JPS5664481A - Led device - Google Patents

Led device

Info

Publication number
JPS5664481A
JPS5664481A JP14030579A JP14030579A JPS5664481A JP S5664481 A JPS5664481 A JP S5664481A JP 14030579 A JP14030579 A JP 14030579A JP 14030579 A JP14030579 A JP 14030579A JP S5664481 A JPS5664481 A JP S5664481A
Authority
JP
Japan
Prior art keywords
base sections
pellets
sections
height
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14030579A
Other languages
Japanese (ja)
Inventor
Tatsuro Beppu
Osamu Ichikawa
Tetsuo Sadamasa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP14030579A priority Critical patent/JPS5664481A/en
Publication of JPS5664481A publication Critical patent/JPS5664481A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
    • H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE:To prevent the pressing-out of conductive resin for fastening LED pellets by a method wherein base sections to which the LED pellets are disposed are previously protruded arranging the height of the base sections when the pellets are each disposed to a plurality of conductive base sections mounted onto an insulating substrate. CONSTITUTION:A plurality of a pair of the first and second conductive base sections 12, 13, which are mutually separated, using copper plates, etc. are formed on a surface layer section of an insulating substrate 11 consisting of alumina porcelain, etc. The height of the base sections 12 loading LED pellets 1 formed by GaP, etc. is previously made higher than all projecting sections made up to the substrate 11, arranging the height, and electrodes 2 at the one crystal sides 1a of the pellets 1 are fastened to the base sections 12 by using adhesives 14 in epoxy resin to which silver powder is contained. Thus, the adhesives 14 is not pressed out because there is step difference between the base sections 12 and the substrate 11. And electrodes 3 at the upper sections of the pellets 1 are bonded to other base sections 13 by using wires 15.
JP14030579A 1979-10-30 1979-10-30 Led device Pending JPS5664481A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14030579A JPS5664481A (en) 1979-10-30 1979-10-30 Led device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14030579A JPS5664481A (en) 1979-10-30 1979-10-30 Led device

Publications (1)

Publication Number Publication Date
JPS5664481A true JPS5664481A (en) 1981-06-01

Family

ID=15265690

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14030579A Pending JPS5664481A (en) 1979-10-30 1979-10-30 Led device

Country Status (1)

Country Link
JP (1) JPS5664481A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0311782A (en) * 1989-06-09 1991-01-21 Matsushita Electric Ind Co Ltd Semiconductor laser device
JPH03174780A (en) * 1989-12-04 1991-07-29 Hitachi Cable Ltd Light emitting diode

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0311782A (en) * 1989-06-09 1991-01-21 Matsushita Electric Ind Co Ltd Semiconductor laser device
JPH03174780A (en) * 1989-12-04 1991-07-29 Hitachi Cable Ltd Light emitting diode

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