JPS57166060A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS57166060A JPS57166060A JP56052598A JP5259881A JPS57166060A JP S57166060 A JPS57166060 A JP S57166060A JP 56052598 A JP56052598 A JP 56052598A JP 5259881 A JP5259881 A JP 5259881A JP S57166060 A JPS57166060 A JP S57166060A
- Authority
- JP
- Japan
- Prior art keywords
- foil
- pattern
- sheets
- film substrate
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49534—Multi-layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To realize an inexpensive film substrate consisting only of two sheets of Cu foil by a method wherein two sheets of Cu foil are pressedly bonded by a thermosetting, insulating adhesive and one of the Cu foil sheets is provided with a conductive pattern while the other is provided with a supporting pattern overlapping said conductive pattern. CONSTITUTION:Cu foil 11 and 12 sandwitching a thermosetting, insulating adhesive 13 are pressed to form a film substrate 10. Next, the Cu foil 11 is etched into a frame pattern 17, a pad 15 located within the pattern 17 for fixing a semiconductor device, and a conductive pattern 14 consisting of a plurality of electrode leads 16 running in four directions. The Cu foil 12 is etched into a supporting pattern 18 encircled by a rear frame pattern 19 and rear frame leads 20. The supporting pattern 18 laps over the pad 15 and the leads 16 on the Cu foil 11, and are specifiedly wire bonded to them. An inexpensive film substrate without using expensive, heat resisting plastic film is obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56052598A JPS57166060A (en) | 1981-04-07 | 1981-04-07 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56052598A JPS57166060A (en) | 1981-04-07 | 1981-04-07 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57166060A true JPS57166060A (en) | 1982-10-13 |
Family
ID=12919213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56052598A Pending JPS57166060A (en) | 1981-04-07 | 1981-04-07 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57166060A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100838661B1 (en) | 2006-06-23 | 2008-06-16 | 안동대학교 산학협력단 | Electrode preparation method for electrochemical biosensor |
-
1981
- 1981-04-07 JP JP56052598A patent/JPS57166060A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100838661B1 (en) | 2006-06-23 | 2008-06-16 | 안동대학교 산학협력단 | Electrode preparation method for electrochemical biosensor |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6428930A (en) | Semiconductor device | |
JPS5721163A (en) | Optical sensor array device | |
JPS54162549A (en) | Heat sensitive recording head | |
EP0559384A3 (en) | Devices with tape automated bonding | |
DE3173587D1 (en) | A semiconductor device having electrodes and conducting members bonded to the electrodes, and a method of manufacturing the same | |
JPS57166060A (en) | Semiconductor device | |
JPS6459841A (en) | Semiconductor device | |
JPS5643816A (en) | Structure of bonding pad part | |
JPS57166061A (en) | Semiconductor device | |
JPS5567179A (en) | Luminous display device | |
JPS5560917A (en) | Liquid crystal display device | |
JPS5674951A (en) | Semiconductor device | |
JPS57120361A (en) | Structure of film substrate | |
JPS556852A (en) | Semiconductor device | |
JPS5356969A (en) | Production of tape for tape carrier | |
GB9121604D0 (en) | Pressure-contact type semiconductor device | |
JPS6451707A (en) | Manufacture of surface acoustic wave chip device | |
JPS5618451A (en) | Manufacture of substrate for semiconductor device | |
JPS57147262A (en) | Manufacture of semiconductor device | |
JPS5374367A (en) | Semiconductor device | |
JPS52116073A (en) | Hermetic structure in which integrated circuit element is sealed up ai rtightly | |
JPS5635451A (en) | Semiconductor device | |
JPS5595930A (en) | Fully solid type electrochromic display device | |
JPS5318960A (en) | Bonding method | |
JPH0213764U (en) |