JPS62189791A - Wiring board - Google Patents
Wiring boardInfo
- Publication number
- JPS62189791A JPS62189791A JP2989886A JP2989886A JPS62189791A JP S62189791 A JPS62189791 A JP S62189791A JP 2989886 A JP2989886 A JP 2989886A JP 2989886 A JP2989886 A JP 2989886A JP S62189791 A JPS62189791 A JP S62189791A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- plug
- recess
- socket
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は配線板に係シ、とくに接栓部を有する配線板に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wiring board, and particularly to a wiring board having a plug portion.
従来の接栓部を有するプリント配線板においては、たと
えば、第７図（、）（ｂ”）に示す如く基板１上に回路
ノ譬ターン２を設け、かつこの回路ノ４ターン２の端部
に接続した接栓部３を前記基板１の何れか一方の端部の
両面に設けたものが使用されていた（％公昭５５−１７
５１２号、第１図）。In a conventional printed wiring board having a plug part, for example, as shown in FIG. A plug 3 connected to the base plate 1 was provided on both sides of either end of the board 1 (1995-17).
512, Figure 1).
前記の従来技術においては、ソケットに接栓部を挿入し
て使用する場合、位置ずれが発生して接触面積が減少し
たシ、接触不良が発生することがあった。In the above-mentioned prior art, when the plug part is inserted into the socket and used, misalignment may occur, the contact area may be reduced, and poor contact may occur.
本発明の目的は前記従来の技術の問題点を解消し、接栓
部を有する配線板をソケットに挿入して使用する場合に
、位置ずれが発生して接触面積が減少したり、接触不良
が発生したシしないようにした配線板を提供することに
ある。An object of the present invention is to solve the above-mentioned problems of the conventional technology, and when a wiring board having a plug part is inserted into a socket and used, positional deviation occurs, the contact area decreases, and contact failure occurs. It is an object of the present invention to provide a wiring board which prevents the occurrence of blemishes.
前記の目的は配線板の一方面の少なくとも一つの端部に
接栓部を設け、かつこの接栓部を前記配線板の接栓部の
設けられた側面部まで延長して設け、かつこの接栓部の
延長部分に窪みを設けることによシ達成される。The above object is to provide a plug at at least one end of one side of the wiring board, extend this plug to a side surface of the wiring board where the plug is provided, and provide the plug. This is accomplished by providing a recess in the extension of the plug.
なお、本発明で云う窪みとは、半円状（−Ａ−）、くさ
び状（−＾−）など窪みを形成する形状であればよい。Note that the recess referred to in the present invention may be any shape that forms a recess, such as a semicircular shape (-A-) or a wedge shape (-^-).
又本発明が適用される配線板とは、プリント配線板、セ
ラミック配線板などである。Further, wiring boards to which the present invention is applied include printed wiring boards, ceramic wiring boards, and the like.
前記の如く構成した配線板においては、つぎに述べるよ
うな特徴を有する。The wiring board configured as described above has the following features.
（、） 接栓部をソケットに挿入して使用する場合、
接栓部に設けられた窪みとソケットに設けられた凸部と
がかん合して窪みおよび接合部の周面が互いに接触する
ので、位置ずれが発生することがなく、かつ接触面積が
減少したシ、接触不良が発生することがない。(,) When using the plug by inserting it into the socket,
Since the recess provided on the plug and the protrusion provided on the socket engage, and the recess and the circumferential surface of the joint come into contact with each other, misalignment does not occur and the contact area is reduced.・There will be no contact failure.
（ｂ） 接栓部を基板の一方の面に設け、かつ、この
接栓部を前記基板の接栓部に設けられた一方の面の側面
部まで延長して設けているので、配線板が小形化され、
かつ回路・やターン密度が向上可能になる。(b) Since the plug is provided on one side of the board and extends to the side surface of the one surface provided on the plug of the board, the wiring board is miniaturized,
In addition, the circuit/turn density can be improved.
以下、本発明の一実施例を示す第１図乃至第６図につい
て説明する。1 to 6 showing one embodiment of the present invention will be described below.
先づ第２図に示す如く、厚さ３５μｍの鋼箔４を有する
市販の銅張り積層板を使用し、当該業者の常法にしたが
ってドリル（図示せず）にて穴をあけてスルーホール５
を形成する。First, as shown in FIG. 2, a commercially available copper-clad laminate with a steel foil 4 having a thickness of 35 μm is used, and a through hole 5 is made by drilling a hole with a drill (not shown) according to the usual method of the manufacturer.
form.
しかるのち、前記鋼箔４の全面と、前記スルーホール５
とに化学鋼めっき用触媒（ジグレイ社製キャタポジソト
４４、Ｓｎ −Ｐｄ系触媒）を常法にしたがって施す。After that, the entire surface of the steel foil 4 and the through hole 5 are
A chemical steel plating catalyst (Cataposisoto 44, Sn--Pd catalyst, manufactured by Jigray Co., Ltd.) is applied in accordance with a conventional method.
（図示せず）
ついで、第３図に示す如く、市販のフィルム状感光性樹
脂（ドライフィルム、日立化成製フオテック８６５ Ａ
ＦＴ ５０．アクリル〜プリエステル系共重合体）を用
い、テンティング法によシエッチングレジスト６を形成
する。(Not shown) Next, as shown in FIG.
FT 50. The etching resist 6 is formed by a tenting method using acrylic-preester copolymer).
ついで、第４図に示す如く、露出している回路部分以外
の前記鋼箔４をＣｕＣＬｚ系溶液もしくはアルカリ系溶
液を使用してエツチングによシ溶解除去したのち、前記
エツチングレゾストロを苛性ソーダにより除去して回路
／４ターンに接続する接栓部３とランド部７を形成する
。Next, as shown in FIG. 4, the steel foil 4 other than the exposed circuit portion is dissolved and removed by etching using a CuCLz solution or an alkaline solution, and then the etching resotro is removed using caustic soda. Then, a plug portion 3 and a land portion 7 to be connected to the circuit/four turns are formed.
ついで、第５図に示す如く、エンドミルカッター（図示
せず）を使用した外形加工装置ルータ（図示せず）を使
用し、前記スルーホール５を任意の半円形状に加工して
半円形の窪み８を形成する。Next, as shown in FIG. 5, the through hole 5 is machined into an arbitrary semicircular shape using a router (not shown), which is an external shape processing device using an end mill cutter (not shown), to form a semicircular recess. form 8.
しかるのち、酸洗浄により前記回路部分の銅箔４の表面
を洗浄し、第６図（ａ）に示す如く、前記化学鋼めっき
液を使用した銅めっきを所定の厚み析出させて前記半円
形の窪み８に化学めりき層を形成し、これにより窪みを
有する接栓部９を得る。Thereafter, the surface of the copper foil 4 of the circuit portion is cleaned by acid cleaning, and as shown in FIG. 6(a), copper plating using the chemical steel plating solution is deposited to a predetermined thickness to form the semicircular shape. A chemically plated layer is formed in the depression 8, thereby obtaining a plug part 9 having a depression.
このようにして得た窪みを有する接栓部９を有するプリ
ント配線板をソケットｌＯに挿入すると、窪みを有する
接栓部９はこのソケッ） １０に形成された凸部１１に
かん合して、第６図（ｂ）に示す如く、ソケッ） １０
内の前記プリント配線板と対向する面に保持されたバネ
接点部１２とも接触する。 ４この結果、プリン
ト配線板の窪みを有する接栓部９はソケット１０に挿入
された場合、位置ずれを発生することなく、かつ接触面
積が減少したシ、接触不良が発生することがない。When the printed wiring board having the plug 9 with the recess thus obtained is inserted into the socket 10, the plug 9 with the recess engages with the protrusion 11 formed on the socket 10. As shown in Figure 6(b), the socket) 10
It also contacts the spring contact portion 12 held on the surface facing the printed wiring board inside. 4. As a result, when the plug portion 9 having the recess of the printed wiring board is inserted into the socket 10, there is no misalignment, and the contact area is reduced, so no contact failure occurs.
以上述べたる如く、本発明による配線板においては、・
つぎの（＆）乃至（Ｃ）に述゛べる効果を有する。As described above, in the wiring board according to the present invention,
It has the following effects (&) to (C).
（ａ） 接栓部をソケットに装着して使用した場合、
位置ずれが発生しないので、接触面積が減少したり、接
触不良が発生することがない。(a) When using the plug part attached to the socket,
Since positional displacement does not occur, the contact area does not decrease and contact failure does not occur.
（ｂ） 接栓部が基板の一方の面に設けられ、かつこ
の接栓部は前記基板の接栓部が設けられた一方の面の側
面部まで延ばされている。すなわち、前記基板の接栓部
が設け゛られている面を有効利用できるので、配線板を
小形化することができ、かつ回路ノ４ターンの密度を向
上させることができる−０ ・
（Ｃ） 配線板に端子部を設ける必要がないので、製
作が容易になる。(b) A plug portion is provided on one surface of the substrate, and the plug portion extends to a side surface of the one surface of the substrate on which the plug portion is provided. That is, since the surface of the board on which the plug portion is provided can be effectively used, the wiring board can be made smaller and the density of the four turns of the circuit can be improved. Since there is no need to provide a terminal portion on the wiring board, manufacturing becomes easier.
第１図（ａ）は本発明による配線板の断面図、第１図（
ｂ）は斜視図、第２図乃至第６図は本発明による配線板
の製造工程の１例を示す説明図、第７図（＆）は従来の
配線板を示す断面図、第７図（ｂ）は斜視図である。
ｌ・・・基板、２・・・回路・やターン、３・・・接栓
部、４・・・銅箔、５・・・スルーホール、６・・・エ
ツチングレジスト、７・・・ランド部、８・・・半円形
の窪み、９・・・窪みを有する接栓部、ｌＯ・・・ソケ
ット、１１・・・ソケットに形成された凸部、１２・・
・・９ネ接点部。
代理人 弁理士 秋 本 正 実
第１図 第２図
第５図FIG. 1(a) is a sectional view of a wiring board according to the present invention;
b) is a perspective view, FIGS. 2 to 6 are explanatory diagrams showing an example of the manufacturing process of a wiring board according to the present invention, FIG. 7(&) is a sectional view showing a conventional wiring board, and FIG. b) is a perspective view. l... Board, 2... Circuit/turn, 3... Connection part, 4... Copper foil, 5... Through hole, 6... Etching resist, 7... Land part , 8... Semicircular recess, 9... Connecting portion having a recess, lO... Socket, 11... Convex portion formed in the socket, 12...
・9-point contact part. Agent Patent Attorney Tadashi Akimoto Figure 1 Figure 2 Figure 5
Claims (1)
設け、かつこの接栓部を前記配線板の接栓部の設けられ
た側面部まで延長して設け、かつこの接栓部の延長部分
に窪みを設けていることを特徴とする配線板。1. A plug part is provided at at least one end of one side of the wiring board, and the plug part is extended to the side surface of the wiring board where the plug part is provided, and this plug part is provided. A wiring board characterized in that a recess is provided in an extended portion of the wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2989886A JPS62189791A (en) | 1986-02-15 | 1986-02-15 | Wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2989886A JPS62189791A (en) | 1986-02-15 | 1986-02-15 | Wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62189791A true JPS62189791A (en) | 1987-08-19 |
Family
ID=12288793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2989886A Pending JPS62189791A (en) | 1986-02-15 | 1986-02-15 | Wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62189791A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0316372U (en) * | 1989-06-29 | 1991-02-19 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5731867B2 (en) * | 1974-10-05 | 1982-07-07 | ||
| JPS60149195A (en) * | 1984-01-13 | 1985-08-06 | イビデン株式会社 | Method of producing printed circuit board |
-
1986
- 1986-02-15 JP JP2989886A patent/JPS62189791A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5731867B2 (en) * | 1974-10-05 | 1982-07-07 | ||
| JPS60149195A (en) * | 1984-01-13 | 1985-08-06 | イビデン株式会社 | Method of producing printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0316372U (en) * | 1989-06-29 | 1991-02-19 |
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