JPH0523568U - Small module mounting device - Google Patents

Small module mounting device

Info

Publication number
JPH0523568U
JPH0523568U JP7189091U JP7189091U JPH0523568U JP H0523568 U JPH0523568 U JP H0523568U JP 7189091 U JP7189091 U JP 7189091U JP 7189091 U JP7189091 U JP 7189091U JP H0523568 U JPH0523568 U JP H0523568U
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
module
small module
mounting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7189091U
Other languages
Japanese (ja)
Inventor
敏治 佐伯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7189091U priority Critical patent/JPH0523568U/en
Publication of JPH0523568U publication Critical patent/JPH0523568U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

(57)【要約】 【目的】 モジュール基板の両面への部品実装、印刷配
線板の部品実装高さを低くする。 【構成】 印刷配線板1にモジュール基板より小さい穴
4を設け、リード端子3にて印刷配線板1に半田付けす
る。 【効果】 モジュール基板2の両面に部品7を実装する
ことができ、かつ、印刷配線板1の部品実装高さを低く
する。
(57) [Summary] [Purpose] To reduce the component mounting height on both sides of the module board and the printed wiring board. [Structure] The printed wiring board 1 is provided with holes 4 smaller than the module substrate, and the lead terminals 3 are soldered to the printed wiring board 1. [Effect] The component 7 can be mounted on both surfaces of the module substrate 2, and the component mounting height of the printed wiring board 1 can be reduced.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

この考案は、電子機器に実装される小型モジュールの実装方法に関するもので ある。 The present invention relates to a mounting method for a small module mounted on an electronic device.

【0002】[0002]

【従来の技術】[Prior Art]

図3は従来の小型モジュールの実装方法を示す。図において1はカードバスケ ットに搭載される印刷配線板、2はモジュール基板、5は基板に接続されるピン 端子、6はスルーホール、7は部品である。 FIG. 3 shows a conventional mounting method for a small module. In the figure, 1 is a printed wiring board mounted on a card basket, 2 is a module substrate, 5 is a pin terminal connected to the substrate, 6 is a through hole, and 7 is a component.

【0003】 従来のモジュールは上記のように構成され、モジュール基板2のスルーホール 6にピン端子5を半田付、次に印刷配線板1のスルーホール6にピン端子5を半 田付することで、モジュール基板2の印刷配線板1への実装が完了する。The conventional module is configured as described above, and by soldering the pin terminals 5 to the through holes 6 of the module substrate 2 and then soldering the pin terminals 5 to the through holes 6 of the printed wiring board 1, Mounting of the module substrate 2 on the printed wiring board 1 is completed.

【0004】[0004]

【考案が解決しようとする課題】[Problems to be solved by the device]

上記のような従来の実装方法では、印刷配線板1に対する面に実装した部品7 の交換、調整ができない。また、印刷配線板1の部品実装高さが高くなり、カー ドバスケットなどに印刷配線板1を実装する場合、専有空間が増えるなどの問題 点があった。 With the conventional mounting method as described above, the component 7 mounted on the surface of the printed wiring board 1 cannot be replaced or adjusted. Further, the mounting height of the printed wiring board 1 becomes high, and when the printed wiring board 1 is mounted on a card basket or the like, there is a problem that an occupied space increases.

【0005】 この考案は上記のような問題点を解消するためになされたもので、モジュール 基板2の両面に部品実装できるとともに、部品実装高さが低くなる小型モジュー ルの実装方法を提供することを目的とする。The present invention has been made in order to solve the above problems, and provides a method for mounting a small module in which components can be mounted on both sides of the module substrate 2 and the mounting height of the components is low. With the goal.

【0006】[0006]

【課題を解決するための手段】[Means for Solving the Problems]

この考案に係る小型モジュールの実装方法においては、印刷配線板に小型モジ ュールより小さい穴を設けたものである。 In the mounting method of the small module according to the present invention, the printed wiring board is provided with a hole smaller than the small module.

【0007】[0007]

【作用】[Action]

上記のように構成された印刷配線板にモジュール基板を実装すると、印刷配線 板に設けた穴よりモジュール基板の部品の交換、調整が可能となる。 When the module board is mounted on the printed wiring board configured as described above, the parts of the module board can be exchanged and adjusted through the holes provided in the printed wiring board.

【0008】[0008]

【実施例】【Example】

実施例1. 図1はこの考案の一実施例を示す図であり、図1において1〜2は上記従来の 実装方法と全く同一のものである。3は基板に接続されるリード端子、4は印刷 配線板に設けた小型モジュールより小さい穴である。 Example 1. FIG. 1 is a diagram showing an embodiment of the present invention. In FIG. 1, 1-2 are exactly the same as the conventional mounting method. Reference numeral 3 is a lead terminal connected to the substrate, and 4 is a hole smaller than a small module provided on the printed wiring board.

【0009】 前記のように構成された小型モジュール実装方法においてはモジュール基板2 の印刷配線板1に対する面に取付けられた部品7の交換、調整が穴4より行なえ る。また、印刷配線板1の穴4にモジュール基板2の部品7を落し込むことによ り部品実装高さを低くすることになる。In the small module mounting method configured as described above, the component 7 mounted on the surface of the module substrate 2 with respect to the printed wiring board 1 can be replaced and adjusted through the hole 4. Further, by dropping the component 7 of the module substrate 2 into the hole 4 of the printed wiring board 1, the component mounting height is lowered.

【0010】[0010]

【考案の効果】[Effect of the device]

以上のように、この考案によれば印刷配線板に小型モジュールより小さい穴を 設けたことにより、小型モジュール基板の両面に部品実装ができ、また、印刷配 線板の部品実装高さを低くする効果がある。 As described above, according to the present invention, by providing the printed wiring board with holes smaller than the small module, components can be mounted on both sides of the small module board, and the mounting height of the printed wiring board can be reduced. effective.

【図面の簡単な説明】[Brief description of drawings]

【図1】この考案の実施例1を示す図である。FIG. 1 is a diagram showing a first embodiment of the present invention.

【図2】この考案の実施例1を示す断面図である。FIG. 2 is a sectional view showing a first embodiment of the present invention.

【図3】従来の小型モジュール実装方法を示す図であ
る。
FIG. 3 is a diagram showing a conventional small module mounting method.

【図4】従来の小型モジュール実装方法を示す図であ
る。
FIG. 4 is a diagram showing a conventional small module mounting method.

【符号の説明】[Explanation of symbols]

1 印刷配線板 2 モジュール基板 3 リード端子 4 穴 5 ピン端子 6 スルーホール 7 部品 1 Printed wiring board 2 Module board 3 Lead terminal 4 hole 5 Pin terminal 6 Through hole 7 Parts

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 印刷配線板に実装する小型モジュールの
実装方法において、印刷配線板に小型モジュールより小
さい穴を設けたことを特徴とする小型モジュール実装装
置。
1. A mounting method for a small module to be mounted on a printed wiring board, wherein a hole smaller than the small module is provided in the printed wiring board.
JP7189091U 1991-09-09 1991-09-09 Small module mounting device Pending JPH0523568U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7189091U JPH0523568U (en) 1991-09-09 1991-09-09 Small module mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7189091U JPH0523568U (en) 1991-09-09 1991-09-09 Small module mounting device

Publications (1)

Publication Number Publication Date
JPH0523568U true JPH0523568U (en) 1993-03-26

Family

ID=13473588

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7189091U Pending JPH0523568U (en) 1991-09-09 1991-09-09 Small module mounting device

Country Status (1)

Country Link
JP (1) JPH0523568U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015151292A1 (en) * 2014-04-04 2017-04-13 三菱電機株式会社 Printed wiring board unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015151292A1 (en) * 2014-04-04 2017-04-13 三菱電機株式会社 Printed wiring board unit

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