JPS57145340A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS57145340A
JPS57145340A JP3050081A JP3050081A JPS57145340A JP S57145340 A JPS57145340 A JP S57145340A JP 3050081 A JP3050081 A JP 3050081A JP 3050081 A JP3050081 A JP 3050081A JP S57145340 A JPS57145340 A JP S57145340A
Authority
JP
Japan
Prior art keywords
film
wiring
contact hole
metal
formed over
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3050081A
Other languages
Japanese (ja)
Inventor
Katsuhiko Hieda
Ryozo Nakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP3050081A priority Critical patent/JPS57145340A/en
Publication of JPS57145340A publication Critical patent/JPS57145340A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/7684—Smoothing; Planarisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To enable the formation of metal wiring with high yield and reliability, by leaving a film on a contact hole part and later forming a film treated with patterning thereon. CONSTITUTION:After forming an Si oxide film 32 as a interlayer insulating film on an Si substrate 31, a contact hole 33 is opened. Next, for example, an Al film 34 as wiring metal is formed over the entire surface, and then a photoresist film 35 is so formed over the entire surface that the surface of the film becomes flat as a whole. Subsequently, entire etching is done to the film 35 and 34 by the etching mthod with the same speed for the film 35 and 34 to leave the Al film 36 on a contact hole. Thereafter, the resist is removed and metal e.g. Al is evaporated to form an Al wiring layer 37 by a photoetching technique. Thus, the stepwise difference is reduced flat to prevent the cutting of Al wiring.
JP3050081A 1981-03-05 1981-03-05 Manufacture of semiconductor device Pending JPS57145340A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3050081A JPS57145340A (en) 1981-03-05 1981-03-05 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3050081A JPS57145340A (en) 1981-03-05 1981-03-05 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS57145340A true JPS57145340A (en) 1982-09-08

Family

ID=12305532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3050081A Pending JPS57145340A (en) 1981-03-05 1981-03-05 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57145340A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189656A (en) * 1983-04-13 1984-10-27 Matsushita Electronics Corp Manufacture of semiconductor device
JPS60142542A (en) * 1983-12-29 1985-07-27 Fujitsu Ltd Manufacture of semiconductor device
JPS63182838A (en) * 1987-01-26 1988-07-28 Seiko Instr & Electronics Ltd Manufacture of semiconductor device
JPS63213944A (en) * 1987-03-03 1988-09-06 Seiko Instr & Electronics Ltd Manufacture of semiconductor device
US5187119A (en) * 1991-02-11 1993-02-16 The Boeing Company Multichip module and integrated circuit substrates having planarized patterned surfaces
CN100452383C (en) * 2004-01-17 2009-01-14 上海华虹Nec电子有限公司 Semiconductor device with aluminium distribution line

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5249767A (en) * 1975-10-20 1977-04-21 Hitachi Ltd Semiconductor device
JPS57107053A (en) * 1980-12-25 1982-07-03 Fujitsu Ltd Manufacture of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5249767A (en) * 1975-10-20 1977-04-21 Hitachi Ltd Semiconductor device
JPS57107053A (en) * 1980-12-25 1982-07-03 Fujitsu Ltd Manufacture of semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189656A (en) * 1983-04-13 1984-10-27 Matsushita Electronics Corp Manufacture of semiconductor device
JPS60142542A (en) * 1983-12-29 1985-07-27 Fujitsu Ltd Manufacture of semiconductor device
JPS63182838A (en) * 1987-01-26 1988-07-28 Seiko Instr & Electronics Ltd Manufacture of semiconductor device
JPS63213944A (en) * 1987-03-03 1988-09-06 Seiko Instr & Electronics Ltd Manufacture of semiconductor device
US5187119A (en) * 1991-02-11 1993-02-16 The Boeing Company Multichip module and integrated circuit substrates having planarized patterned surfaces
CN100452383C (en) * 2004-01-17 2009-01-14 上海华虹Nec电子有限公司 Semiconductor device with aluminium distribution line

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