JPS5330283A - Production of substrates for semiconductor integrated circuits - Google Patents
Production of substrates for semiconductor integrated circuitsInfo
- Publication number
- JPS5330283A JPS5330283A JP10365276A JP10365276A JPS5330283A JP S5330283 A JPS5330283 A JP S5330283A JP 10365276 A JP10365276 A JP 10365276A JP 10365276 A JP10365276 A JP 10365276A JP S5330283 A JPS5330283 A JP S5330283A
- Authority
- JP
- Japan
- Prior art keywords
- substrates
- production
- integrated circuits
- semiconductor integrated
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To obtain a substrate for ICs of high heat resistance free from any distortion in the substrate by providing a SiO2 film on at least once of the bonding surfaces of the substrate with borosilicate glass containing B2O3.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10365276A JPS5330283A (en) | 1976-09-01 | 1976-09-01 | Production of substrates for semiconductor integrated circuits |
DE19772738614 DE2738614A1 (en) | 1976-09-01 | 1977-08-26 | Integrated circuit module - produced by glass film bonding one substrate for silicon island domains to another as carrier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10365276A JPS5330283A (en) | 1976-09-01 | 1976-09-01 | Production of substrates for semiconductor integrated circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5330283A true JPS5330283A (en) | 1978-03-22 |
Family
ID=14359700
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10365276A Pending JPS5330283A (en) | 1976-09-01 | 1976-09-01 | Production of substrates for semiconductor integrated circuits |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5330283A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56146249A (en) * | 1980-04-14 | 1981-11-13 | Fujitsu Ltd | Semiconductor device |
JPS60106165A (en) * | 1983-11-15 | 1985-06-11 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS6159852A (en) * | 1984-08-31 | 1986-03-27 | Toshiba Corp | Manufacture of semiconductor device |
JPS6276646A (en) * | 1985-09-30 | 1987-04-08 | Toshiba Corp | Manufacture of semiconductor device |
JPS6337652A (en) * | 1986-07-31 | 1988-02-18 | Sumitomo Metal Mining Co Ltd | Adhesion method of substrate for semiconductor device |
-
1976
- 1976-09-01 JP JP10365276A patent/JPS5330283A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56146249A (en) * | 1980-04-14 | 1981-11-13 | Fujitsu Ltd | Semiconductor device |
JPS60106165A (en) * | 1983-11-15 | 1985-06-11 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS6159852A (en) * | 1984-08-31 | 1986-03-27 | Toshiba Corp | Manufacture of semiconductor device |
JPS6276646A (en) * | 1985-09-30 | 1987-04-08 | Toshiba Corp | Manufacture of semiconductor device |
JPS6337652A (en) * | 1986-07-31 | 1988-02-18 | Sumitomo Metal Mining Co Ltd | Adhesion method of substrate for semiconductor device |
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