JPS54162463A - Semiconductor device and its manufacture - Google Patents
Semiconductor device and its manufactureInfo
- Publication number
- JPS54162463A JPS54162463A JP7170878A JP7170878A JPS54162463A JP S54162463 A JPS54162463 A JP S54162463A JP 7170878 A JP7170878 A JP 7170878A JP 7170878 A JP7170878 A JP 7170878A JP S54162463 A JPS54162463 A JP S54162463A
- Authority
- JP
- Japan
- Prior art keywords
- film
- flat
- mask
- layer
- bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Abstract
PURPOSE: To prevent the occurrence of cracks for the insulating film, by making flat the surface of the bump metal welded to the leads and making uniform the stress with broader contact area.
CONSTITUTION: The Al wiring 53 is formed on the SiO2 film 52 of the Si substrate 51, the SiO2 54 is etched and opened 56 with the resist mask 55 and the Al layer 57 having the same thickness as the film 54 is evaporated. The mask 55 is removed and the double layered film 59 of Cr-Cu is evaporated on the flat surface in which the Al layer 58 is incorporated. When the Au bump electrode 61 is made with the resist mask 60 having greater window than the layer 58 by taking the film 59 as the plating electrode, since no step difference at the window open part is present, the bump top surface is flat. The resist 60 is removed, the film 59 is etched with the resist mask 62, the mask 62 is made flat to produce chips. Further, the bump metal 61 and the leads on the film carrier are thermally pressed. At this time, the stress is exerted uniformly on the surface of the electrode 61, it is buffered with the layers 58 and 53, and the reliability of the device can greatly be increased without damaging the insulation film.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7170878A JPS54162463A (en) | 1978-06-13 | 1978-06-13 | Semiconductor device and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7170878A JPS54162463A (en) | 1978-06-13 | 1978-06-13 | Semiconductor device and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54162463A true JPS54162463A (en) | 1979-12-24 |
Family
ID=13468299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7170878A Pending JPS54162463A (en) | 1978-06-13 | 1978-06-13 | Semiconductor device and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54162463A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0551723U (en) * | 1991-12-11 | 1993-07-09 | 凸版印刷株式会社 | Blank board for bag-in-box outer box |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52155054A (en) * | 1976-06-18 | 1977-12-23 | Matsushita Electric Ind Co Ltd | Production of semiconductor device |
| JPS5343474A (en) * | 1976-10-01 | 1978-04-19 | Seiko Epson Corp | Semiconductor integrated circuit |
-
1978
- 1978-06-13 JP JP7170878A patent/JPS54162463A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52155054A (en) * | 1976-06-18 | 1977-12-23 | Matsushita Electric Ind Co Ltd | Production of semiconductor device |
| JPS5343474A (en) * | 1976-10-01 | 1978-04-19 | Seiko Epson Corp | Semiconductor integrated circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0551723U (en) * | 1991-12-11 | 1993-07-09 | 凸版印刷株式会社 | Blank board for bag-in-box outer box |
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