JPH0178071U - - Google Patents
Info
- Publication number
- JPH0178071U JPH0178071U JP1987174101U JP17410187U JPH0178071U JP H0178071 U JPH0178071 U JP H0178071U JP 1987174101 U JP1987174101 U JP 1987174101U JP 17410187 U JP17410187 U JP 17410187U JP H0178071 U JPH0178071 U JP H0178071U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- pad
- hole
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はこの考案の一実施例によるプリント基
板へのＩＣ取付過程を示す斜視図、第２図は従来
方法によるプリント基板でのはんだ短絡状態を示
す斜視図イ及び側面図ロ、第３図はこの考案の一
実施例によるプリント基板でのはんだ短絡を除去
するための作業過程を示す斜視図イ及び側面図ロ
、第４図は従来方式のプリント基板へのＩＣ取付
過程を示す斜視図を示す。
図中、１はＩＣ、２はリード、３はプリント基
板、４はパツド、５はスルーホールである。尚、
図中同一符号は同一または相当部分を示す。
Fig. 1 is a perspective view showing the process of attaching an IC to a printed circuit board according to an embodiment of this invention, Fig. 2 is a perspective view showing a solder short circuit state on a printed board according to the conventional method, and Fig. 3 is a side view. 4 is a perspective view illustrating the work process for removing solder short circuits on a printed circuit board according to an embodiment of this invention, and a side view B, and FIG. show. In the figure, 1 is an IC, 2 is a lead, 3 is a printed circuit board, 4 is a pad, and 5 is a through hole. still,
The same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
傍に電気的接続を目的としないスルーホールを形
成したことを特徴とするプリント基板。 A printed circuit board characterized in that a through hole not intended for electrical connection is formed near a pad to be soldered to an electrical component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987174101U JPH0178071U (en) | 1987-11-12 | 1987-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987174101U JPH0178071U (en) | 1987-11-12 | 1987-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0178071U true JPH0178071U (en) | 1989-05-25 |
Family
ID=31465976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987174101U Pending JPH0178071U (en) | 1987-11-12 | 1987-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0178071U (en) |
-
1987
- 1987-11-12 JP JP1987174101U patent/JPH0178071U/ja active Pending
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