JPS5330283A - Production of substrates for semiconductor integrated circuits - Google Patents

Production of substrates for semiconductor integrated circuits

Info

Publication number
JPS5330283A
JPS5330283A JP10365276A JP10365276A JPS5330283A JP S5330283 A JPS5330283 A JP S5330283A JP 10365276 A JP10365276 A JP 10365276A JP 10365276 A JP10365276 A JP 10365276A JP S5330283 A JPS5330283 A JP S5330283A
Authority
JP
Japan
Prior art keywords
substrates
production
integrated circuits
semiconductor integrated
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10365276A
Other languages
Japanese (ja)
Inventor
Satoru Ogiwara
Takaya Suzuki
Tatsuya Kamei
Takuzo Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10365276A priority Critical patent/JPS5330283A/en
Priority to DE19772738614 priority patent/DE2738614A1/en
Publication of JPS5330283A publication Critical patent/JPS5330283A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To obtain a substrate for ICs of high heat resistance free from any distortion in the substrate by providing a SiO2 film on at least once of the bonding surfaces of the substrate with borosilicate glass containing B2O3.
COPYRIGHT: (C)1978,JPO&Japio
JP10365276A 1976-09-01 1976-09-01 Production of substrates for semiconductor integrated circuits Pending JPS5330283A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP10365276A JPS5330283A (en) 1976-09-01 1976-09-01 Production of substrates for semiconductor integrated circuits
DE19772738614 DE2738614A1 (en) 1976-09-01 1977-08-26 Integrated circuit module - produced by glass film bonding one substrate for silicon island domains to another as carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10365276A JPS5330283A (en) 1976-09-01 1976-09-01 Production of substrates for semiconductor integrated circuits

Publications (1)

Publication Number Publication Date
JPS5330283A true JPS5330283A (en) 1978-03-22

Family

ID=14359700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10365276A Pending JPS5330283A (en) 1976-09-01 1976-09-01 Production of substrates for semiconductor integrated circuits

Country Status (1)

Country Link
JP (1) JPS5330283A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56146249A (en) * 1980-04-14 1981-11-13 Fujitsu Ltd Semiconductor device
JPS60106165A (en) * 1983-11-15 1985-06-11 Fujitsu Ltd Manufacture of semiconductor device
JPS6159852A (en) * 1984-08-31 1986-03-27 Toshiba Corp Manufacture of semiconductor device
JPS6276646A (en) * 1985-09-30 1987-04-08 Toshiba Corp Manufacture of semiconductor device
JPS6337652A (en) * 1986-07-31 1988-02-18 Sumitomo Metal Mining Co Ltd Adhesion method of substrate for semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56146249A (en) * 1980-04-14 1981-11-13 Fujitsu Ltd Semiconductor device
JPS60106165A (en) * 1983-11-15 1985-06-11 Fujitsu Ltd Manufacture of semiconductor device
JPS6159852A (en) * 1984-08-31 1986-03-27 Toshiba Corp Manufacture of semiconductor device
JPS6276646A (en) * 1985-09-30 1987-04-08 Toshiba Corp Manufacture of semiconductor device
JPS6337652A (en) * 1986-07-31 1988-02-18 Sumitomo Metal Mining Co Ltd Adhesion method of substrate for semiconductor device

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