JPS5552248A - Manufacture of electronic device - Google Patents
Manufacture of electronic deviceInfo
- Publication number
- JPS5552248A JPS5552248A JP12557078A JP12557078A JPS5552248A JP S5552248 A JPS5552248 A JP S5552248A JP 12557078 A JP12557078 A JP 12557078A JP 12557078 A JP12557078 A JP 12557078A JP S5552248 A JPS5552248 A JP S5552248A
- Authority
- JP
- Japan
- Prior art keywords
- surface wave
- paraffin
- vacant space
- layer
- elastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To provide a method of manufacturing a module comprising an elastic- surface wave element and a semiconductor integrated circuit element in which the formation of a vacant space on the surface wave element is made available with ease and the reliability thereof is improved by using two different insulating resins to cover the surface wave element.
CONSTITUTION: An elastic-surface wave filter 13 consisting of a piezo-electric substrate 11 and a pair of toothed electrodes 12 mounted thereon, and a peripheral circuit semiconductor element 14 are mounted on a lead frame 15. Then only the semiconductor element 14 is covered with and enclosed in epoxy or silicone resin 16 having excellent airtight and wet-proof properties. Paraffin is applied to the input and output elecrodes and the surface wave propagating route of the filter 13 to form a paraffin coating layer 17, which is then overlaid by a layer 18 consisting of a porous resin such as phenol, followed by heating. As a result, the paraffin 17 is molten into the phenol resin 18 to leave a vacant space 19 in the form of layer. Thus the formation of the vacant space as well as the protection of the resulting module can be obtained in a very simple manner.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12557078A JPS5552248A (en) | 1978-10-11 | 1978-10-11 | Manufacture of electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12557078A JPS5552248A (en) | 1978-10-11 | 1978-10-11 | Manufacture of electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5552248A true JPS5552248A (en) | 1980-04-16 |
Family
ID=14913450
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12557078A Pending JPS5552248A (en) | 1978-10-11 | 1978-10-11 | Manufacture of electronic device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5552248A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6010649A (en) * | 1983-06-29 | 1985-01-19 | Nec Corp | Hybrid integrated circuit device |
US6888259B2 (en) * | 2001-06-07 | 2005-05-03 | Denso Corporation | Potted hybrid integrated circuit |
-
1978
- 1978-10-11 JP JP12557078A patent/JPS5552248A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6010649A (en) * | 1983-06-29 | 1985-01-19 | Nec Corp | Hybrid integrated circuit device |
US6888259B2 (en) * | 2001-06-07 | 2005-05-03 | Denso Corporation | Potted hybrid integrated circuit |
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