JPS6389673U - - Google Patents
Info
- Publication number
- JPS6389673U JPS6389673U JP1986184576U JP18457686U JPS6389673U JP S6389673 U JPS6389673 U JP S6389673U JP 1986184576 U JP1986184576 U JP 1986184576U JP 18457686 U JP18457686 U JP 18457686U JP S6389673 U JPS6389673 U JP S6389673U
- Authority
- JP
- Japan
- Prior art keywords
- spring piece
- board
- piece
- support piece
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Description
第1図はこの考案の一実施例を示す斜視図、第
2図はその最終組立て状態を示す断面図、第3図
はこの種の従来例を示す斜視図である。
図中、1は基板、2は銅箔パターン、5は半田
、6,7は透孔、8はばね片、9は支え片である
。尚、図中同一符号は同一又は相当部分を示す。
FIG. 1 is a perspective view showing an embodiment of this invention, FIG. 2 is a sectional view showing its final assembled state, and FIG. 3 is a perspective view showing a conventional example of this type. In the figure, 1 is a substrate, 2 is a copper foil pattern, 5 is solder, 6 and 7 are through holes, 8 is a spring piece, and 9 is a support piece. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
固定されるばね片を有するものにおいて、上記ば
ね片の中間に切込みによる曲げ起し支え片を設け
、この支え片を変形させてその先端を基板の透孔
に挿入するようにしてなる接続ばね片の取付構造
。 In a device that has a spring piece that is fixed to the copper foil pattern surface of the board with one end in a movable state, a bending support piece is provided in the middle of the spring piece, and this support piece is deformed and its tip is attached to the board. A mounting structure for a connecting spring piece that is inserted into a through hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986184576U JPS6389673U (en) | 1986-11-28 | 1986-11-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986184576U JPS6389673U (en) | 1986-11-28 | 1986-11-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6389673U true JPS6389673U (en) | 1988-06-10 |
Family
ID=31132386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986184576U Pending JPS6389673U (en) | 1986-11-28 | 1986-11-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6389673U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0297756U (en) * | 1989-01-19 | 1990-08-03 | ||
WO1996031919A1 (en) * | 1995-04-04 | 1996-10-10 | Thomas & Betts Corporation | Ground terminal |
-
1986
- 1986-11-28 JP JP1986184576U patent/JPS6389673U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0297756U (en) * | 1989-01-19 | 1990-08-03 | ||
WO1996031919A1 (en) * | 1995-04-04 | 1996-10-10 | Thomas & Betts Corporation | Ground terminal |