the card exterior is filled with a high thermal conductivity material.
〔作用Ｊ
この発明に卦けるＩＣカードは、動作時に半導体素子の
電力損失により発する熱を、半導体素子のパッケージ表
面とＩＣカード外装の金属パネルとの間に充填した高熱
伝４率物質を通して効率よ〈金属パネルへ伝導し、金属
パネル表面から外部大気へ熱を放散し、ＩＣカード内部
の温度上昇を抑制する。[Function J] The IC card according to the present invention efficiently dissipates heat generated due to power loss of the semiconductor element during operation through a high heat conductivity material filled between the package surface of the semiconductor element and the metal panel of the IC card exterior. <Heat is conducted to the metal panel, dissipates heat from the metal panel surface to the outside atmosphere, and suppresses the temperature rise inside the IC card.
（実施例Ｊ
以下、この発明の一実施例を図について説明するっ第１
図はＩＣカードを示す断面図である。図において、（１
） 、 （ｌａ）、 （ｌｂ）、 （２）〜（４１
は第２図の従来例に示したものと同等であるので説明を
省略する。（５）は金塊パネル（４）と半導体素子（１
）のパッケージ（１ａ）表面とを接着する接着剤や接着
シートなどの高熱伝導率物質である。(Embodiment J Hereinafter, one embodiment of the present invention will be explained with reference to the drawings.
The figure is a sectional view showing an IC card. In the figure, (1
), (la), (lb), (2) ~ (41
is the same as that shown in the conventional example shown in FIG. 2, so its explanation will be omitted. (5) is a gold nugget panel (4) and a semiconductor element (1
) is a high thermal conductivity material such as an adhesive or an adhesive sheet that adheres to the surface of the package (1a).
次に工Ｃカードの動作時のカード内部熱伝４について説
明する。ＩＣカード動作時、半導体素子（１）の電力損
失により発する熱は、半導体チップから半導体素子（１
）のパッケージ（ｌａ ）の表面を経て高熱伝４″４Ａ
物寅（５）を介して金属パネル（４）に伝導し、金属パ
ネル（４）の表面から外部大気へ放散される。Next, the heat transfer 4 inside the card during operation of the engineering C card will be explained. During IC card operation, heat generated due to power loss in the semiconductor element (1) is transferred from the semiconductor chip to the semiconductor element (1).
) High heat transfer through the surface of the package (la) 4″4A
It is conducted to the metal panel (4) through the material (5) and is dissipated from the surface of the metal panel (4) to the outside atmosphere.
半導体チップからの＃！は、一部半導体素子（１）のリ
ード（ｌｂ）を通して配線基板（２）へ伝導され、配線
基板（２）の表面からＩＣカード内内空を介して金属パ
ネル（４）の表面から外部大気へ放散されるが、高熱伝
導率物質（５）の熱伝導率が、空気に比べて１分に高け
れば、半導体素子（１）からの発熱はほとんど半導体素
子（１）のパッケージ（ｌａ）表面から高熱伝導率物質
（５）を介してＩＣカード外装の金属パネル（４）の表
面から放散され、ＩＣカード内部空気の温度上昇は抑制
される。# from semiconductor chips! A portion of this is conducted to the wiring board (2) through the leads (lb) of the semiconductor element (1), and from the surface of the metal panel (4) through the inner space of the IC card from the surface of the wiring board (2) to the external atmosphere. However, if the thermal conductivity of the high thermal conductivity material (5) is higher than that of air per minute, most of the heat generated from the semiconductor element (1) will be dissipated to the surface of the package (la) of the semiconductor element (1). The heat is radiated from the surface of the metal panel (4) of the IC card exterior through the high thermal conductivity material (5), and the temperature rise of the air inside the IC card is suppressed.
なか、上記実施例では金属パネル（４）を、Ｋ熱伝導率
物質（５）で、半導体素子（１）のパッケージ（１日）
の表面に接着するものを示したが、ＩＣカード内部空間
全体に高熱伝導率物質（５）を充填しても金属パネル（
４）から高い熱放散効果が得られ上記実施例と同様の効
果が得られる。Among them, in the above embodiment, the metal panel (4) is made of K thermal conductive material (5), and the semiconductor element (1) is packaged (1 day).
The metal panel (
4), a high heat dissipation effect can be obtained, and the same effect as in the above embodiment can be obtained.
「発明の効果］
以上のように、この発明によれば、ＩＣカード内部の半
導体素子とカード外装の金属パネルとの間の間隙を、高
熱＠４４Ａ物質で充填したので、動作時の半導体素子の
電力損失による発熱を効率よ〈金嘱パネル表面から放散
することができ、ＩＣカード内部の温度上昇を抑制する
効果があるっ[Effects of the Invention] As described above, according to the present invention, the gap between the semiconductor element inside the IC card and the metal panel of the card exterior is filled with a high-heat @44A substance, so that the semiconductor element during operation is Heat generated by power loss can be efficiently dissipated from the surface of the metal panel, which has the effect of suppressing the temperature rise inside the IC card.
第１図はこの＠明の一実施例によるＩＣカードを示す断
面図、第２図は従来のＩＣカードを示す断面図であるう
図中、（１）？′ｉ半導体素子、（ｌａ）はパッケージ
、（Ｉｂ）はリード、（２）は配線基板、（３）は樹脂
成形フレーム、（４）は金属パネル、（５）は高熱伝４
率物質である。
なか、図中、同一符号は同一、又は相当部分を示す。Fig. 1 is a sectional view showing an IC card according to an embodiment of this @ Ming, and Fig. 2 is a sectional view showing a conventional IC card. 'i Semiconductor element, (la) is package, (Ib) is lead, (2) is wiring board, (3) is resin molded frame, (4) is metal panel, (5) is high heat transfer 4
It is a rate substance. In the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
気的接続を得る為のコネクタを実装した配線基板と、該
配線基板を固定する樹脂成形フレームと、該フレームに
接着される金属パネルとから構成されるＩＣカードにお
いて、上記半導体素子と上記金属パネルとの間隙を高熱
伝導率物質で充填したことを特徴とするＩＣカード。Consists of a wiring board mounted with semiconductor elements, other circuit elements, and connectors for electrical connection with external equipment, a resin molded frame that fixes the wiring board, and a metal panel adhered to the frame. 1. An IC card characterized in that a gap between the semiconductor element and the metal panel is filled with a material having high thermal conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1321890A JPH03182397A (en) | 1989-12-12 | 1989-12-12 | Ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1321890A JPH03182397A (en) | 1989-12-12 | 1989-12-12 | Ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03182397A true JPH03182397A (en) | 1991-08-08 |
Family
ID=18137543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1321890A Pending JPH03182397A (en) | 1989-12-12 | 1989-12-12 | Ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03182397A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5508885A (en) * | 1993-04-26 | 1996-04-16 | Mitsubishi Denki Kabushiki Kaisha | IC card having improved heat dissipation |
| JPH09226280A (en) * | 1996-02-22 | 1997-09-02 | Shinko Electric Ind Co Ltd | Card module |
| JPH09231336A (en) * | 1995-12-20 | 1997-09-05 | Pfu Ltd | Card-form circuit module |
| US5923084A (en) * | 1995-06-06 | 1999-07-13 | Seiko Epson Corporation | Semiconductor device for heat discharge |
| US6771509B2 (en) | 1992-05-20 | 2004-08-03 | Seiko Epson Corporation | Cartridge for electronic devices |
| JP2017191487A (en) * | 2016-04-14 | 2017-10-19 | キヤノン株式会社 | Slot device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61166195A (en) * | 1985-01-18 | 1986-07-26 | 凸版印刷株式会社 | Ic module |
| JPS62167097A (en) * | 1986-01-21 | 1987-07-23 | セイコーエプソン株式会社 | Integrated circuit card |
| JPH01117049A (en) * | 1987-10-30 | 1989-05-09 | Hitachi Ltd | Integrated circuit element cooling device |
-
1989
- 1989-12-12 JP JP1321890A patent/JPH03182397A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61166195A (en) * | 1985-01-18 | 1986-07-26 | 凸版印刷株式会社 | Ic module |
| JPS62167097A (en) * | 1986-01-21 | 1987-07-23 | セイコーエプソン株式会社 | Integrated circuit card |
| JPH01117049A (en) * | 1987-10-30 | 1989-05-09 | Hitachi Ltd | Integrated circuit element cooling device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6771509B2 (en) | 1992-05-20 | 2004-08-03 | Seiko Epson Corporation | Cartridge for electronic devices |
| US5508885A (en) * | 1993-04-26 | 1996-04-16 | Mitsubishi Denki Kabushiki Kaisha | IC card having improved heat dissipation |
| US5923084A (en) * | 1995-06-06 | 1999-07-13 | Seiko Epson Corporation | Semiconductor device for heat discharge |
| JPH09231336A (en) * | 1995-12-20 | 1997-09-05 | Pfu Ltd | Card-form circuit module |
| JPH09226280A (en) * | 1996-02-22 | 1997-09-02 | Shinko Electric Ind Co Ltd | Card module |
| JP2017191487A (en) * | 2016-04-14 | 2017-10-19 | キヤノン株式会社 | Slot device |
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