JPS5552248A - Manufacture of electronic device - Google Patents

Manufacture of electronic device

Info

Publication number
JPS5552248A
JPS5552248A JP12557078A JP12557078A JPS5552248A JP S5552248 A JPS5552248 A JP S5552248A JP 12557078 A JP12557078 A JP 12557078A JP 12557078 A JP12557078 A JP 12557078A JP S5552248 A JPS5552248 A JP S5552248A
Authority
JP
Japan
Prior art keywords
surface wave
paraffin
vacant space
layer
elastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12557078A
Other languages
Japanese (ja)
Inventor
Katsuaki Yanagisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12557078A priority Critical patent/JPS5552248A/en
Publication of JPS5552248A publication Critical patent/JPS5552248A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To provide a method of manufacturing a module comprising an elastic- surface wave element and a semiconductor integrated circuit element in which the formation of a vacant space on the surface wave element is made available with ease and the reliability thereof is improved by using two different insulating resins to cover the surface wave element.
CONSTITUTION: An elastic-surface wave filter 13 consisting of a piezo-electric substrate 11 and a pair of toothed electrodes 12 mounted thereon, and a peripheral circuit semiconductor element 14 are mounted on a lead frame 15. Then only the semiconductor element 14 is covered with and enclosed in epoxy or silicone resin 16 having excellent airtight and wet-proof properties. Paraffin is applied to the input and output elecrodes and the surface wave propagating route of the filter 13 to form a paraffin coating layer 17, which is then overlaid by a layer 18 consisting of a porous resin such as phenol, followed by heating. As a result, the paraffin 17 is molten into the phenol resin 18 to leave a vacant space 19 in the form of layer. Thus the formation of the vacant space as well as the protection of the resulting module can be obtained in a very simple manner.
COPYRIGHT: (C)1980,JPO&Japio
JP12557078A 1978-10-11 1978-10-11 Manufacture of electronic device Pending JPS5552248A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12557078A JPS5552248A (en) 1978-10-11 1978-10-11 Manufacture of electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12557078A JPS5552248A (en) 1978-10-11 1978-10-11 Manufacture of electronic device

Publications (1)

Publication Number Publication Date
JPS5552248A true JPS5552248A (en) 1980-04-16

Family

ID=14913450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12557078A Pending JPS5552248A (en) 1978-10-11 1978-10-11 Manufacture of electronic device

Country Status (1)

Country Link
JP (1) JPS5552248A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6010649A (en) * 1983-06-29 1985-01-19 Nec Corp Hybrid integrated circuit device
US6888259B2 (en) * 2001-06-07 2005-05-03 Denso Corporation Potted hybrid integrated circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6010649A (en) * 1983-06-29 1985-01-19 Nec Corp Hybrid integrated circuit device
US6888259B2 (en) * 2001-06-07 2005-05-03 Denso Corporation Potted hybrid integrated circuit

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