JPS51140583A - Tip for semiconductor i.c. circuits - Google Patents

Tip for semiconductor i.c. circuits

Info

Publication number
JPS51140583A
JPS51140583A JP6578475A JP6578475A JPS51140583A JP S51140583 A JPS51140583 A JP S51140583A JP 6578475 A JP6578475 A JP 6578475A JP 6578475 A JP6578475 A JP 6578475A JP S51140583 A JPS51140583 A JP S51140583A
Authority
JP
Japan
Prior art keywords
semiconductor
tip
circuits
speediness
lowering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6578475A
Other languages
Japanese (ja)
Other versions
JPS5944781B2 (en
Inventor
Hisao Kanai
Hiroyuki Matsuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP6578475A priority Critical patent/JPS5944781B2/en
Publication of JPS51140583A publication Critical patent/JPS51140583A/en
Publication of JPS5944781B2 publication Critical patent/JPS5944781B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE: To increase speediness and reliability of semiconductor device by lowering the heat resistance of semiconductor tip.
COPYRIGHT: (C)1976,JPO&Japio
JP6578475A 1975-05-30 1975-05-30 semiconductor integrated circuit chip Expired JPS5944781B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6578475A JPS5944781B2 (en) 1975-05-30 1975-05-30 semiconductor integrated circuit chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6578475A JPS5944781B2 (en) 1975-05-30 1975-05-30 semiconductor integrated circuit chip

Publications (2)

Publication Number Publication Date
JPS51140583A true JPS51140583A (en) 1976-12-03
JPS5944781B2 JPS5944781B2 (en) 1984-11-01

Family

ID=13296995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6578475A Expired JPS5944781B2 (en) 1975-05-30 1975-05-30 semiconductor integrated circuit chip

Country Status (1)

Country Link
JP (1) JPS5944781B2 (en)

Also Published As

Publication number Publication date
JPS5944781B2 (en) 1984-11-01

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