JPH0170352U - - Google Patents
Info
- Publication number
- JPH0170352U JPH0170352U JP1987165749U JP16574987U JPH0170352U JP H0170352 U JPH0170352 U JP H0170352U JP 1987165749 U JP1987165749 U JP 1987165749U JP 16574987 U JP16574987 U JP 16574987U JP H0170352 U JPH0170352 U JP H0170352U
- Authority
- JP
- Japan
- Prior art keywords
- positioning
- semiconductor device
- mounting board
- hole
- package body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Description
第１図はこの考案の一実施例による半導体装置
の展開斜視図、第２図はこの考案の他の実施例に
よる半導体装置の展開斜視図、第３図は従来の半
導体装置の展開斜視図である。
図において、１はパツケージ本体、２は位置決
め用貫通孔、３は外部導出導体、４は実装基板、
５は位置決め用ピン、６は半田付け手段である。
なお、図中同一符号は同一、又は相当部分を示す
。
FIG. 1 is an exploded perspective view of a semiconductor device according to one embodiment of this invention, FIG. 2 is an exploded perspective view of a semiconductor device according to another embodiment of this invention, and FIG. 3 is an exploded perspective view of a conventional semiconductor device. be. In the figure, 1 is the package body, 2 is a through hole for positioning, 3 is an external conductor, 4 is a mounting board,
5 is a positioning pin, and 6 is a soldering means.
Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
た半導体素子と前記半導体素子が実装される実装
基板上に前記位置決め用貫通孔に対する位置決め
用ピンを設けた実装基板とを備えたことを特徴と
する半導体装置。 (2) 位置決め用貫通孔はパツケージ本体の主表
面に対し垂直に貫通していることを特徴とする実
用新案登録請求の範囲第１項記載の半導体装置。 (3) 位置決め用ピンは実装基板表面に対し垂直
に設置していることを特徴とする実用新案登録請
求の範囲第１項記載の半導体装置。[Scope of Claim for Utility Model Registration] (1) A semiconductor element in which a positioning through hole is provided in a package body, and a mounting board on which a positioning pin for the positioning through hole is provided on a mounting board on which the semiconductor element is mounted. A semiconductor device characterized by comprising: (2) The semiconductor device according to claim 1, wherein the positioning through hole penetrates perpendicularly to the main surface of the package body. (3) The semiconductor device according to claim 1, wherein the positioning pins are installed perpendicularly to the surface of the mounting board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987165749U JPH0170352U (en) | 1987-10-29 | 1987-10-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987165749U JPH0170352U (en) | 1987-10-29 | 1987-10-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0170352U true JPH0170352U (en) | 1989-05-10 |
Family
ID=31452517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987165749U Pending JPH0170352U (en) | 1987-10-29 | 1987-10-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0170352U (en) |
-
1987
- 1987-10-29 JP JP1987165749U patent/JPH0170352U/ja active Pending