JPH03182397A - Ic card - Google Patents

Ic card

Info

Publication number
JPH03182397A
JPH03182397A JP32189089A JP32189089A JPH03182397A JP H03182397 A JPH03182397 A JP H03182397A JP 32189089 A JP32189089 A JP 32189089A JP 32189089 A JP32189089 A JP 32189089A JP H03182397 A JPH03182397 A JP H03182397A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
surface
semiconductor element
metal panel
heat conductivity
ic card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32189089A
Inventor
Takayuki Shinohara
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To obtain an IC card capable of suppressing the rise of internal temp. by efficiently conducting the heat generated by the power loss of a semiconductor element at the time of operation to a metal panel to radiate the same to the open air from the surface of the metal panel by filling the gap between the surface of the package of the semiconductor element and the exterior metal panel with a heat conductivity substance.
CONSTITUTION: The heat generated by the power loss of a semiconductor element 1 at the time of the operation of an IC card is conducted to a metal panel 4 from a semiconductor chip through the surface of the package 1a of the semiconductor element 1 and a high heat conductivity substance 5 and radiated to the open air from the surface of the metal panel 4. When the heat conductivity of the high heat conductivity substance 5 is higher than that of air, the heat generated from the semiconductor element 1 is almost diffused from the surface of the metal panel 4 through the surface of the package 1a of the semiconductor element 1 and the high heat conductivity substance 5 and the temp. rise of the air in the IC card is suppressed.
COPYRIGHT: (C)1991,JPO&Japio
JP32189089A 1989-12-12 1989-12-12 Ic card Pending JPH03182397A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32189089A JPH03182397A (en) 1989-12-12 1989-12-12 Ic card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32189089A JPH03182397A (en) 1989-12-12 1989-12-12 Ic card

Publications (1)

Publication Number Publication Date
JPH03182397A true true JPH03182397A (en) 1991-08-08

Family

ID=18137543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32189089A Pending JPH03182397A (en) 1989-12-12 1989-12-12 Ic card

Country Status (1)

Country Link
JP (1) JPH03182397A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5508885A (en) * 1993-04-26 1996-04-16 Mitsubishi Denki Kabushiki Kaisha IC card having improved heat dissipation
US5923084A (en) * 1995-06-06 1999-07-13 Seiko Epson Corporation Semiconductor device for heat discharge
US6771509B2 (en) 1992-05-20 2004-08-03 Seiko Epson Corporation Cartridge for electronic devices

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61166195A (en) * 1985-01-18 1986-07-26 Toppan Printing Co Ltd Ic module
JPS62167097A (en) * 1986-01-21 1987-07-23 Seiko Epson Corp Integrated circuit card
JPH01117049A (en) * 1987-10-30 1989-05-09 Hitachi Ltd Integrated circuit element cooling device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61166195A (en) * 1985-01-18 1986-07-26 Toppan Printing Co Ltd Ic module
JPS62167097A (en) * 1986-01-21 1987-07-23 Seiko Epson Corp Integrated circuit card
JPH01117049A (en) * 1987-10-30 1989-05-09 Hitachi Ltd Integrated circuit element cooling device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6771509B2 (en) 1992-05-20 2004-08-03 Seiko Epson Corporation Cartridge for electronic devices
US5508885A (en) * 1993-04-26 1996-04-16 Mitsubishi Denki Kabushiki Kaisha IC card having improved heat dissipation
US5923084A (en) * 1995-06-06 1999-07-13 Seiko Epson Corporation Semiconductor device for heat discharge

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