JPS57120361A - Structure of film substrate - Google Patents

Structure of film substrate

Info

Publication number
JPS57120361A
JPS57120361A JP567281A JP567281A JPS57120361A JP S57120361 A JPS57120361 A JP S57120361A JP 567281 A JP567281 A JP 567281A JP 567281 A JP567281 A JP 567281A JP S57120361 A JPS57120361 A JP S57120361A
Authority
JP
Japan
Prior art keywords
pattern
copper foil
substrate
film
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP567281A
Other languages
Japanese (ja)
Other versions
JPS6256656B2 (en
Inventor
Yoshio Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP567281A priority Critical patent/JPS57120361A/en
Priority to KR1019810005282A priority patent/KR850001541B1/en
Priority to GB8200313A priority patent/GB2093401B/en
Priority to DE3201133A priority patent/DE3201133A1/en
Publication of JPS57120361A publication Critical patent/JPS57120361A/en
Publication of JPS6256656B2 publication Critical patent/JPS6256656B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49534—Multi-layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To obtain at a low cost a substrate structure applicable for a film carrier system by a method wherein two copper foils are insulated to be bonded by use of thermohardening resin and a desired lead pattern is formed in one copper foil. CONSTITUTION:Two copper foils 11, 12 are bonded to each other by use of adhesive 13 of thermohardening resin and are formed in a film shape integrally. An etching is provided selectively for one copper foil 11 on a film substrate 14 formed as described above to form a desired lead pattern 16 and a continuous belt-like pattern 17 including an index hole 15 at the both ends. A selective etching for preventing a parasitic capacitance for the pattern 16 is provided for the other copper foil 12 on the substrate 14 and the remaining copper foils serve to carry the pattern 16. As a result, the substrate structure can be handled easily as for one sheet of copper foil in the aspect of strength and an adoption of film carrier producing system is permitted.
JP567281A 1981-01-17 1981-01-17 Structure of film substrate Granted JPS57120361A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP567281A JPS57120361A (en) 1981-01-17 1981-01-17 Structure of film substrate
KR1019810005282A KR850001541B1 (en) 1981-01-17 1981-12-31 Composite film
GB8200313A GB2093401B (en) 1981-01-17 1982-01-06 Composite film
DE3201133A DE3201133A1 (en) 1981-01-17 1982-01-15 COMPOSITE LAYER ARRANGEMENT, IN PARTICULAR FOR USE IN A SEMICONDUCTOR ARRANGEMENT, AND METHOD FOR THE PRODUCTION THEREOF

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP567281A JPS57120361A (en) 1981-01-17 1981-01-17 Structure of film substrate

Publications (2)

Publication Number Publication Date
JPS57120361A true JPS57120361A (en) 1982-07-27
JPS6256656B2 JPS6256656B2 (en) 1987-11-26

Family

ID=11617586

Family Applications (1)

Application Number Title Priority Date Filing Date
JP567281A Granted JPS57120361A (en) 1981-01-17 1981-01-17 Structure of film substrate

Country Status (1)

Country Link
JP (1) JPS57120361A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63244657A (en) * 1987-03-30 1988-10-12 Toshiba Corp Semiconductor device
JPH0239448A (en) * 1988-07-28 1990-02-08 Nec Corp Film carrier tape
CN102822953A (en) * 2010-03-30 2012-12-12 东丽株式会社 Metal support flexible board, metal support carrier tape for tape automated bonding using same, metal support flexible circuit board for mounting led, and copper foil-laminated metal support flexible circuit board for forming circuit

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05512Y2 (en) * 1987-08-06 1993-01-08

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49121968A (en) * 1973-03-30 1974-11-21

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49121968A (en) * 1973-03-30 1974-11-21

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63244657A (en) * 1987-03-30 1988-10-12 Toshiba Corp Semiconductor device
JPH0239448A (en) * 1988-07-28 1990-02-08 Nec Corp Film carrier tape
CN102822953A (en) * 2010-03-30 2012-12-12 东丽株式会社 Metal support flexible board, metal support carrier tape for tape automated bonding using same, metal support flexible circuit board for mounting led, and copper foil-laminated metal support flexible circuit board for forming circuit

Also Published As

Publication number Publication date
JPS6256656B2 (en) 1987-11-26

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