JPH02125370U - - Google Patents

Info

Publication number
JPH02125370U
JPH02125370U JP3297089U JP3297089U JPH02125370U JP H02125370 U JPH02125370 U JP H02125370U JP 3297089 U JP3297089 U JP 3297089U JP 3297089 U JP3297089 U JP 3297089U JP H02125370 U JPH02125370 U JP H02125370U
Authority
JP
Japan
Prior art keywords
circuit device
back surfaces
wiring patterns
chip
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3297089U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3297089U priority Critical patent/JPH02125370U/ja
Publication of JPH02125370U publication Critical patent/JPH02125370U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の回路装置に係る一実施例の構
成を示す斜視図、第2図は従来の技術に係る回路
装置の構成を示す斜視図である。 10……基体、11〜14……パターン、16
……チツプコンデンサ、17,18……スルーホ
ール、P,P……半田付。
FIG. 1 is a perspective view showing the structure of an embodiment of the circuit device of the present invention, and FIG. 2 is a perspective view showing the structure of a conventional circuit device. 10...Base, 11-14...Pattern, 16
...Chip capacitor, 17, 18...Through hole, P1 , P2 ...Soldered.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基体の表裏面に形成された複数の配線パタ
ーンにチツプ部品又はデイスクリート部品が配設
され、表裏面の配線パターン間を導通接続するス
ルーホールを配設してなる回路装置において、前
記複数のチツプ部品又はデイスクリート部品の近
傍にガス抜孔と兼用するスルーホールが配設され
ることを特徴とする回路装置。
In a circuit device in which chip components or discrete components are arranged in a plurality of wiring patterns formed on the front and back surfaces of an insulating substrate, and through holes are arranged for conductive connection between the wiring patterns on the front and back surfaces, A circuit device characterized in that a through hole that also serves as a gas vent hole is provided near a chip component or a discrete component.
JP3297089U 1989-03-23 1989-03-23 Pending JPH02125370U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3297089U JPH02125370U (en) 1989-03-23 1989-03-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3297089U JPH02125370U (en) 1989-03-23 1989-03-23

Publications (1)

Publication Number Publication Date
JPH02125370U true JPH02125370U (en) 1990-10-16

Family

ID=31536275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3297089U Pending JPH02125370U (en) 1989-03-23 1989-03-23

Country Status (1)

Country Link
JP (1) JPH02125370U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6380595A (en) * 1986-09-24 1988-04-11 日本電気株式会社 Printed wiring board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6380595A (en) * 1986-09-24 1988-04-11 日本電気株式会社 Printed wiring board

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