JPS63187370U - - Google Patents

Info

Publication number
JPS63187370U
JPS63187370U JP7764887U JP7764887U JPS63187370U JP S63187370 U JPS63187370 U JP S63187370U JP 7764887 U JP7764887 U JP 7764887U JP 7764887 U JP7764887 U JP 7764887U JP S63187370 U JPS63187370 U JP S63187370U
Authority
JP
Japan
Prior art keywords
printed circuit
lead wires
circuit boards
hold
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7764887U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7764887U priority Critical patent/JPS63187370U/ja
Publication of JPS63187370U publication Critical patent/JPS63187370U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図aおよびbは本考案の一実施例を示す側
面図、第2図および第3図は従来の電子回路モジ
ユールの例示する斜視図である。 1,1′……プリント基板、2……チツプ部品
、3,4……リード線、5……メインプリント基
板。
1A and 1B are side views showing an embodiment of the present invention, and FIGS. 2 and 3 are perspective views illustrating a conventional electronic circuit module. 1, 1'...Printed circuit board, 2...chip parts, 3, 4...lead wire, 5...main printed board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 両面の少くとも一方にチツプ部品を実装した複
数のプリント基板と、所定の間隔で積重ねて配置
した各前記プリント基板を保持すると共に相互間
の回路接続する複数のリード線と、該リード線の
うちの外部接続用のリード線を接続して保持する
メインプリント基板とを、備えていることを特徴
とする多層構成の電子回路モジユール。
A plurality of printed circuit boards with chip components mounted on at least one of both sides, a plurality of lead wires that hold the printed circuit boards stacked at predetermined intervals and connect circuits to each other, and among the lead wires, An electronic circuit module having a multilayer structure, comprising: a main printed circuit board for connecting and holding lead wires for external connections;
JP7764887U 1987-05-22 1987-05-22 Pending JPS63187370U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7764887U JPS63187370U (en) 1987-05-22 1987-05-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7764887U JPS63187370U (en) 1987-05-22 1987-05-22

Publications (1)

Publication Number Publication Date
JPS63187370U true JPS63187370U (en) 1988-11-30

Family

ID=30925851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7764887U Pending JPS63187370U (en) 1987-05-22 1987-05-22

Country Status (1)

Country Link
JP (1) JPS63187370U (en)

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