CN102822953A - Metal support flexible board, metal support carrier tape for tape automated bonding using same, metal support flexible circuit board for mounting led, and copper foil-laminated metal support flexible circuit board for forming circuit - Google Patents

Metal support flexible board, metal support carrier tape for tape automated bonding using same, metal support flexible circuit board for mounting led, and copper foil-laminated metal support flexible circuit board for forming circuit Download PDF

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Publication number
CN102822953A
CN102822953A CN2011800167659A CN201180016765A CN102822953A CN 102822953 A CN102822953 A CN 102822953A CN 2011800167659 A CN2011800167659 A CN 2011800167659A CN 201180016765 A CN201180016765 A CN 201180016765A CN 102822953 A CN102822953 A CN 102822953A
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Prior art keywords
support
metal
flexible substrate
metal support
circuit board
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前田昭弘
大野英二
泽村泰司
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Toray Industries Inc
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Toray Industries Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/64—Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups H01L31/00 - H10K99/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/049—Nitrides composed of metals from groups of the periodic table
    • H01L2924/0494—4th Group
    • H01L2924/04941—TiN
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Abstract

Disclosed is a metal support flexible wiring board which has excellent wire bonding properties and low curling properties while maintaining excellent insulating properties and punching properties, and therefore can be subjected to a reel-to-reel process and facilitates packaging scheme and heat dissipation scheme. Specifically disclosed is a metal support flexible board comprising (1) an adhesive layer and (2) a support layer, wherein the support (2) is composed of a metal foil, and the adhesive layer (1) contains (A) a polyamide resin containing a dimer acid residue and (B) a phenol resin.

Description

Metal support flexible substrate and use its belt engage automatically with metal support carrier band, LED install with metal support flexible circuit board and laminated circuit form metal support flexible circuit board with Copper Foil
Technical field
The present invention relates to metal and support flexible printed wiring board.More specifically; Relate to semiconductor integrated circuit (IC be installed) time employed belt engage (TAB) or ball grid array (BGA grid array automatically) encapsulation is with semiconductor device connecting boards such as plates, and for making LED or power category Unit Installation with electronic component-use metal support flexible substrate that substrate was fit to.
Background technology
Flexible substrate is used substrate for the circuit that is formed the bendability excellence that constitutes with conductor layer etc. by support, bonding agent, circuit forms; Also be on the conductor circuit layer that forms after the installation targets functional part etc.; Implement circuit protection through solder resist or coverlay, as the distributing board that various distributions guide or the IC installation extensively utilizes with plate of electronic instrument.
Along with popularizing of electric mechanical; In the today of developing electronic unit miscellaneous; The power consumption of the circuit substrate under the unit volume constantly raises along with miniaturization, densification; For flexible circuit board, also require corresponding to the raising of numerous high request characteristics that are suitable for the position and fail safe and deposit.Cause caloric value big and require the plasma display of high insulating property to drive flexible circuit board because of driving voltage is high especially for installing with driver IC; Or be used for installing the flexible circuit board that causes the big LED element of local pyrexia amount because of luminous; As the further multifunction of correspondence, high speed, the required technology of high-output powerization, raising thermal endurance, heat dissipation design property become problem when keeping insulation property and low crimpiness.
Therefore, a kind of substrate is proposed, when use has the substrate of metal substrate as circuit arrangement of high-cooling property, on this metal substrate configuration Ludox class inorganic varnish as insulating barrier, thereby can prevent the dielectric breakdown that causes because of wire-bonded.(for example with reference to patent documentation 1).
But; Because the inorganic varnish of Ludox class does not have flexible; So in flexible circuit board, exist with inferior problem: insulating barrier cracks; The amount of crimp of flexible circuit board is big; Can't carry out reel-to-reel (reel to reel) processing flow; With when being used for automatic juncture etc., be difficult to guarantee semi-cured state control or the punching property of resin bed etc.
In addition,, proposed a kind of used for liquid crystal display element TAB tape carrier, it is characterized in that, on parent metal, be coated with bonding agent, be formed with copper pattern thereon as base matrix as the method for utilizing the metal supporting layer.(for example with reference to patent documentation 2).
But; Owing to below next-door neighbour's insulating barrier, exist in the formation of conductive layer; Above the next-door neighbour, dispose the circuit of formation; So; Though can guarantee the insulating properties of insulating properties and each circuit layout-support metal level between circuit layout; But for being used as the high plasma display of driving voltage for driver IC or caloric value LED mounting substrate how, insulation property are not enough.In addition; Like automatic juncture of belt and so on circuit is being formed with Copper Foil in client's operation (client's engineering) successively during lamination; Existence forms with in Copper Foil and the support Copper Foil because of bond layer is clipped in circuit, the hygroscopic moisture of bond layer do not have the escape place and in bond layer problem such as generation foaming.
The prior art document
Patent documentation
Patent documentation 1: japanese kokai publication hei 8-288605 communique
Patent documentation 2: japanese kokai publication hei 8-055880 communique.
Summary of the invention
Invent problem to be solved
The objective of the invention is to: provide because of when keeping excellent insulating properties and punching characteristic, having excellent wire-bonded property and low crimpiness, process and can carry out reel-to-reel, package design and heat dissipation design are easy to metal and support flexible substrate.
Solve the means of problem
For solving above-mentioned problem, metal of the present invention is supported flexible substrate, and support is made up of metal forming, and (1) bond layer contains (A) and contains the polyamide of dimeric dibasic acid residue and (B) phenolic resins.
The effect of invention
According to the present invention, owing to when keeping excellent insulating properties and punching characteristic, have excellent wire-bonded property and low crimpiness, institute is so that easy package design and heat dissipation design become possibility.Using metal of the present invention to support the electronic unit of flexible substrate to have the required chemical proofing of circuit fabrication utilizes the high voltage drive of metal support substrate circuit to become possible insulating properties with making; Reel-to-reel processing and punching processing, fly line (flying ead) formation easy, compare with existing electronic unit make simply and cheaply heat dissipation design become possibility.
Embodiment
Below the present invention is elaborated.
Metal of the present invention supports (1) bond layer of flexible substrate to contain the polyamide that (A) contains the dimeric dibasic acid residue.
(A) dimeric dibasic acid that contains in the polyamide of dimeric dibasic acid residue is gone up the binary acid of highest weight scope for industry, owing to have bulky alkyl, so hydrophobicity is strong.Therefore, the dimer acid polyamide resin of being derived by dimeric dibasic acid is little and tough because of crystallinity, is rich in flexibility, when keeping low water absorption property, has and realizes the required dissolubility in organic solvent of metal support flexible substrate of the present invention.In addition, the hydrolytic resistance and the anti-flammability that have the strong adhesion that comes from amido link.Therefore, have the polyamide of dimeric dibasic acid residue, when keeping as flexible substrate desired chemical proofing, anti-flammability and low crimpiness, maintain the punching property under automatic joint method of belt and the similar approach thereof well through use.In addition, can be suppressed at after the punching foaming that causes because of the resin hygroscopic moisture when configuration circuit makes the bonding agent full solidification with metal level well.The polyamide that has carbon number and be 36 dicarboxylic acid residue is preferred aspect obdurability and system film property and processability.If have the polyamide of dimeric dibasic acid residue, then can use known various material, also can use more than 2 kinds.
Polyamide with dimeric dibasic acid residue can be through obtaining based on the dimeric dibasic acid of conventional method and the polycondensation of diamines, but also can contain dicarboxylic acids such as adipic acid, azelaic acid and decanedioic acid beyond the dimeric dibasic acid this moment as copolymer composition.As diamines, can use known materials such as ethylenediamine, hexamethylene diamine and piperazine, also can use more than 2 kinds.
In the present invention, the amine value with polyamide of dimeric dibasic acid residue is preferably 0.5 ~ 10, more preferably 0.5 ~8.The mg quantity of the potassium hydroxide of required salt acid equivalent during the polyamide of so-called here amine value representation and titration 1g.When the polyamide that contains more than 2 kinds, refer to the amine value of following expression: with titration 1g with each polyamide by the content in (1) bond layer the mg quantity of the potassium hydroxide of required salt acid equivalent during than the resin compound that mixes.If the amine value is more than 0.5; Then the crosslink density of (1) bond layer increases; Not only the flexible substrate that is obtained improves the chemical proofing or the insulation durability of aqueous slkali or organic acid mixed liquor; And the wire-bonded when installing with respect to IC or flip-chip thermal pressure can be with the resin limit deformation in Min., can avoid contacting of metal supporting layer and lead-in wire.In addition; If the amine value is below 10; Then can be reduced in the absolute value of the amount of curl of the distributing board that processing back obtains, and can keep the cross-linking reaction speed of suitable bonding agent, so can guarantee the storage stability under the bonding agent semi-cured state, the stability in the manufacturing procedure.
The melt viscosity that has under preferred 190 ℃ of the polyamide of dimeric dibasic acid residue is more than the 10Pas, if then further preferred more than the 20Pas.If 190 ℃ of melt viscosities down are more than the 10Pas, then can obtain the system film property of (1) bond layer and durability that the hygroscopic moisture when (1) bond layer formally solidified foams, so can carry out more stable machining.In addition, the melt viscosity under preferred 190 ℃ is below the 190Pas, if 100Pas is with next further preferred.If 190 ℃ of melt viscosities down are below the 190Pas, need not at high temperature to handle when then configuration circuit formation is with metal level, so can be with the Min. that is controlled at of the thermal degradation when of circuit layer and thermal stress.Here, the melt viscosity under 190 ℃ can be measured through the apparent viscosity of putting down in writing in the JIS K7210-1999 appendix C.When the polyamide that contains more than 2 kinds, use each polyamide is measured than the resin compound that mixes with the content in (1) bond layer.
In addition, the polyamide with dimeric dibasic acid residue preferably contains the polyetheramides resin.Even it is flexible that the polyetheramides resin still is imbued with, can be reduced in the absolute value of the amount of curl of the distributing board that obtains after the processing when macromolecule quantizes.
In addition, metal of the present invention supports (1) bond layer of flexible substrate to contain (B) phenolic resins.If phenolic resins 1 molecule contains the material of the phenol property hydroxyl more than 2, then there is not particular determination, known phenolic resins such as novolac type phenolic resins, resol type phenolic resins all can use.Particularly; For example can enumerate out the resin that contains following material: alkyl substituted phenols such as phenol, cresols, p-t-butyl phenol, nonyl phenol, p-phenyl phenol; Cyclic alkyl such as terpene, bicyclopentadiene modified phenol; Have nitro, halogen group, cyanic acid, amino etc. and contain the material of heteroatomic functional group; Material with parent nucleus such as naphthalene, anthracenes, multi-functional phenol such as Bisphenol F, bisphenol-A, bisphenol S, resorcinol, 1,2,3,-thrihydroxy-benzene.In addition, also can use the above-mentioned substance more than 2 kinds,, preferably use resol type phenolic resins from the viewpoint of insulating reliability.
In (1) of the present invention bond layer, (B) content of phenolic resins is preferably more than 10 weight portions with respect to the polyamide that (A) of 100 weight portions contains the dimeric dibasic acid residue, further is preferably more than 30 weight portions.In addition, be preferably below 200 weight portions, further be preferably below 160 weight portions.If (B) content of phenolic resins is more than 10 weight portions, then the bonding force durability under insulating reliability, the hot and humid processing improves, if below 200 weight portions, and then flexible excellence.
In the present invention, (1) bond layer also can contain (C) epoxy resin.As epoxy resin; The material that preferably has 2 above epoxy radicals, the material that preferably has the chemical constitution such as diglycidyl ether, linear phenol-aldehyde resin, cresols novolac resin, triphenolyl methane (ト リ ス Off ェ ニ ロ ー Le メ タ Application), epoxidation four phenylol ethane, epoxidation m-xylene diamine, cyclohexene oxide, bis oxide cycloheptene, cyclopentene oxide of bisphenol-A, Bisphenol F, bisphenol S, resorcinol, dihydroxy naphthlene, bicyclopentadiene biphenol, bicyclopentadiene two (xylenols) etc.In addition, the material that also preferably except that epoxy radicals, has the chemical reaction position that is selected from pi-allyl, methylallyl, amino, hydroxyl and carboxyl more than 3 altogether.When the different chemical reactive site that contains more than 2 kinds, as long as the chemical reaction number positional of all kinds that is had in the unit formula adds up to more than 3.The position at chemical reaction position does not have particular restriction, preferably on side chain, has the chemical reaction position at least.In addition, also can use above-mentioned epoxy resin more than 2 kinds.
In the present invention, (1) bond layer also can contain (D) curing accelerator.For example but example goes out aromatic polyamine, 2-alkyl-4-methylimidazole, 2-phenyl-imdazole derivatives such as 4-alkyl imidazole, dicyandiamide, triphenyl phasphine, known materials such as diazabicyclo hendecene.Also can use these materials more than 2 kinds.
In the present invention, (1) bond layer also can contain (E) filler.If filler does not damage the material of the characteristic of binding agent; Then there is not particular determination; As inorganic filler; Can enumerate out gold; Silver; Copper; Iron; Nickel; Metal particles such as aluminium; Magnesium hydroxide; Aluminium hydroxide; Metal hydroxidess such as calcium aluminate hydrate; Aluminium oxide; Zirconia; Zinc oxide; Antimony trioxide; Antimony pentaoxide; Aluminium oxide; Magnesia; Titanium oxide; Iron oxide; Cobalt oxide; Chromium oxide; Metal oxides such as talcum; Carborundum; Titanium carbide silicon dioxide; Aluminium nitride; Titanium nitride; Inorganic salts such as silicon nitride or calcium carbonate; Carbon black; Silicon dioxide, glass etc.Wherein, preferably use silicon dioxide, aluminium oxide, aluminium nitride, magnesium hydroxide, aluminium hydroxide etc.Here, silicon dioxide can be any in amorphous, the crystallization, does not limit separately to use according to the characteristic that is had separately.With the purpose that rises to of cementability or fillibility etc., also available silane coupler etc. is implemented surface treatment to these inorganic fillers.The particle diameter of inorganic filler does not have particular determination, from the average grain diameter of preferred 0.02 ~ 30 μ m in aspect such as dispersiveness and coating, the transparency.
As organic filler, but example goes out cross-linked polymers such as styrene, NBR rubber, acrylic rubber, polyamide, polyimides, silicone.The average grain diameter of particulate organic filler is if consider that dispersion stabilization then is preferably 0.2 ~5 μ m.
Situation to except that above composition, containing antioxidant ion capturing agent etc. in the scope of the characteristic of not damaging bonding agent does not have any restriction.As antioxidant, if give the material of anti-oxidation function, then there is not particular determination, can use known antioxidants such as phenol antioxidant, thioether class antioxidant, Phosphorus antioxidant, amine antioxidants.Also can use these materials more than 2 kinds.
Metal of the present invention supports (2) support of flexible substrate to be made up of metal forming.Through in support, using metal forming can improve the thermal conductivity of circuit substrate, with heating panel size minimization.In addition; Metal of the present invention is supported flexible substrate owing to be prone to through formation device aperture (device hole) such as punching processing; So; Be mounted parts through utilizing device aperture IC or LED element etc. to be installed from the back side of circuit formation face; Can be with (2) support itself as heating panel, or improve heat sink (heat ink) thermal conductivity.
As metal; Preferred Copper Foil, stainless steel foil, the aluminium foil of using; But also can use other copper alloy foil, nickel foil, magnesium paper tinsel, titanium foil such as phosphor bronze according to purposes, required function or contain their Alloy Foil etc.; Can combine to encapsulate whole balance, suitable selection thermal coefficient of expansion is 10 ~30ppm/ ℃ a metal forming.(2) thickness of support can combine desired flexible, the suitable selection of tearing strength, but preferably adopts 12 μ m ~150 μ m, more preferably adopts 12 μ m ~ 75 μ m.
In addition; Metal forming as (2) support; To give (1) bond layer easy-adhesion or insulating properties, change gloss appearance property, to be exposed to chemicals etc. when avoiding forming circuit is purpose; Also can implement surface treatments such as organic and inorganic coupling processing or gold-plated, coated with resin, formation ceramic layer, constitute (3) support coating in (1) of (2) support bond layer one side and/or its opposite side.
(3) thickness of support coating, from the viewpoint of lining intensity with the insulating reliability of the balance of rolling up operability and reinforcement (2) support and circuit conductor layer, lower limit is preferably more than the 2 μ m, more preferably more than the 2.5 μ m.In addition, the upper limit is preferably below the 100 μ m, more preferably below the 10 μ m.Further be preferably less than 5 μ m.In addition, the layer structure of (3) support coating can be simple layer or is made up of multilayer.
When in (3) support coating, using resin; There is not particular restriction; But preferably use thermal endurance, excellent polyimide resin or the polyamide-imide resin of chemical proofing, especially preferably use polyamide-imide resin with the aspect of giving easy-adhesion from giving chemical proofing.Polyamide-imide resin particularly can obtain to contain the polyamide of dimeric dibasic acid residue and (B) the high bonding force of (1) bond layer of phenolic resins with of the present invention containing (A), and is therefore preferred.(3) polyamide-imide resin that uses in the support coating is from thermal endurance, chemical proofing aspect; Preferred Tg (glass transition temperature) is more than 300 ℃; Weight average molecular weight is more than 10000; Be the high bonding force of acquisition and (1) of the present invention bond layer, the preferred mixing cured epoxy resin that has more than 5% weight.
In addition, (3) support coating can dispose according to the either side of purpose in (1) bond layer one side and an opposite side thereof as required, also can give wherein arbitrary side or both sides' fissility.Fissility refers to peel off from (2) support that disposes (3) support coating the part of (2) support; Otherwise or, do not peel off also or at other interface and peel off (3) support coating in the part of remained on surface (3) the support coating of (2) support.When (3) support coating of (1) bond layer one side is endowed fissility; Can make the base material minimizing of processing back product; When (3) support coating of the opposite side of (1) bond layer one side is endowed fissility; Can keep soup tolerance as before, obtain effectively to utilize the high-cooling property substrate of (2) support the available circuit process line.In this case; Preferably (3) support coating has layer structure more than two layers) ground floor that support contacted is adhesives and/or thermoplastic resin, beyond the ground floor at least 1 layer for be selected from polyester, polyalkenes hydrocarbon, polyphenylene sulfide, polyvinyl butyral resin, polyvinyl acetate, polyvinyl alcohol, Merlon, polyamide, polyimides, polyamidoimide and the polymethyl methacrylate more than a kind.Ground floor has fissility thus, and beyond the above-mentioned ground floor at least 1 layer can the soup tolerance when guaranteeing circuit fabrication in, the hot strength when guaranteeing to peel off, and realize being prone to peeling off.
In addition; For forming device aperture or centre feed hole (sproket hole through punching etc.) etc. the time the cross section, hole; With insulation protection and the chemicals when avoiding circuit to form expose as purpose; Can implement processing such as resin-coated or oxide scale film formation, further append (4) cross section, hole coating based on electro-deposition etc.When in the coating of (4) cross section, hole, using resin, preferably use excellent epoxy resin of insulating properties, thermal endurance, chemical proofing or polyimide resin, polyamide-imide resin, acrylic resin.
In addition; When circuit forms; Being exposed to chemicals with the device aperture cross section avoiding (2) support or form through punching or centre feed hole cross section is purpose; Preferably support painting photoresist on whole of the flexible substrate, and preferably back lining materials is coated (2) support on whole of the opposite side of (1) bond layer at metal.
The chemicals that use when circuit forms more; But support on the surface of flexible substrate through photoresist being coated metal; The part that can avoid on (2) support not having (1) bond layer and expose (2) support receives the exposure of chemicals, can prevent that thus metal from supporting the damage of flexible substrate.In addition, through back lining materials being coated (2) support on whole of the opposite side of (1) bond layer, can avoid the chemicals in device aperture cross section or centre feed hole cross section to expose.
Metal of the present invention is supported flexible substrate, before configuration circuit forms with metal level, also can semi-cured state keep (1) bond layer, and configuration (5) diaphragm, processes metal and supports carrier band.Diaphragm is not peeled off if can not damage form and the function of (1) bond layer; Then there is not particular determination; For example can enumerate out the film that the coated of plastic films such as polyester, polyalkenes hydrocarbon, polyphenylene sulfide, polyvinyl chloride, polytetrafluoroethylene, Kynoar, polyvinyl fluoride, polyvinyl butyral resin, polyvinyl acetate, polyvinyl alcohol, Merlon, polyamide, polyimides, polymethyl methacrylate being implemented release agents such as silicone or fluorine compounds forms; And, flood or be coated with paper of the resin with release property etc. the paper that their laminations form.
Metal supports carrier band after the device aperture through formation necessity such as punching processing, peels off diaphragm, forms through laminating or pressing configuration circuit and uses metal level, thereby can in device aperture, form unsettled distribution (fly line).If use the installation of fly line; Then can support the positive and negative either side of carrier band that IC or LED element etc. are installed from metal; So not only can improve the layout (lay out that is mounted parts) property, heat dissipation design property, and can further avoid in terminal conjunction method, becoming the cambial dielectric breakdown of support metal level-circuit that is caused because of the insulating barrier compression failure of problem.
Then, support the method for flexible substrate to be illustrated to preparing metal of the present invention.
(a) resin combination that will constitute (1) bond layer is dissolved in solvent as bonding agent coating, on (2) support, is coated with, drying, forms (1) bond layer, supports flexible substrate thereby obtain metal of the present invention.For the thickness of (1) bond layer, respectively require function as long as satisfy cementability, insulating properties, thermal conductivity etc., then there is not particular determination, but flexible for keeping, preferably be coated with according to reaching 2 ~200 μ m, more preferably be coated with according to reaching 2 ~ 50 μ m.Coating process does not have particular determination, can combine that the coating proterties is suitable uses common coating apparatus such as comma formula, lip formula, roll-type, line rod (メ イ ヤ ー バ ー) formula, intaglio process be brush.Drying condition is generally 100 ~200 ℃, 1 ~5 minute.Solvent does not have particular determination; Aromatic species such as toluene, xylenes, chlorobenzene; Ketone such as methylethylketone, methyl iso-butyl ketone (MIBK); Non-proton type of dimethyl formamide, dimethylacetylamide, N-methyl pyrrolidone etc.; Alcohols solvents such as ethanol, methyl alcohol, isopropyl alcohol, n-butanol, benzylalcohol are suitable, also can use these solvents more than 2 kinds.In addition; When use is insoluble to (D) curing accelerator of solvent or (E) during filler; Following method can suit to adopt: use homo-mixer or ball mill, sand mill, be scattered in the method in the solvent in advance based on the dispersal device of cavitation mode etc., or in each resin that constitutes (1) bond layer any one uses in above that extruder or banbury mixer etc. are mediated, the method for dispersion etc.
(b) on method formed (1) bond layer that also can in (a), put down in writing as required lamination have (5) diaphragm of release property, obtain metal of the present invention and support flexible substrate.And then when increasing bonding agent thickness, as long as coating process (1) bond layer that maybe will form lamination repeatedly repeatedly once more.In addition, also can on (5) diaphragm, form (1) bond layer in advance, lamination (2) support obtains metal of the present invention and supports flexible substrate.When disposing (3) support coating on (2) support; Preferably preparation will form the resin dissolves of (3) support coating or be scattered in the coating that organic solvent forms in advance; Thickness with regulation on (2) support is coated with, drying; Form (3) support coating; In addition; When configuration has (3) support coating of fissility; Preferably the fissility resin bed is being used to keep to peel off coating on the film of required hot strength, the dry and multilayer structure making that obtains, is fitting on (2) support through laminating etc. in advance.
Condition to (2) support laminated (1) bond layer is generally temperature 50 ~160 ℃, press pressure 0.1 ~0.5MPa.Laminating temperature is preferably below 140 ℃, if 120 ℃ with next be judged as good, if 100 ℃ with next be judged as extremely good.In addition; When (2) support when (1) bond layer one side constitutes (3) support coating; On (2) support, dispose object laminated (1) bond layer of (3) support coating, this moment also preferably according to contact laminating (1) bond layer on (2) support the time same condition carry out lamination.
After obtaining metal support flexible substrate of the present invention, for example can regulate the curing degree of (1) bond layer in 40 ~100 ℃ heat treatment about 20 ~300 hours.Through regulating curing degree, prevent bonding agent excess flow when metal supports that configuration circuit forms with metal level on the flexible substrate, simultaneously, the effect of the foaming that causes because of moisture when preventing to be heating and curing is arranged.
When using metal of the present invention to support that flexible substrate carries out circuit fabrication, when configuration (4) cross section, hole coating on formed device aperture or centre feed hole, preferably after through formation holes such as punchings, form through the electrodeposition coating method.As the electrodeposition coating method, the preferred employing applies negative voltage to (2) support, the cationic electrodeposition coating method that the electrocoating paints such as epoxy resin, polyimide resin class of positive polarization are separated out in the cross section, hole of (2) support.In addition, preferably implementing to add this electrocoating paint of heat fixation behind the electrodeposition coating.
Use metal of the present invention to support the electronic unit of flexible substrate to have required chemical proofing of circuit fabrication and the required insulating properties of metal support substrate circuit; The formation of reel-to-reel processing and punching processing, fly line is easy, compares with existing electronic unit to make simple and low-cost heat dissipation design become possibility.
Embodiment
An instance of execution mode of the present invention below is shown, but the present invention is not limited to these embodiment.At first, the evaluation method in embodiment and the comparative example is described.
(1) metal is supported the insulating reliability evaluation of flexible circuit board
Under 130 ℃, 85%RH environment, support flexible circuit board (the wide 50 μ m of conductor, conductor spacing 50 μ m) to apply the voltage of 100V, resistance value is dropped to 10 the metal that in each embodiment and comparative example, obtains < > 6 <> Time below the Ω is as the durable time of insulation.Durable time of insulating was preferably more than 250 hours.
(2) metal is supported the amount of curl evaluation of flexible substrate
The charged road that will in each embodiment and comparative example, obtain forms with the metal of Copper Foil supports the circuit of flexible substrate to form with Copper Foil through using the (subtractive that subdues of iron chloride) after method (etching) removal, cut into 35mm * 90mm as amount of curl evaluation support flexible substrate with metal.After the amount of curl evaluation being supported with metal flexible substrate carries out 24 hours damping in 23 ℃/55%RH; End at the substrate that will curl is statically placed under the state on the glass plate up, measure be stained with the circuit substrate that solidifies coverlay apart from the maximum height position of glass plate as amount of curl.If amount of curl 7mm with next be judged as good, if 3mm with next be judged as extremely good.
(3) metal is supported the foaming evaluation of flexible substrate
With metal microstructure sem observation above-mentioned (2) amount of curl evaluation (1) bond layer, the evaluation of foaming with metal support flexible substrate.With diameter is that the above person of 5 μ m is considered as foaming; To not have foaming person fully and be evaluated as zero; Be more than the 5 μ m with confirming to have 1 ~ 10 with interior diameter and the foaming person of less than 50 μ m is evaluated as △, with confirm to have diameter be foaming or affirmation more than the 50 μ m diameter more than 11 is arranged is more than the 5 μ m and the foaming person of less than 50 μ m is evaluated as *.If then can be judged as more than the △ well, if zero can be judged as extremely good.
(4) metal is supported withstand voltage the connecing property evaluation of flexible circuit board
Use ACF connector (TCW-125 Avionics Co. (Japanese ア PVC オ ニ Network ス Co., Ltd.) system) in 200 ℃ of metal support flexible circuit board (wide 50 μ m of conductor in each embodiment and comparative example, obtaining; Conductor spacing 50 μ m) apply 1 second hot pressing, making tool pressure is each root distribution 50g/2500 μ m < > 2 <> , carry out withstand voltage the connecing property evaluation of wire-bonded etc.Measure the withstand voltage deflection that connects with the circuit pattern copper of the instrument crimping face of sample, if 3.0 μ m with interior then can be judged as qualified, if 2.0 μ m with interior then can be judged as good, if 1.0 μ m with interior then can be judged as extremely good.
(5) metal is supported the punching property evaluation of flexible substrate
The metal that will in each embodiment and comparative example, obtain supports the used in flexible substrate compacting tool set to offer 0.250mm < > φ <> , 0.350mm < > φ <> , 0.500mm < > φ <> Circular hole, its cross section is observed, as the evaluation of punching property.If (1) bond layer sagging (ダ レ) on the cross section in hole more than the long 10 μ m of nothing or overlap or above (1) bond layer of long 10 μ m break or gap; Peeling off between nothing and (2) support around the hole; Then form good device aperture or through hole, can be judged as extremely good for the formation of fly line or designs property; Do not break or gap as if having above (1) bond layer sagging of length 20 μ m or overlap or (1) bond layer more than the long 20 μ m, peeling off between nothing and (2) support around the hole then can be judged as good; When (1) bond layer sagging or overlap or above (1) bonding agent of long 20 μ m of occurring on the cross section in hole more than the long 20 μ m break or gap, during peeling off around the hole between appearance and (2) support, can be judged as bad.
(6) metal supports the flexible substrate and the metal of band centre feed hole to support the soup tolerance of flexible substrate to estimate
Support the metal of flexible substrate, band centre feed hole to support flexible substrate through observing the metal that will in each embodiment and comparative example, obtain respectively (40 ℃ of 1. ferric chloride solutions; 37%), 2. sodium hydroxide solution (30 ℃ of), 3. (70 ℃ of electroless plating tin liquors; " Timposit " LT-34 and Haas Company (ロ ー system ア Application ド ハ ー ス society) outward appearance after flooding system) is estimated as the soup tolerance.Criterion is as follows.
(6-1) metal is supported the situation of flexible substrate
The A level: when dipping 5 minutes in 1 soup successively, then dipping 5 minutes in 2 soup, further dipping in the time of 5 minutes in 3 soup, satisfy following (i) and (ii) in the situation of arbitrary necessary condition.
The B level: though do not satisfy the necessary condition of above-mentioned A level, ought be successively in 1 soup dipping 3 minutes, then dipping 3 minutes in 2 soup, further dipping in the time of 3 minutes in 3 soup, satisfy following (i) and (ii) in the situation of arbitrary necessary condition.
The C level: when in 1 soup, flooding 3 minutes successively, then in 2 soup, flooded 3 minutes, further dipping though satisfy the necessary condition of following (i), was discontented with the situation of your row necessary condition (ii) in the time of 3 minutes in 3 soup.
The F level: when dipping 3 minutes in 1 soup successively, then dipping 3 minutes in 2 soup, further dipping in the time of 3 minutes in 3 soup, discontented foot row (i) and (ii) in the situation of arbitrary necessary condition.
(i)(1) appearance of bond layer is not seen the obvious damage that is caused by soup.
(ii) when not when the opposite side of (1) of (2) support bond layer forms (3) support coating, the appearance of the face of (2) support and an opposite side (1) bond layer is not seen the obvious damage that is caused by soup.In addition; When the opposite side at (1) of (2) support bond layer formed (3) support coating, the appearance with the face opposite side of (2) support (3) support coating that an opposite side of (1) bond layer of (2) support forms was not seen the obvious damage that is caused by soup.
(6-2) metal of band centre feed hole is supported the situation of flexible substrate
The situation of necessary condition A level: when in 1 soup, flooding 5 minutes successively, then in 2 soup, flooded 5 minutes, when further in 3 soup, flooding 5 minutes, satisfy following (i) ~(iii fully).
The situation of necessary condition A ' level: though do not satisfy the necessary condition of above-mentioned A level, ought in 1 soup, flood 3 minutes successively, then in 2 soup, flood 3 minutes, when further in 3 soup, flooding 3 minutes, satisfy following (i fully) ~(iii).
B level: when in 1 soup, flooding 3 minutes successively, then in 2 soup, flooded 3 minutes, when further in 3 soup, flooding 3 minutes, satisfy following (i) ~(iii) any 2 situation in the necessary condition.
C level: when in 1 soup, flooding 3 minutes successively, then in 2 soup, flooded 3 minutes, when further in 3 soup, flooding 3 minutes, only satisfy following (i) ~(iii) any 1 situation in the necessary condition.
The situation of necessary condition F level: in 1 soup, flooding 3 minutes successively, following in 2 soup and flooded 3 minutes, when further in 3 soup, flooding 3 minutes, be discontented with you fully and be listed as (i) ~(iii).
(i)(1) appearance of bond layer is not seen the obvious damage that is caused by soup.
(ii) when not when an opposite side of (1) of (2) support bond layer forms (3) support coating, the appearance with the face opposite side of (1) bond layer (2) support is not seen the obvious damage that is caused by soup.In addition; When the opposite side at (1) of (2) support bond layer formed (3) support coating, the appearance with the face opposite side of (2) support (3) support coating that an opposite side of (1) bond layer of (2) support forms was not seen the obvious damage that is caused by soup.
(iii) on the cross section, hole, do not see the obvious damage that causes by soup.
(7) metal is supported the bonding force of flexible circuit board
The metal that use obtains in each embodiment and comparative example is supported flexible circuit board (the wide 50 μ m of conductor); With Tensilon (テ Application シ ロ Application) UTM-11-5HR (Toyo Baldwin Co.; Ltd. (Japan ボ ー Le De ウ ィ Application society) makes) peel conductor in 90 degree directions with the speed that 50mm/ divides, measure the peel strength of this moment.If then can be judged as more than the 8N/cm extremely good, if then can be judged as good more than the 6N/cm.
(embodiment 1)
(a) preparation of bonding agent synusia
To (A) of 100 weight portions dimer acid polyamide resin (" Sunmide (サ Application マ イ De) " (registered trade mark)HT-100G Products Japan (エ ア ー プ ロ ダ Network Star ジ ャ パ Application society) system; Amine value 1; Melt viscosity 7.0Pas); (B) resol (CKM1634 of 50 weight portions is clear to make) with macromolecule society; (C) epoxy resin of 80 weight portions ((D) curing accelerator (2-ethyl-4-methylimidazole (2E4MZ) of " Epikote (エ ピ コ ー ト) " (registered trade mark)YL980 Epoxy Resins Co. (ジ ャ パ Application エ Port キ シ レ ジ Application society) system) weight portion; Tokyo changes into society's system) in; (mixed weight is than ethanol 1: toluene 4) to add the ethanol/toluene mixed solvent; In 30 ℃ of stirrings; Mix, the preparation solid component concentration is the adhesive composite of 25 weight %.This adhesive composite is coated with machine with rod to be coated (5) diaphragm (thickness of band silicone release agent is on the PETG film (rattan lumber industry (strain) system " FILMBYNA (Off ィ Le system バ イ Na) " (registered trade mark) GT)) of 25 μ m; Making dry thickness is about 12 μ m; 150 ℃ of dryings after 4 minutes; Other (5) diaphragm of applying on formed (1) bonding agent aspect, thus the preparation both sides are by the bonding agent synusia of (5) diaphragm clamping.
(b) metal supports flexible substrate and metal to support the preparation of flexible circuit board
Bonding agent synusia to the method for in above-mentioned (a), putting down in writing obtains is peeled off the one-sided of (5) diaphragm; Go up with 100 ℃, the condition of 0.3MPa at (2) support (coefficient of linear expansion 16.0ppm/ ℃ of rolled copper foil (BHY-22B-T 70 μ m thick (Nippon Mining and Metals Co., Ltd's system)) and to carry out lamination, obtain metal and support flexible substrate.
Stripping metal is supported (5) diaphragm of flexible substrate, at 140 ℃, the electrolytic copper foil of the condition laminated 18 μ m of 0.3MPa pressure.Then, in air oven, carry out 80 ℃ following 3 hours, 100 ℃ following 5 hours, 150 ℃ heat treated successively of following 5 hours, prepare charged road and form metal support flexible substrate with Copper Foil.Form the circuit formation of supporting flexible substrate with the metal of Copper Foil on the charged road that obtains and carry out the peeling off of formation, etching, resist of photoresist film with copper-clad surface through conventional method; Form wiring closet apart from be 100 μ m (the wide 50 μ m of conductor) to telegraph circuit after; In fluoboric acid class (Rohm and Haas Company (ロ ー system ア Application ド ハ ー ス society) in system tin plating electrolyte (trade name) " TINPOSIT " (registered trade mark)LT-34) the electroless plating tin liquor in 70 ℃ of impregnation process 5 minutes; Apply the thick coating of 0.5 μ m, the preparation metal is supported flexible circuit board.
The evaluation that use obtains through said method is supported flexible substrate, charged road to form with the metal of Copper Foil with metal to support flexible substrate, metal support flexible circuit board, carry out above-mentioned (1) ~(7) evaluation.
(embodiment 2)
Remove when preparation bonding agent synusia; As (A) ~(D) composition uses (A) dimer acid polyamide resin (" Tohmide (ト ー マ イ De) of 100 weight portions " (registered trade mark)TXC-232C; Fuji changes into industrial society system; Amine value 10.0; Melt viscosity 24.0Pas); (B) resol (CKM1634 of 50 weight portions is clear to make) with macromolecule society; (C) epoxy resin of 80 weight portions ((D) curing accelerator (2-ethyl-4-methylimidazole (2E4MZ) of " Epikote (エ ピ コ ー ト) " (registered trade mark)YL980 Epoxy Resins Co. (ジ ャ パ Application エ Port キ シ レ ジ Application society) system) weight portion; Tokyo changes into society's system) outside; According to preparing, carry out above-mentioned (1 with embodiment 1 same method) ~(7) the middle evaluation of putting down in writing.
(embodiment 3)
Remove when preparation bonding agent synusia; As (A) ~(D) composition uses (A) dimeric dibasic acid polyetheramides resin (" Tohmide (ト ー マ イ De) of 100 weight portions " (registered trade mark)PA-200; Fuji changes into industrial society system; Amine value 3; Melt viscosity 40.0Pas); (B) resol (CKM1634 of 50 weight portions is clear to make) with macromolecule society; (C) epoxy resin of 80 weight portions ((D) curing accelerator (2-ethyl-4-methylimidazole (2E4MZ) of " Epikote (エ ピ コ ー ト) " (registered trade mark)YL980 Epoxy Resins Co. (ジ ャ パ Application エ Port キ シ レ ジ Application society) system) weight portion; Tokyo changes into society's system) outside; According to preparing, carry out above-mentioned (1 with embodiment 1 same method) ~(7) the middle evaluation of putting down in writing.
(embodiment 4)
Remove when preparation bonding agent synusia; As (A) ~(D) composition uses (A) dimeric dibasic acid polyetheramides resin (" Tohmide (ト ー マ イ De) of 100 weight portions " (registered trade mark)PA-200; Fuji changes into industrial society system; Amine value 3; Melt viscosity 40.0Pas); (B) resol (CKM1634 of 50 weight portions is clear to make) with macromolecule society; (C) epoxy resin of 80 weight portions ((D) curing accelerator (2-ethyl-4-methylimidazole (2E4MZ) of " Epikote (エ ピ コ ー ト) " (registered trade mark)YL980 Epoxy Resins Co. (ジ ャ パ Application エ Port キ シ レ ジ Application society) system) weight portion; Tokyo changes into the system) of society; And use that (mixed weight is than ethanol 1: (E) alumina filled material (" Adomafine (ア De マ Off ァ イ Application) " (the registered trade mark)AO-502 that is added with 300 weight portions toluene 4) at the ethanol/toluene mixed solvent; Average grain diameter 0.7 μ m Co. (ア of Co., Ltd. De マ テ ッ Network ス society) system) carries out outside the mixed solvent that dispersion treatment forms with sand mill in advance; According to preparing, carry out above-mentioned (1 with embodiment 1 same method) ~(7) the middle evaluation of putting down in writing.
(embodiment 5)
(a) preparation of bonding agent synusia
Remove when preparation binding agent synusia; As (A) ~(D) composition uses (A) dimeric dibasic acid polyetheramides resin (" Tohmide (ト ー マ イ De) of 100 weight portions " (registered trade mark)PA-200; Fuji changes into industrial society system; Amine value 3; Melt viscosity 40.0Pas); (B) resol (CKM1634 of 50 weight portions is clear to make) with macromolecule society; (C) epoxy resin of 80 weight portions ((D) curing accelerator (2-ethyl-4-methylimidazole (2E4MZ) of " Epikote (エ ピ コ ー ト) " (registered trade mark)YL980 Epoxy Resins Co. (ジ ャ パ Application エ Port キ シ レ ジ Application society) system) weight portion; Tokyo changes into society's system) outside, according to preparing the bonding agent sheet with embodiment 1 same method.
(b) metal supports the metal of flexible substrate, band centre feed hole to support flexible substrate and metal to support the preparation of flexible circuit board
It is wide that the bonding agent synusia that will obtain according to the method for record in above-mentioned (a) is cut into 30mm; Peel off the one-sided of (5) diaphragm then; At (2) support (the wide (Sumikei Aluminum of the aluminium foil thick 35mm of 50 μ m Foil Co. (live light ア Le ミ Co., Ltd.) system) coefficient of linear expansion 22.0ppm) go up with 100 ℃, the condition of 0.3MPa and carry out lamination, obtain metal and support flexible substrate.
Support to utilize on the flexible substrate mould to form centre feed hole (square of aperture 1.98mm * 1.98mm, spacing 4.75mm) through carrying out each 1 row punching of two ends at metal, the metal that obtains the band centre feed hole is supported flexible substrate.
The metal of peeling off the band centre feed hole is supported (5) diaphragm of flexible substrate, at 140 ℃, the electrolytic copper foil of the condition laminated 18 μ m of 0.3MPa pressure.Then, in air oven, carry out 80 ℃ following 3 hours, 100 ℃ following 5 hours, 150 ℃ heat treated successively of following 5 hours, prepare charged road and form metal support flexible substrate with Copper Foil.
Form the circuit formation of supporting flexible substrate with the metal of Copper Foil on the charged road that obtains with on whole of the substrate of copper-clad surface one side; Carry out formation, exposure, the video picture of photoresist film through conventional method; Then on whole of its back side, be coated with back lining materials, fill centre feed hole with back lining materials with brush.Then; Carry out peeling off of the peeling off of etching, resist, back lining materials; Form wiring closet apart from be 100 μ m (the wide 50 μ m of conductor) to telegraph circuit after; In fluoboric acid class (Rohm and Haas Company (ロ ー system ア Application ド ハ ー ス society) in system tin plating electrolyte (trade name) " TINPOSIT " (registered trade mark)LT-34) the electroless plating tin liquor in 70 ℃ of impregnation process 5 minutes; Apply the thick coating of 0.5 μ m, the preparation metal is supported flexible circuit board.
The evaluation that use obtains through said method is supported the metal of flexible substrate, band centre feed hole to support flexible substrate, charged road to form with the metal of Copper Foil with metal to support flexible substrate, metal support flexible circuit board, carry out above-mentioned (1) ~(7) evaluation.
(embodiment 6)
Will be except that using as the aluminium foil of (2) support (the thick (Sumikei Aluminum of 50 μ m Foil Co. (live light ア Le ミ Co., Ltd.) system) coefficient of linear expansion 22.0ppm) the two sides be covered the goods that form as (3) support coating with the polyamide-imide resin of 300 ℃ of the Tg of 3.0 μ m, weight average molecular weight 11000, epoxy resin mixing ratio 10%; According to preparing, carry out above-mentioned (1 with embodiment 5 same methods) ~(7) the middle evaluation of putting down in writing.
(embodiment 7)
Will be except that using as the aluminium foil of (2) support (the thick (Sumikei Aluminum of 50 μ m Foil Co. (live light ア Le ミ Co., Ltd.) system) coefficient of linear expansion 22.0ppm) the two sides be covered the goods that form as (3) support coating with Tg300 ℃ of 1.5 μ m, the polyamide-imide resin of weight average molecular weight 11000, epoxy resin mixing ratio 10%; According to preparing, carry out above-mentioned (1 with embodiment 5 same methods) ~(7) the middle evaluation of putting down in writing.
(embodiment 8)
Will be except that using as the aluminium foil of (2) support (the thick (Sumikei Aluminum of 50 μ m Foil Co. (live light ア Le ミ Co., Ltd.) system) coefficient of linear expansion 22.0ppm) the two sides be covered the goods that form as (3) support coating with the polyamide-imide resin of 250 ℃ of the Tg of 3.0 μ m, weight average molecular weight 8000, epoxy resin mixing ratio 10%; According to preparing, carry out above-mentioned (1 with embodiment 5 same methods) ~(7) the middle evaluation of putting down in writing.
(embodiment 9)
Will be except that using as the aluminium foil of (2) support (the thick (Sumikei Aluminum of 50 μ m Foil Co. (live light ア Le ミ Co., Ltd.) system) coefficient of linear expansion 22.0ppm) the two sides be covered the goods that form as (3) support coating with the polyimide resin of 300 ℃ of the Tg of 3.0 μ m, weight average molecular weight 12000; According to preparing, carry out above-mentioned (1 with embodiment 5 same methods) ~(7) the middle evaluation of putting down in writing.
(embodiment 10)
Remove when preparation binding agent synusia; Use (A) dimer acid polyamide resin (" Tohmide (ト ー マ イ De) of 100 weight portions as (A) composition " (registered trade mark)PA-100; Fuji changes into industrial society system; Amine value 0; Melt viscosity 180.0Pas) outside; According to preparing, carry out above-mentioned (1 with embodiment 6 same methods) ~(7) the middle evaluation of putting down in writing.
(embodiment 11)
Remove when preparation binding agent synusia; Use (A) dimer acid polyamide resin (" Tohmide (ト ー マ イ De) of 100 weight portions as (A) composition " (registered trade mark)PA-100; Fuji changes into industrial society system; Amine value 0; Melt viscosity 180.0Pas) outside; According to preparing, carry out above-mentioned (1 with embodiment 7 same methods) ~(7) the middle evaluation of putting down in writing.
(embodiment 12)
Remove using will be as the aluminium foil of (2) support (the thick (Sumikei Aluminum of 50 μ m Foil Co. (live light ア Le ミ Co., Ltd.) system) coefficient of linear expansion 22.0ppm) (1) bond layer one side with 300 ℃ of the Tg of 3 μ m; The polyimide resin of weight average molecular weight 11000 is as the lining of (3) support coating; And reverse side one side is used in the interior lining band KT-50 that constitutes binding agent on the PETG film, and (river village industry society makes)(fissility adhesive layer 20 μ m; PETG film 50 μ m) carry out outside the goods that the roll-type lamination forms in 30 ℃; According to preparing, carry out above-mentioned (1 with embodiment 5 same methods) ~(7) the middle evaluation of putting down in writing.
(embodiment 13)
Remove when the metal of preparation band centre feed hole is supported flexible substrate; Electrocoating paint Elecoat (エ レ コ ー ト)AMG (Shimizu Co. (the シ ミ ズ of Co., Ltd.) system) electro-deposition that with resinous principle is epoxy resin on the centre feed hole cross section becomes thickness 10 μ m; In 100 ℃ of dried of carrying out 15 minutes; Form outside the coating of (4) cross section, hole; According to preparing, carry out above-mentioned (1 with embodiment 6 same methods) ~(7) the middle evaluation of putting down in writing.
(embodiment 14)
Remove when the metal of preparation band centre feed hole is supported flexible substrate; (4) cross section, hole coating is made as outside the electrocoating paint Elecoat that resinous principle is the polyimide resin class (エ レ コ ー ト)PI (Shimizu Co. (the シ ミ ズ of Co., Ltd.) system); According to preparing, carry out above-mentioned (1 with embodiment 13 same methods) ~(7) the middle evaluation of putting down in writing.
(embodiment 15)
Remove when preparation binding agent synusia; Use (A) dimeric dibasic acid polyetheramides resin (" Tohmide(ト ー マ イ De) of 100 weight portions as (A) ~ (D) composition " (registration mark) PA-200; Fuji changes into industrial society system; Amine value 3; Melt viscosity 40.0Pas), (C) epoxy resin of (B) resol of 50 weight portions (CKM1634 clear with macromolecule society system), 80 weight portions (" Epikote(エ ピ コ ー ト) " (registration mark) YL980; JapanEpoxyResinsCo.; Ltd.(ジ ャ パ Application エ Port キ シ レ ジ Application society) system), (D) curing accelerator (2-ethyl-4-methylimidazole (2E4MZ) of 2 weight portions; Tokyo changes into society's system); And use the ethanol/toluene mixed solvent (mixed weight is than ethanol 1: (E) the alumina filled material (" Adomafine(ア De マ Off ァ イ Application) that is added with 300 weight portions toluene 4) " (registration mark) AO-502; Average grain diameter 0.7 μ m; AdmatechsCo.; The ア of Ltd.(Co., Ltd. De マ テ ッ Network ス society) system) carries out the mixed solvent that dispersion treatment forms with sand mill in advance; Use outside the SUS316 paper tinsel (70 μ m thick (Japan smart paper tinsel Co., Ltd. system) linear expansion coefficient 18.5ppm) as (2) support in addition; Method according to similarly to Example 1 prepares, and carries out the evaluation of record in above-mentioned (1) ~ (7).
(embodiment 16)
Remove when preparation binding agent synusia; As (A) ~(D) composition uses (A) dimeric dibasic acid polyetheramides resin (" Tohmide (ト ー マ イ De) of 100 weight portions " (registered trade mark)PA-200; Fuji changes into industrial society system; Amine value 3; Melt viscosity 40.0Pas); (B) resol (CKM1634 of 50 weight portions is clear to make) with macromolecule society; (C) epoxy resin of 80 weight portions ((D) curing accelerator (2-ethyl-4-methylimidazole (2E4MZ) of " Epikote (エ ピ コ ー ト) " (registered trade mark)YL980 Epoxy Resins Co. (ジ ャ パ Application エ Port キ シ レ ジ Application society) system) weight portion; Tokyo changes into the system) of society; And use that (mixed weight is than ethanol 1: (E) alumina filled material (" Adomafine (ア De マ Off ァ イ Application) " (the registered trade mark)AO-502 that is added with 300 weight portions toluene 4) at the ethanol/toluene mixed solvent; Average grain diameter 0.7 μ m Co. (ア of Co., Ltd. De マ テ ッ Network ス society) system) carries out the mixed solvent that dispersion treatment forms with sand mill in advance; Use aluminium foil (the thick (Sumikei Aluminum of 50 μ m Foil Co. (live light ア Le ミ Co., Ltd.) system) coefficient of linear expansion 22.0ppm as (2) support in addition) outside; According to preparing, carry out above-mentioned (1 with embodiment 1 same method) ~(7) the middle evaluation of putting down in writing.
(embodiment 17)
Remove when preparation binding agent synusia; As (A) ~(D) composition uses (A) dimeric dibasic acid polyetheramides resin (" Tohmide (ト ー マ イ De) of 100 weight portions " (registered trade mark)PA-200; Fuji changes into industrial society system; Amine value 3; Melt viscosity 40.0Pas); (B) resol (CKM1634 of 50 weight portions is clear to make) with macromolecule society; (C) epoxy resin of 80 weight portions ((D) curing accelerator (2-ethyl-4-methylimidazole (2E4MZ) of " Epikote (エ ピ コ ー ト) " (registered trade mark)YL980 Epoxy Resins Co. (ジ ャ パ Application エ Port キ シ レ ジ Application society) system) weight portion; Tokyo changes into the system) of society; And use that (mixed weight is than ethanol 1: (E) aluminium nitride packing material (H that is added with 300 weight portions toluene 4) at the ethanol/toluene mixed solvent; Average grain diameter 1.7 μ m Corporation (ト of Co., Ltd. Network ヤ マ society) system) carries out outside the mixed solvent that dispersion treatment forms with sand mill in advance; According to preparing, carry out above-mentioned (1 with embodiment 1 same method) ~(7) the middle evaluation of putting down in writing.
(embodiment 18)
Remove when preparation binding agent synusia; Use (A) dimeric dibasic acid polyetheramides resin (" Tohmide(ト ー マ イ De) of 100 weight portions as (A) ~ (D) composition " (registration mark) PA-200; Fuji changes into industrial society system; Amine value 1; Melt viscosity 40.0Pas), dimer acid polyamide resin (" Tohmide(ト ー マ イ De) " (registration mark) PA-100; Fuji changes into industrial society system; Amine value 0; Melt viscosity 180.0Pas) and dimer acid polyamide resin (" Tohmide(ト ー マ イ De) " (registration mark) 535; Fuji changes into industrial society system; Amine value 50; Melt viscosity 1.0Pas) weight ratio is mixture (the amine value 7.1 of 2:1:0.5; Melt viscosity 80Pas) (dimeric dibasic acid polyetheramides resin 1); (B) resol of 50 weight portions (the clear and macromolecule society system of CKM1634); (C) epoxy resin of 80 weight portions (" Epikote(エ ピ コ ー ト) " (registration mark) YL980; JapanEpoxyResinsCo.; Ltd.(ジ ャ パ Application エ Port キ シ レ ジ Application society) system); Outside (D) curing accelerator of 2 weight portions (2-ethyl-4-methylimidazole (2E4MZ), Tokyo change into society's system); Method according to similarly to Example 1 prepares, and carries out the evaluation of record in above-mentioned (1) ~ (7).
(embodiment 19)
Remove when preparation binding agent synusia; As (A) ~(D) composition uses (A) dimer acid polyamide resin (" Macromelt (マ Network ロ メ Le ト) " (registered trade mark)6900 Japan Ltd. (ヘ Application ケ Le ジ ャ パ Application society) system of 100 weight portions; Amine value 0; Melt viscosity 10Pas); (B) resol (CKM1634 of 50 weight portions is clear to make) with macromolecule society; (C) epoxy resin of 80 weight portions ((D) curing accelerator (2-ethyl-4-methylimidazole (2E4MZ) of " Epikote (エ ピ コ ー ト) " (registered trade mark)YL980 Epoxy Resins Co. (ジ ャ パ Application エ Port キ シ レ ジ Application society) system) weight portion; Tokyo changes into society's system) outside; According to preparing, carry out above-mentioned (1 with embodiment 1 same method) ~(7) the middle evaluation of putting down in writing.
(embodiment 20)
Remove when preparation bonding agent synusia; As (A) ~(D) composition uses (A) dimer acid polyamide resin (" Tohmide (ト ー マ イ De) of 100 weight portions " (registered trade mark)1350; Fuji changes into industrial society system; Amine value 10; Melt viscosity 3.0Pas); (B) resol (CKM1634 of 50 weight portions is clear to make) with macromolecule society; (C) epoxy resin of 80 weight portions ((D) curing accelerator (2-ethyl-4-methylimidazole (2E4MZ) of " Epikote (エ ピ コ ー ト) " (registered trade mark)YL980 Epoxy Resins Co. (ジ ャ パ Application エ Port キ シ レ ジ Application society) system) weight portion; Tokyo changes into society's system) outside; According to preparing, carry out above-mentioned (1 with embodiment 1 same method) ~(7) the middle evaluation of putting down in writing.
(embodiment 21)
Remove when preparation binding agent synusia; As (A) ~(D) composition uses (A) dimer acid polyamide resin (" Tohmide (ト ー マ イ De) of 100 weight portions " (registered trade mark)PA-100; Fuji changes into industrial society system; Amine value 0; Melt viscosity 180.0Pas); (B) phenolic resins (CKM1634 of 50 weight portions is clear to make) with macromolecule society; (C) epoxy resin of 80 weight portions ((D) curing accelerator (2-ethyl-4-methylimidazole (2E4MZ) of " Epikote (エ ピ コ ー ト) " (registered trade mark)YL980 Epoxy Resins Co. (ジ ャ パ Application エ Port キ シ レ ジ Application society) system) weight portion; Tokyo changes into society's system) outside; According to preparing, carry out above-mentioned (1 with embodiment 1 same method) ~(7) the middle evaluation of putting down in writing.
(comparative example 1)
Remove when preparation binding agent synusia; As (A))) composition uses (A) dimer acid polyamide resin (" Macromelt (マ Network ロ メ Le ト) " (registered trade mark)6900 Japan Ltd. (ヘ Application ケ Le ジ ャ パ Application society) system of 100 weight portions; Amine value 0; Melt viscosity 10Pas); (C) epoxy resin of 80 weight portions ((D) curing accelerator (2-ethyl-4-methylimidazole (2E4MZ) of " Epikote (エ ピ コ ー ト) " (registered trade mark)YL980 Epoxy Resins Co. (ジ ャ パ Application エ Port キ シ レ ジ Application society) system) weight portion; Tokyo changes into the system) of society; And do not use outside (B) composition; According to preparing, carry out above-mentioned (1 with embodiment 1 same method) ~(7) the middle evaluation of putting down in writing.
(comparative example 2)
Remove when preparation binding agent synusia; As (A) ~(D) composition uses (A) ABS resin diene resin (" ipol " (registered trade mark)1043 Corporation (Japanese ゼ オ Application society) system) of 100 weight portions; (B) resol (CKM1634 of 50 weight portions is clear to make) with macromolecule society; (C) epoxy resin of 80 weight portions ((D) curing accelerator (2-ethyl-4-methylimidazole (2E4MZ) of " Epikote (エ ピ コ ー ト) " (registered trade mark)YL980 Epoxy Resins Co. (ジ ャ パ Application エ Port キ シ レ ジ Application society) system) weight portion; Tokyo changes into society's system) outside; According to preparing, carry out above-mentioned (1 with embodiment 1 same method) ~(7) the middle evaluation of putting down in writing.
(comparative example 3)
Except that use aluminium foil (the thick (Sumikei Aluminum of 50 μ m Foil Co. (live light ア Le ミ Co., Ltd.) system) coefficient of linear expansion 22.0ppm as (2) support); According to preparing, carry out above-mentioned (1 with comparative example 2 same methods) ~(7) the middle evaluation of putting down in writing.
(comparative example 4)
Will be except that using as the aluminium foil of (2) support (the thick (Sumikei Aluminum of 50 μ m Foil Co. (live light ア Le ミ Co., Ltd.) system) coefficient of linear expansion 22.0ppm) the two sides be covered the goods that form as (3) support coating with the polyamide-imide resin of 300 ℃ of the Tg of 3.0 μ m, weight average molecular weight 11000, epoxy resin mixing ratio 10%; According to preparing, carry out above-mentioned (1 with comparative example 2 same methods) ~(7) the middle evaluation of putting down in writing.
(1) bond layer, (2) support, (3) support coating, (4) cross section, the hole coating that use in each embodiment, the comparative example are illustrated in the table 1,2.In addition, the laminating temperature that circuit is formed with Copper Foil is illustrated in the table 3,4 with the mensuration result.
[table 1]
Figure 2011800167659100002DEST_PATH_IMAGE002
[table 2]
Figure 2011800167659100002DEST_PATH_IMAGE004
[table 3]
Figure 2011800167659100002DEST_PATH_IMAGE006
[table 4]
Figure 2011800167659100002DEST_PATH_IMAGE008
Utilizability on the industry
According to the present invention, owing to when keeping excellent insulating properties and punching characteristic, have excellent wire-bonded property and low crimpiness, institute is so that easy package design and heat dissipation design become possibility.Using metal of the present invention to support the electronic unit of flexible substrate to have the required chemical proofing of circuit fabrication utilizes the high voltage drive of metal support substrate circuit to become possible insulating properties with making; The formation of reel-to-reel processing or punching processing, fly line is easy, compare with existing electronic unit make simply and cheaply heat dissipation design become possibility.

Claims (10)

1. metal is supported flexible substrate; Said metal supports flexible substrate to be made up of (1) bond layer and (2) support; It is characterized in that (2) support is made up of metal forming, and (1) bond layer contains (A) and contains the polyamide of dimeric dibasic acid residue and (B) phenolic resins.
2. the metal of claim 1 is supported flexible substrate, it is characterized in that, constitutes (3) support coating in (1) of (2) support bond layer one side and/or an opposite side.
3. the metal of claim 2 is supported flexible substrate, it is characterized in that (3) support coating has fissility with respect to (2) support.
4. claim 2 or 3 metal are supported flexible substrate, it is characterized in that, the thickness of (3) support coating is that 2 μ m are above and below the 100 μ m.
5. each metal is supported flexible substrate among claim 2 ~4, it is characterized in that (3) support coating contains polyamide-imide resin.
6. each metal is supported flexible substrate among claim 1 ~5, it is characterized in that the amine value that (A) contains the polyamide of dimeric dibasic acid residue is 0.5 ~ 10.
7. each metal is supported to it is characterized in that flexible substrate among claim 1 ~6, and (2) support is to be selected from a kind of in Copper Foil, stainless steel foil, aluminium foil and the nickel foil.
8. use automatic joint of belt of each metal support flexible substrate among claim 1 ~7 to support carrier band with metal.
9. use the LED installation of each metal support flexible substrate among claim 1 ~7 to support flexible circuit board with metal.
10. laminated circuit forms with the metal of Copper Foil and supports flexible circuit board; It forms the metal support flexible circuit board with Copper Foil for the laminated circuit that uses each metal support flexible substrate among claim 1 ~7; It is characterized in that having the fly line structure with the formed circuit of metal level through circuit formation.
CN2011800167659A 2010-03-30 2011-03-03 Metal support flexible board, metal support carrier tape for tape automated bonding using same, metal support flexible circuit board for mounting led, and copper foil-laminated metal support flexible circuit board for forming circuit Pending CN102822953A (en)

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