JPS6228499U - - Google Patents

Info

Publication number
JPS6228499U
JPS6228499U JP12065285U JP12065285U JPS6228499U JP S6228499 U JPS6228499 U JP S6228499U JP 12065285 U JP12065285 U JP 12065285U JP 12065285 U JP12065285 U JP 12065285U JP S6228499 U JPS6228499 U JP S6228499U
Authority
JP
Japan
Prior art keywords
film
hybrid integrated
circuit board
integrated circuit
thick film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12065285U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12065285U priority Critical patent/JPS6228499U/ja
Publication of JPS6228499U publication Critical patent/JPS6228499U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Non-Adjustable Resistors (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例の断面図、第2図は
従来構造の断面図である。 1,11……回路基板、2,12……導体膜、
3,13……端子ピン、4,14……電子部品、
5,15……抵抗体膜。
FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional structure. 1, 11... circuit board, 2, 12... conductor film,
3, 13... terminal pin, 4, 14... electronic component,
5,15...Resistor film.

Claims (1)

【実用新案登録請求の範囲】 1 回路基板の表面に導体膜を形成し、ここに電
子部品を搭載して所要の回路を構成した厚膜混成
集積回路において、前記回路基板の裏面に電波吸
収体としての抵抗体膜を形成したことを特徴とす
る厚膜混成集積回路。 2 抵抗体膜を回路基板の略裏面全面に形成して
なる実用新案登録請求の範囲第1項記載の厚膜混
成集積回路。
[Claims for Utility Model Registration] 1. In a thick film hybrid integrated circuit in which a conductive film is formed on the surface of a circuit board and electronic components are mounted thereon to configure a required circuit, a radio wave absorber is provided on the back surface of the circuit board. A thick film hybrid integrated circuit characterized in that a resistor film is formed as a resistor film. 2. The thick film hybrid integrated circuit according to claim 1, wherein a resistor film is formed on substantially the entire back surface of a circuit board.
JP12065285U 1985-08-05 1985-08-05 Pending JPS6228499U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12065285U JPS6228499U (en) 1985-08-05 1985-08-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12065285U JPS6228499U (en) 1985-08-05 1985-08-05

Publications (1)

Publication Number Publication Date
JPS6228499U true JPS6228499U (en) 1987-02-20

Family

ID=31009170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12065285U Pending JPS6228499U (en) 1985-08-05 1985-08-05

Country Status (1)

Country Link
JP (1) JPS6228499U (en)

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