JPS61185639U - - Google Patents
Info
- Publication number
- JPS61185639U JPS61185639U JP7019485U JP7019485U JPS61185639U JP S61185639 U JPS61185639 U JP S61185639U JP 7019485 U JP7019485 U JP 7019485U JP 7019485 U JP7019485 U JP 7019485U JP S61185639 U JPS61185639 U JP S61185639U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- main circuit
- sub
- connect
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 1
Landscapes
- Automatic Cycles, And Cycles In General (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の一実施例を示した縦断面図、
第２図は第１図の−線断面図、第３図は本考
案の他の実施例の要部を示した正面図、第４図は
従来例を示した縦断面図である。
１０……主回路基板、１１……第１の副回路基
板、１２……第２の幅回路基板、１３，１４，１
５，２５，２６……電子部品、１６，１７……ク
リツプピン、１８……リード線、１９……ケース
。
FIG. 1 is a vertical sectional view showing an embodiment of the present invention;
FIG. 2 is a sectional view taken along the line -- in FIG. 1, FIG. 3 is a front view showing essential parts of another embodiment of the present invention, and FIG. 4 is a longitudinal sectional view showing a conventional example. 10... Main circuit board, 11... First sub circuit board, 12... Second width circuit board, 13, 14, 1
5, 25, 26...electronic parts, 16, 17...clip pin, 18...lead wire, 19...case.
Claims (1)
板と、電子部品を実装して付属回路を構成した少
なくとも１枚の副回路基板とを、前記副回路基板
の電子部品を前記主回路基板の電子部品と反対側
に向けた状態で重ねてケース内に収納し、前記主
回路基板と副回路基板とにクリツプピンを半田付
けして両基板を接続し、前記主回路基板と副回路
基板とにそれぞれ外部に導出されるリード線を半
田付けしたことを特徴とする車両用電装品ユニツ
ト。 A main circuit board on which electronic components are mounted to form a main circuit, and at least one sub-circuit board on which electronic parts are mounted to form an auxiliary circuit. Store the electronic components stacked in a case with the sides facing away from each other, solder clip pins to the main circuit board and the sub circuit board to connect both boards, and connect the main circuit board and the sub circuit board. An electrical component unit for a vehicle, characterized in that each lead wire led to the outside is soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7019485U JPH0246435Y2 (en) | 1985-05-13 | 1985-05-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7019485U JPH0246435Y2 (en) | 1985-05-13 | 1985-05-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61185639U true JPS61185639U (en) | 1986-11-19 |
| JPH0246435Y2 JPH0246435Y2 (en) | 1990-12-07 |
Family
ID=30606573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7019485U Expired JPH0246435Y2 (en) | 1985-05-13 | 1985-05-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0246435Y2 (en) |
-
1985
- 1985-05-13 JP JP7019485U patent/JPH0246435Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0246435Y2 (en) | 1990-12-07 |
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