JPS5664482A - Led device - Google Patents

Led device

Info

Publication number
JPS5664482A
JPS5664482A JP14030679A JP14030679A JPS5664482A JP S5664482 A JPS5664482 A JP S5664482A JP 14030679 A JP14030679 A JP 14030679A JP 14030679 A JP14030679 A JP 14030679A JP S5664482 A JPS5664482 A JP S5664482A
Authority
JP
Japan
Prior art keywords
pellets
base sections
conductive
led
crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14030679A
Other languages
Japanese (ja)
Inventor
Tatsuro Beppu
Akihiro Hachiman
Tetsuo Sadamasa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP14030679A priority Critical patent/JPS5664482A/en
Publication of JPS5664482A publication Critical patent/JPS5664482A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]

Abstract

PURPOSE:To prevent the creeping-up of conductive resin used for fastening a plurality of LED pellet on conductive base section by a method wherein the conductive base sections are projected higher than other surface where the LED pellets formed by crystal substrates and epitaxial layers grown on the crystal substrates are fast stuck to the base sections. CONSTITUTION:The first and second conductive base sections 12, 13 are made up to an insulating substrate 11 consisting of alumina porcelain, etc., being mutually parted, the LED pellets 1 are placed on the first base sections 12, downward directing P type crystals 1b at the sides reverse to the crystal substrate sides forming the pellets 1, and the electrodes 3 are fastened by using conductive resin 14 consisting of epoxy resin containing silver powder previously applied. In this constitution, only the base sections 12 are projected and formed in response to the forms of the pellets 1, and the creeping-up of the resin 14 to the flanks of the pellets 1 is prevented. And electrodes 2 at the N type crystal 1a sides on the upper surfaces of the pellets are connected to other base sections 13 by employing wires 15.
JP14030679A 1979-10-30 1979-10-30 Led device Pending JPS5664482A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14030679A JPS5664482A (en) 1979-10-30 1979-10-30 Led device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14030679A JPS5664482A (en) 1979-10-30 1979-10-30 Led device

Publications (1)

Publication Number Publication Date
JPS5664482A true JPS5664482A (en) 1981-06-01

Family

ID=15265711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14030679A Pending JPS5664482A (en) 1979-10-30 1979-10-30 Led device

Country Status (1)

Country Link
JP (1) JPS5664482A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60225482A (en) * 1984-04-24 1985-11-09 Toshiba Corp Semiconductor device
JP2013254833A (en) * 2012-06-06 2013-12-19 Mitsubishi Electric Corp Light-emitting device and method of manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60225482A (en) * 1984-04-24 1985-11-09 Toshiba Corp Semiconductor device
JP2013254833A (en) * 2012-06-06 2013-12-19 Mitsubishi Electric Corp Light-emitting device and method of manufacturing the same

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