JPS54126474A - High-density package - Google Patents

High-density package

Info

Publication number
JPS54126474A
JPS54126474A JP3433378A JP3433378A JPS54126474A JP S54126474 A JPS54126474 A JP S54126474A JP 3433378 A JP3433378 A JP 3433378A JP 3433378 A JP3433378 A JP 3433378A JP S54126474 A JPS54126474 A JP S54126474A
Authority
JP
Japan
Prior art keywords
substrate
walls
ics
low
conductive plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3433378A
Other languages
Japanese (ja)
Other versions
JPS6111471B2 (en
Inventor
Katsuhiko Yabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3433378A priority Critical patent/JPS54126474A/en
Publication of JPS54126474A publication Critical patent/JPS54126474A/en
Publication of JPS6111471B2 publication Critical patent/JPS6111471B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To obtain a low-thermal resistance, low-permittivity and high-density package by fixing a heat sink to the top face of ICs through a conductive plate after fixing plural ICs onto a low-permittivity circuit substrate, where a desired network is provided, to bond these ICs and pads provided on the substrate.
CONSTITUTION: A desired network having conductor 2 for external terminals is provided on substrate 1 which is formed by alumina porcelain etc., and two walls 7 obtained by arranging glasses oppositely are formed at the edge of the IC arrangement position on conductor 2. Next, Au is injected between two walls 7 to form prescribed-height bonding pad 8, and Si 9 is injected between adjacent two walls where an IC is to be arranged. After that, IC 10 is put on Si 9, and lead 11 provided in IC 10 is connected to pad 8. Next, conductive plate 13 where conductive adhesive 12 is applied to the contact part of IC 10 is so arranged that plate 13 may cover IC 10 and pad 8, and heat sink 14 having the same area as substrate 1 is fixed by screw 16 while being brought into contact with the outside face of conductive plate 13.
COPYRIGHT: (C)1979,JPO&Japio
JP3433378A 1978-03-24 1978-03-24 High-density package Granted JPS54126474A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3433378A JPS54126474A (en) 1978-03-24 1978-03-24 High-density package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3433378A JPS54126474A (en) 1978-03-24 1978-03-24 High-density package

Publications (2)

Publication Number Publication Date
JPS54126474A true JPS54126474A (en) 1979-10-01
JPS6111471B2 JPS6111471B2 (en) 1986-04-03

Family

ID=12411207

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3433378A Granted JPS54126474A (en) 1978-03-24 1978-03-24 High-density package

Country Status (1)

Country Link
JP (1) JPS54126474A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5950552A (en) * 1982-09-09 1984-03-23 シ−メンス・アクチエンゲゼルシヤフト Cooler for integrated circuit element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5950552A (en) * 1982-09-09 1984-03-23 シ−メンス・アクチエンゲゼルシヤフト Cooler for integrated circuit element
JPS6355867B2 (en) * 1982-09-09 1988-11-04 Siemens Ag

Also Published As

Publication number Publication date
JPS6111471B2 (en) 1986-04-03

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