JPS61153372U - - Google Patents
Info
- Publication number
- JPS61153372U JPS61153372U JP3542885U JP3542885U JPS61153372U JP S61153372 U JPS61153372 U JP S61153372U JP 3542885 U JP3542885 U JP 3542885U JP 3542885 U JP3542885 U JP 3542885U JP S61153372 U JPS61153372 U JP S61153372U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- substrate
- electrode
- conductor layer
- height
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例を示すメルフ部品の
斜視図、第２図は同メルフ部品を基板に実装した
側断面図、第３図は従来例を示しチツプ部品を実
装した平面図、第４図は同側断面図、第５図は従
来例を示しメルフ部品を実装した平面図、第６図
は同側断面図、第７図は従来例を示し他のチツプ
部品を実装した側断面図、第８図は従来例を示し
メルフ部品を実装した側断面図、第９図は従来例
を示しレジストが帯を被つた側断面図である。
１……基板、２……導体層、４……接着剤、７
……半田、８……メルフ部品、９……電極、１１
……帯。
Fig. 1 is a perspective view of a Melf component showing an embodiment of the present invention, Fig. 2 is a side sectional view of the Melf part mounted on a board, and Fig. 3 is a plan view of a conventional example with chip parts mounted. Fig. 4 is a sectional view of the same side, Fig. 5 is a plan view of the conventional example with MELF components mounted, Fig. 6 is a sectional view of the same side, and Fig. 7 is the conventional example of the side with other chip components mounted. FIG. 8 is a side sectional view showing a conventional example in which Melf parts are mounted, and FIG. 9 is a side sectional view showing a conventional example in which a resist is covered with a band. 1...Substrate, 2...Conductor layer, 4...Adhesive, 7
... Solder, 8 ... Melf parts, 9 ... Electrode, 11
……band.
Claims (1)
布し、この接着剤によつて基板上に固定した後、
電極を導体層に半田接続する小型電気部品におい
て、 前記接着剤で接着する個所の両側の外周に接着
剤の流出を防止する高さの帯を多角形となるよう
に形成したことを特徴とする小型電気部品。 ２ 実用新案登録請求の範囲第１項において、前
記帯を基板の導体層と電極との間に間隙が生ずる
高さとしたことを特徴とする小型電気部品。[Claims for Utility Model Registration] 1. After applying an adhesive between the conductive layers formed on the substrate and fixing it on the substrate with this adhesive,
A small electric component in which an electrode is soldered to a conductor layer, characterized in that polygonal bands are formed on the outer periphery of both sides of the part to be bonded with the adhesive, the height of which prevents the adhesive from flowing out. Small electrical parts. 2 Utility Model Registration A small electric component according to claim 1, characterized in that the band has a height such that a gap is created between the conductor layer of the substrate and the electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3542885U JPS61153372U (en) | 1985-03-14 | 1985-03-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3542885U JPS61153372U (en) | 1985-03-14 | 1985-03-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61153372U true JPS61153372U (en) | 1986-09-22 |
Family
ID=30539696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3542885U Pending JPS61153372U (en) | 1985-03-14 | 1985-03-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61153372U (en) |
-
1985
- 1985-03-14 JP JP3542885U patent/JPS61153372U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS61153372U (en) | ||
| JPH0349415Y2 (en) | ||
| JPS61104582U (en) | ||
| JPS61104583U (en) | ||
| JPH0383952U (en) | ||
| JPH02136301U (en) | ||
| JPS6186968U (en) | ||
| JPH046212Y2 (en) | ||
| JPS6186969U (en) | ||
| JPH0356175U (en) | ||
| JPH01116472U (en) | ||
| JPS58131638U (en) | Hybrid integrated circuit device | |
| JPS5920671U (en) | printed wiring board | |
| JPS61207077U (en) | ||
| JPS6389283U (en) | ||
| JPS6274361U (en) | ||
| JPS6181156U (en) | ||
| JPS61153373U (en) | ||
| JPS61156266U (en) | ||
| JPS6157564U (en) | ||
| JPH03102761U (en) | ||
| JPS6226048U (en) | ||
| JPH0292975U (en) | ||
| JPS6244465U (en) | ||
| JPS61151337U (en) |