JPS59140446U - Package for hybrid integrated circuits - Google Patents

Package for hybrid integrated circuits

Info

Publication number
JPS59140446U
JPS59140446U JP3522683U JP3522683U JPS59140446U JP S59140446 U JPS59140446 U JP S59140446U JP 3522683 U JP3522683 U JP 3522683U JP 3522683 U JP3522683 U JP 3522683U JP S59140446 U JPS59140446 U JP S59140446U
Authority
JP
Japan
Prior art keywords
package
integrated circuits
hybrid integrated
fixing
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3522683U
Other languages
Japanese (ja)
Inventor
章 竹岡
信行 木崎
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP3522683U priority Critical patent/JPS59140446U/en
Publication of JPS59140446U publication Critical patent/JPS59140446U/en
Pending legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の混成集積回路用パッケージの斜視図、第
２図は本考案の一実施例における混成集積回路用パッケ
ージの斜視図、第３図は同パッケージを基板に固定した
状態を示す正面図である。 １・・・・・・放熱板、２・・・・・・成形樹脂、３・
・・・・・外部端子、４・・・・・・固定用支持部、５
・・・・・・引掛は部、６・・・　　□・・・基板。Fig. 1 is a perspective view of a conventional hybrid integrated circuit package, Fig. 2 is a perspective view of a hybrid integrated circuit package according to an embodiment of the present invention, and Fig. 3 is a front view of the package fixed to a substrate. It is a diagram. 1... Heat sink, 2... Molded resin, 3.
...External terminal, 4...Fixing support part, 5
...The hook is part, 6... □... Board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チップなどをマウントした放熱板を密封するため
の成形樹脂または金属ケースに、プリント基板に固定す
るための固定用支持部および引掛は部を設けた混成集積
回路用パッケージ。A package for hybrid integrated circuits that includes a molded resin or metal case for sealing a heat dissipation plate on which semiconductor chips are mounted, and a fixing support section and a hook section for fixing it to a printed circuit board.
JP3522683U 1983-03-10 1983-03-10 Package for hybrid integrated circuits Pending JPS59140446U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3522683U JPS59140446U (en) 1983-03-10 1983-03-10 Package for hybrid integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3522683U JPS59140446U (en) 1983-03-10 1983-03-10 Package for hybrid integrated circuits

Publications (1)

Publication Number Publication Date
JPS59140446U true JPS59140446U (en) 1984-09-19

Family

ID=30165929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3522683U Pending JPS59140446U (en) 1983-03-10 1983-03-10 Package for hybrid integrated circuits

Country Status (1)

Country Link
JP (1) JPS59140446U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05160298A (en) * 1991-07-10 1993-06-25 Mitsubishi Electric Corp Surface mounting type package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05160298A (en) * 1991-07-10 1993-06-25 Mitsubishi Electric Corp Surface mounting type package

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