JPH0189775U - - Google Patents

Info

Publication number
JPH0189775U
JPH0189775U JP18511487U JP18511487U JPH0189775U JP H0189775 U JPH0189775 U JP H0189775U JP 18511487 U JP18511487 U JP 18511487U JP 18511487 U JP18511487 U JP 18511487U JP H0189775 U JPH0189775 U JP H0189775U
Authority
JP
Japan
Prior art keywords
pad
wiring board
printed wiring
solder resist
resist relief
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18511487U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18511487U priority Critical patent/JPH0189775U/ja
Publication of JPH0189775U publication Critical patent/JPH0189775U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図は本考案の第1及び第2の実
施例の平面図、第3図は従来の印刷配線板の平面
図、第4図は従来の印刷配線板にフラツトIC部
品を搭載した場合の部分平面図である。 1……印刷配線板、2……ソルダーレジスト、
3……パツド、4……ソルダーレジストの逃げ、
5……フラツトIC、6……外部リード、7……
レーザービーム。
1 and 2 are plan views of the first and second embodiments of the present invention, FIG. 3 is a plan view of a conventional printed wiring board, and FIG. 4 is a plan view of a conventional printed wiring board with flat IC components. FIG. 3 is a partial plan view of the vehicle installed. 1...Printed wiring board, 2...Solder resist,
3...Putsudo, 4...Escape of solder resist,
5...Flat IC, 6...External lead, 7...
Laser beam.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 四方向に外部リードを有するフラツトIC部品
を実装するためのパツドと該パツドの周囲に形成
されたソルダーレジストの逃げとを有する印刷配
線板において、前記ソルダーレジストの逃げは前
記各パツドに連通していることを特徴とする印刷
配線板。
In a printed wiring board having a pad for mounting a flat IC component having external leads in four directions and a solder resist relief formed around the pad, the solder resist relief communicates with each pad. A printed wiring board characterized by:
JP18511487U 1987-12-03 1987-12-03 Pending JPH0189775U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18511487U JPH0189775U (en) 1987-12-03 1987-12-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18511487U JPH0189775U (en) 1987-12-03 1987-12-03

Publications (1)

Publication Number Publication Date
JPH0189775U true JPH0189775U (en) 1989-06-13

Family

ID=31476442

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18511487U Pending JPH0189775U (en) 1987-12-03 1987-12-03

Country Status (1)

Country Link
JP (1) JPH0189775U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5784193A (en) * 1980-11-14 1982-05-26 Tokyo Shibaura Electric Co Printed circuit board
JPS5856491A (en) * 1981-09-30 1983-04-04 株式会社東芝 Printed circuit board
JPS5849472B2 (en) * 1975-10-03 1983-11-04 帝人株式会社 Shijiyoukiyuinhouhou

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5849472B2 (en) * 1975-10-03 1983-11-04 帝人株式会社 Shijiyoukiyuinhouhou
JPS5784193A (en) * 1980-11-14 1982-05-26 Tokyo Shibaura Electric Co Printed circuit board
JPS5856491A (en) * 1981-09-30 1983-04-04 株式会社東芝 Printed circuit board

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