JPS54126474A - High-density package - Google Patents
High-density packageInfo
- Publication number
- JPS54126474A JPS54126474A JP3433378A JP3433378A JPS54126474A JP S54126474 A JPS54126474 A JP S54126474A JP 3433378 A JP3433378 A JP 3433378A JP 3433378 A JP3433378 A JP 3433378A JP S54126474 A JPS54126474 A JP S54126474A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- walls
- ics
- low
- conductive plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To obtain a low-thermal resistance, low-permittivity and high-density package by fixing a heat sink to the top face of ICs through a conductive plate after fixing plural ICs onto a low-permittivity circuit substrate, where a desired network is provided, to bond these ICs and pads provided on the substrate.
CONSTITUTION: A desired network having conductor 2 for external terminals is provided on substrate 1 which is formed by alumina porcelain etc., and two walls 7 obtained by arranging glasses oppositely are formed at the edge of the IC arrangement position on conductor 2. Next, Au is injected between two walls 7 to form prescribed-height bonding pad 8, and Si 9 is injected between adjacent two walls where an IC is to be arranged. After that, IC 10 is put on Si 9, and lead 11 provided in IC 10 is connected to pad 8. Next, conductive plate 13 where conductive adhesive 12 is applied to the contact part of IC 10 is so arranged that plate 13 may cover IC 10 and pad 8, and heat sink 14 having the same area as substrate 1 is fixed by screw 16 while being brought into contact with the outside face of conductive plate 13.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3433378A JPS54126474A (en) | 1978-03-24 | 1978-03-24 | High-density package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3433378A JPS54126474A (en) | 1978-03-24 | 1978-03-24 | High-density package |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54126474A true JPS54126474A (en) | 1979-10-01 |
JPS6111471B2 JPS6111471B2 (en) | 1986-04-03 |
Family
ID=12411207
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3433378A Granted JPS54126474A (en) | 1978-03-24 | 1978-03-24 | High-density package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54126474A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5950552A (en) * | 1982-09-09 | 1984-03-23 | シ−メンス・アクチエンゲゼルシヤフト | Cooler for integrated circuit element |
-
1978
- 1978-03-24 JP JP3433378A patent/JPS54126474A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5950552A (en) * | 1982-09-09 | 1984-03-23 | シ−メンス・アクチエンゲゼルシヤフト | Cooler for integrated circuit element |
JPS6355867B2 (en) * | 1982-09-09 | 1988-11-04 | Siemens Ag |
Also Published As
Publication number | Publication date |
---|---|
JPS6111471B2 (en) | 1986-04-03 |
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