JPS6186968U - - Google Patents
Info
- Publication number
- JPS6186968U JPS6186968U JP17033684U JP17033684U JPS6186968U JP S6186968 U JPS6186968 U JP S6186968U JP 17033684 U JP17033684 U JP 17033684U JP 17033684 U JP17033684 U JP 17033684U JP S6186968 U JPS6186968 U JP S6186968U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- board
- utility
- model registration
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案のチツプ部品の一実施例の斜
視図、第２図はこの考案のチツプ部品を基板に取
り付けた場合の側面図、第３図は従来のチツプ部
品を基板に取り付けた状態の平面図、第４図は基
板単体の平面図、第５図および第６図はそれぞれ
第３図の要部の断面図である。
１１…基板、１２ａ，１２ｂ…導体層、１３…
チツプ部品、１４ａ，１４ｂ…電極、１５ａ，１
５ｂ…帯、１６…接着剤の層、１７ａ，１７ｂ…
半田。
Figure 1 is a perspective view of an embodiment of the chip component of this invention, Figure 2 is a side view of the chip component of this invention attached to a board, and Figure 3 is a state of a conventional chip component attached to a board. FIG. 4 is a plan view of the single substrate, and FIGS. 5 and 6 are sectional views of essential parts of FIG. 3, respectively. 11...Substrate, 12a, 12b...Conductor layer, 13...
Chip parts, 14a, 14b...electrodes, 15a, 1
5b... Band, 16... Adhesive layer, 17a, 17b...
solder.
Claims (1)
て、対向する電極の間に対向する複数の凸状の帯
を印刷で設けたことを特徴とするチツプ部品。 (2) 帯の高さをチツプ部品を基板を固定した場
合、チツプ部品両端の電極と基板上の導体層との
間にギヤツプを生ずるように設定したことを特徴
とする実用新案登録請求の範囲第１項記載のチツ
プ部品。[Claims for Utility Model Registration] (1) A chip part, which is a small electrical part without lead wires, and is characterized by having a plurality of opposing convex bands printed between opposing electrodes. (2) A claim for utility model registration characterized in that the height of the band is set so that when a chip component is fixed to a board, a gap is created between the electrodes at both ends of the chip component and the conductor layer on the board. Chip parts described in item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17033684U JPS6186968U (en) | 1984-11-12 | 1984-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17033684U JPS6186968U (en) | 1984-11-12 | 1984-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6186968U true JPS6186968U (en) | 1986-06-07 |
Family
ID=30728041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17033684U Pending JPS6186968U (en) | 1984-11-12 | 1984-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6186968U (en) |
-
1984
- 1984-11-12 JP JP17033684U patent/JPS6186968U/ja active Pending
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