JPS6120073U

JPS6120073U - printed wiring body

Info

Publication number: JPS6120073U
Application number: JP2377584U
Authority: JP
Inventors: 竹宣奥瀬
Original assignee: 関西西本電気株式会社
Priority date: 1984-02-20
Filing date: 1984-02-20
Publication date: 1986-02-05

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図はプリント配線体の仮組付工程を説明する分解斜
視図、第２図は第１図に示すプリント配線体のデイツプ
半田処理を説明する正面図、第３図は第１図に示すプリ
ント配線体にシールド力バーを嵌着した高周波機器を示
す正面図である。第５図及び第６図は本考案の一実施例を示し、第５図は
プリント配線体の仮組付工程を説明する分解斜視図、第
６図は第５図に示すプリント配線体のデイツプ半田処理
を説明する正面図である。第７図は本考案の他の実施例を示すプリント配線体の正
面図である。１・・・・・・プリント基板、１′・・・・・・半田付
面、１３・・・・・・晃端線、１５・・・・・・板状突
起物。Fig. 1 is an exploded perspective view illustrating the temporary assembly process of the printed wiring body, Fig. 2 is a front view illustrating the dip soldering process of the printed wiring body shown in Fig. 1, and Fig. 3 is the same as that shown in Fig. 1. FIG. 3 is a front view showing a high frequency device in which a shielding force bar is fitted to a printed wiring body. 5 and 6 show an embodiment of the present invention, FIG. 5 is an exploded perspective view illustrating the temporary assembly process of the printed wiring body, and FIG. 6 is a dip view of the printed wiring body shown in FIG. It is a front view explaining soldering processing. FIG. 7 is a front view of a printed wiring body showing another embodiment of the present invention. 1... Printed circuit board, 1'... Soldering surface, 13... End wire, 15... Plate-shaped protrusion.

Claims

[Scope of utility model registration request]

A printed circuit board in which a plate-like protrusion such as a shield plate leg piece is provided on the soldering surface side of a printed circuit board, characterized in that the tip edge of the plate-like protrusion is inclined to facilitate solder breakage during soldering dip. wiring body.