JPS5680196A - Method of forming electrode for printed circuit board - Google Patents

Method of forming electrode for printed circuit board

Info

Publication number
JPS5680196A
JPS5680196A JP15681779A JP15681779A JPS5680196A JP S5680196 A JPS5680196 A JP S5680196A JP 15681779 A JP15681779 A JP 15681779A JP 15681779 A JP15681779 A JP 15681779A JP S5680196 A JPS5680196 A JP S5680196A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
forming electrode
electrode
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15681779A
Other languages
Japanese (ja)
Inventor
Toshitada Nezu
Takatsugu Takenaka
Jiyuujirou Obata
Yoshio Oosawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15681779A priority Critical patent/JPS5680196A/en
Publication of JPS5680196A publication Critical patent/JPS5680196A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP15681779A 1979-12-05 1979-12-05 Method of forming electrode for printed circuit board Pending JPS5680196A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15681779A JPS5680196A (en) 1979-12-05 1979-12-05 Method of forming electrode for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15681779A JPS5680196A (en) 1979-12-05 1979-12-05 Method of forming electrode for printed circuit board

Publications (1)

Publication Number Publication Date
JPS5680196A true JPS5680196A (en) 1981-07-01

Family

ID=15635977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15681779A Pending JPS5680196A (en) 1979-12-05 1979-12-05 Method of forming electrode for printed circuit board

Country Status (1)

Country Link
JP (1) JPS5680196A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57163759U (en) * 1981-04-09 1982-10-15
JPS5950597A (en) * 1982-09-16 1984-03-23 松下電器産業株式会社 Method of mounting electronic circuit part
JPS5961545U (en) * 1982-10-19 1984-04-23 株式会社デンソー integrated circuit device
JPS59144194A (en) * 1983-02-07 1984-08-18 株式会社日立製作所 Terminal for soldering ceramic substrate
JPS6453493A (en) * 1987-08-24 1989-03-01 Ibiden Co Ltd Wiring board for surface packaging
JPH04354398A (en) * 1991-05-31 1992-12-08 Internatl Business Mach Corp <Ibm> Wiring board and manufacture thereof
JP2007227731A (en) * 2006-02-24 2007-09-06 Matsushita Electric Ind Co Ltd Printed circuit board and electronic instrument employing it
WO2021199475A1 (en) * 2020-03-31 2021-10-07 株式会社村田製作所 Module substrate, high-frequency module, and communication device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57163759U (en) * 1981-04-09 1982-10-15
JPS629755Y2 (en) * 1981-04-09 1987-03-06
JPS5950597A (en) * 1982-09-16 1984-03-23 松下電器産業株式会社 Method of mounting electronic circuit part
JPS6361796B2 (en) * 1982-09-16 1988-11-30
JPS5961545U (en) * 1982-10-19 1984-04-23 株式会社デンソー integrated circuit device
JPS59144194A (en) * 1983-02-07 1984-08-18 株式会社日立製作所 Terminal for soldering ceramic substrate
JPS6453493A (en) * 1987-08-24 1989-03-01 Ibiden Co Ltd Wiring board for surface packaging
JPH04354398A (en) * 1991-05-31 1992-12-08 Internatl Business Mach Corp <Ibm> Wiring board and manufacture thereof
JP2007227731A (en) * 2006-02-24 2007-09-06 Matsushita Electric Ind Co Ltd Printed circuit board and electronic instrument employing it
WO2021199475A1 (en) * 2020-03-31 2021-10-07 株式会社村田製作所 Module substrate, high-frequency module, and communication device

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