TW201207968A - Metallic supporting flexible substrate and metallic supporting carrier tape for tape automated bonding using same, metallic supporting flexible circuit substrate for LED mounting and copper foil laminated metallic supporting flexible - Google Patents

Metallic supporting flexible substrate and metallic supporting carrier tape for tape automated bonding using same, metallic supporting flexible circuit substrate for LED mounting and copper foil laminated metallic supporting flexible Download PDF

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Publication number
TW201207968A
TW201207968A TW100110739A TW100110739A TW201207968A TW 201207968 A TW201207968 A TW 201207968A TW 100110739 A TW100110739 A TW 100110739A TW 100110739 A TW100110739 A TW 100110739A TW 201207968 A TW201207968 A TW 201207968A
Authority
TW
Taiwan
Prior art keywords
metal
support
flexible substrate
resin
layer
Prior art date
Application number
TW100110739A
Other languages
Chinese (zh)
Inventor
Akihiro Maeda
Eiji Ono
Yasushi Sawamura
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of TW201207968A publication Critical patent/TW201207968A/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/049—Nitrides composed of metals from groups of the periodic table
    • H01L2924/0494—4th Group
    • H01L2924/04941—TiN
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Structure Of Printed Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention provides a metallic supporting flexible wiring substrate which can be processed by reel to reel and packaging design, heat dissipation design are easy because of not only having excellent insulating properties and punching properties but also having excellent wire bonding properties and low curling properties. In the metallic supporting flexible wiring substrate formed from (1) adhesive layer and (2) supporting body layer, (2) supporting body is formed by metallic foil and (1) adhesive layer comprises (A) polyamide resin having dimer acid residue and (B) phenol resin.

Description

201207968 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種金屬支撐可撓性電路基板 言之’關於封裝半導體積體電路（IC)之際所用之恶 式自動結合（TAB)或球格式陣列（BGA)封 ： 層（interp〇Ser)等之半導體裝置連接用基板， 二 ::製作刷或功率系元件之封裝用基板的電；構：： 金屬支撐可撓性基板。 牛用 【先前技術】 可撓性基板係由載體.接著層· 笪π城丄 席逼路形成用導體Μ 之·彎曲性優異的電路形成用基板，將目的之‘ 此構件#封裝於所形成的導體f路層巾之後 光阻或覆層薄膜而實施電路# 1 ^ ^ 精由谇錫 配線圍繞或1C封裝用之中人庙仏成 俄。。之各種 ^ 中7丨層所廣泛利用之配線板。 I1边著電子機器之普及，p μ & ^ ^ 的規,s及，已開發各式各樣之電子構件 的現在，也隨著小型4卜、古h _ ^•化回进度化的電路基板每單位俨 積之消耗電力持續上升伋母早位體 φ .^ , 卩使對於可撓性電路基板，也 要求兼顧按照適用部位之許 也 :尤其’由於驅動電壓高、散熱量多，且在 ： 要求尚絕緣性能的電漿顯 " 電故 丁益驅動用驅動1C之可撓性 玉路基板’或在用以封裝 的T Fn _ A u發先所造成的局部散熱量多 led 7C件之可撓性電路其 檣儿 基板中，為了對應於進一步高 為月匕化·高速化•高輸出化 ^ ^ ^. ., 0 ^ 之技術，一邊維持絕緣性能 弋低捲曲性，且一邊使耐 匕 問題。 .、，、〖生·散熱設計性提高已成為 201207968 緣破 路裝 作為 獻1 性， 撓性 不可 狀態 顯示 底基 專利 在正 間之 作為 LED 結合 形下 挾住 發生 〔先 〔專 因此’有人提案—種能夠防止因線結合 :之基板’其係將具有高散熱性之金屬基板作4 置之基板使用’同時也將- 于也將一氧化矽溶膠系無機清漆 絕緣層而配置於該金眉其 / i屬基板上（例如，參閱專利 )° 然而，由於二氧化矽溶朦 膠系無機清漆不·具有可撓 在可撓性電路基板中， + # w 於絕緣層中發生裂痕，或可 電路基板之捲曲大，以搽般 ^ 以捲盤至捲盤之加工流動成為 此，於用於自動結合方.笙 ^ ^ 万式專，具有樹脂層之半硬化 控制或穿孔性等之確保為困難等之問題。 另外，利用金屬支撐層之方半 _ ,. m 万法’有人提案一種液晶 凡件用TAB捲帶載體，复特 體之基底金屬上，…：：：將接著劑塗布於基 文獻2)。 ’、…鋼圖案（例如，參閲 然而，由於在絕緣層之正 L 具有導電層之構造且 上方已配設所形成的電路，斜料 lL Λ ’’對一邊保持電路配線 絕緣性與各電路配線-支撐 勾嗜之絕緣性，且一邊 驅動電壓高的電漿顯示器用 ™ Α . ,Λ 動1C或散熱量多的 封裝用基板而抓用，絕綾性能 月匕不足。另外，如自動 方式來在主顧步驟内逐次積層 ,_ 聲路形成用銅箔之情 ，由於接者劑層被電路形成用铜 ^ 而無接著劑層之吸濕水分脫除支撐體銅消所 發泡等之問題。刀脫除處’接著劑層中具有 前技術文獻〕 利文獻〕 201207968 8-288605號公報 8-055880號公報 專利文獻1 :曰本特開平 專利文獻2 :曰本特開平 【發明内容] 〔發明所欲解決之問題〕 為目的，由 邊具有優異 方式加工， 本發明係提供—種金屬支撐可撓性基板 於-邊維持優異的絕緣性及穿孔特性，且— 的線、·β σ I·生或低捲曲性，能夠以捲盤至捲盤 封裝設計與散熱設計為容易。 〔解決問題之手段〕 為了解決上述問 係利用金屬箔而構成 (A)二聚物酸殘基 〔發明之效果〕 題，本發明之金屬支撐.可撓性基板 支撑體，且（1 )接著劑層為含有含 之聚醯胺樹脂及（B )酚樹脂。 右根據本發明’能夠一邊維持優異的絕緣性及穿孔 且，且一邊具有優異的線結合性或低捲曲性，便能夠容 :封裝π计與散熱設計。使用本發明之金屬支撐可撓 土板的电子構件係具有使在電路加工所必要的财藥品 或金屬支撐基板電路之高電壓驅動成為可能的絕緣 生使捲盤至捲盤之加工或穿孔加工、飛線之形成為容 易且便月匕夠車交習知《電子構件為簡單且低成本散熱設 計0 【實施方式] 〔用於實施發明之形態〕 以下’針對本發明而詳加說明。 本發明之金屬支撐可撓性基板係（丨）接著劑層為含 有含（A )二聚物酸殘基之聚醯胺樹脂。 201207968 在含（A)二 係工業上最高分 的煙基而疏水性 酸聚醯胺樹脂係 軟性的低吸水率 撓性基板而具有 醯胺鍵之強的鍵 使用具有二聚物 撓性基板所要求 邊良好地維持捲 孔性。另外，穿 抑制因使接著劑 發泡。基於強韌 有碳數3 6之二美 酸殘基之聚醯胺 也可以使用二種 具有二聚物 進行的二聚物酸 酸以外之己二酸 合成分而含有。 之習知者，也可 於本發明中 價較佳為0.5至 示於滴定聚酸胺 當量的 mg數量 聚物酸殘基之聚醯胺樹脂中之二聚 子里領域之二鹽基酸，由於具有體 大。藉此，由二聚物酸所衍生的二 由於結晶性小，一邊維持富既強韌 ’且一邊為了實現本發明之金屬支 對必要有機溶劑的溶解性。更具有 結力之耐水解性或難燃性。因而， 酉欠殘基之聚酿胺樹脂，一邊維持作 的耐藥品性、難燃性及低捲曲性， 帶式自動結合方法及其類似方法中 孔後配設電路用金屬層起，能夠良 完全硬化之際的樹脂吸濕水分所造 性或製膜性及加工性之觀點，較佳 史酸殘基的聚醯胺樹脂。若為具有二 樹脂的話’能夠使用習知之各種樹 以上。 酸殘基之聚醯胺樹脂係藉由常用方 與二胺之縮聚合所獲得，此時將二 、壬二酸及癸二酸等之二羧酸作為 二胺能夠使用乙二胺、己二胺及α底 以使用二種以_L。 ，具有二聚物酸殘基之聚醯胺樹脂 1 〇，更佳為0.5至8。於此所謂胺價 樹脂1 g之際所需要的鹽酸中，氫氧 者。含有二種以上聚醯胺樹脂之情 物酸 積高 聚物 且柔 撐可 源自 藉由 為可 且一 之穿 好地 成的 為具 聚物 脂， 法所 聚物 共聚 啶等 的胺 係表 化鉀 形， 201207968 係心於滴疋以（〗）接著劑層中之含量比來混合各聚醯胺 樹脂之樹脂混合物丨g之際所需要的鹽酸令，以氫氧化鉀 當量的mg數量所示之胺價。若胺價為0.5以上，（1 ) 接著劑層之交聯密度變高，於是不僅能夠提高所獲得之 可撓性基板對於鹼液或有機酸混合液之耐藥品性或絕緣 耐久性，也能夠對於將IC封裝時之線結合或覆晶熱壓力 而使樹脂變形止於最小限，便能夠避免金屬支撐層與線 結合之接觸。另外，若胺價為1〇以下，能夠減低加工後 所獲得之配線板的捲曲量之絕對值，並且由於能夠適切 地保持接著劑之交聯反應速度，便能夠確保在接著劑半 硬化狀態下之保存安定性、在加工步驟之安定性。 具有二聚物酸殘基之聚醢胺樹脂，在丨9(rc之熔融 黏度較佳為l〇Pa. s以上，更佳4 2〇Pa· s以上。若在 19〇t之熔融黏度為1〇 Pa. s以上，由於可以獲得（〇 接著劑層之造膜性、或對於（1)接著劑層之真正硬化時 令之對吸濕水分發泡之_久性，便能夠更穩定的加工。 另外’在1 90 c之熔融黏度較佳為丨9〇 Pa · s以下，更佳 為100 Pa.S以下。若在190t之熔融黏度較佳為19〇 h二以下’於配設電路形成用金屬層之際，由於無高溫 下進行處理之必要’便能夠將電路層之熱劣化或熱鹿力 發生抑制至最小限度。於此，在㈣之熔融黏度能夠 根據nSK721㈡999附屬t c記載之表觀的黏“定而 :出。含有二種以上聚酿胺樹脂之情形，使用α⑴接 著d層中之3里比而混合各聚醯胺樹脂之樹脂混 測出。 201207968 另外，具有二聚物酸殘基之聚醯胺樹脂較佳為含有 聚醚醯胺樹脂。聚醚醯胺樹脂係於高分子量化之際也能 夠富有可撓性、減低加工後所獲得之配線板的捲曲量之 絕對值。 另外，本發明之金屬支撐可撓性基板係（丨）接著劑 層含有（B )酚樹脂。若酚樹脂為1分子内含有2個以上 之酚性羥基者的話，並未予以特別限定，能夠使用酚醛 型酚樹脂、曱階酚醛型酚樹脂等之習知酚樹脂中任一 種。具體而言，例如可舉例：具有酚、甲酚、對三級丁 基酚、壬基酚、對苯基酚等之烷基取代酚；莊、二環戊 二烯等之環狀烷基改性酚；具有含硝基、幽素基、氰基、 胺基等之雜原子之官能基者；具有萘、蒽等之骨架者； 由雙酚F、雙酚A、雙酚S、間苯二酚、焦掊酚等之多官 忐酚所構成之樹脂。另外，也可以使用上述二種以上。 從絕緣信賴性之觀點，較佳為使用甲階酚醛型酚樹脂。 於本發明之（1 )接著劑層中，相對於含有（A )二 聚物酸殘基之聚醯胺樹脂100重量份，（B )酚樹脂之含 量較佳為10重量份以上，更佳為3〇重量份以上。另外， 較佳為200重量份以下，進一步較佳為16〇重量份以下。 若（B)酚樹脂之含量為1〇重量份以上絕緣信賴性、 f高溫高濕處理下之接著力耐久性將提高；若為2〇〇重 量份以下，則具有優異的可撓性。 ^於本發明t，（丨）接著劑層也可以含有（c)環氧 樹脂。環氧樹脂較佳為具有2個以上環氧基者，較佳為 具有雙酴A '雙紛F、雙紛s、間苯二紛、二經基萘、二 201207968 環戊二烯二酚、二環戍二烯二甲苯酚等之 醚；酚酚醛、甲酚酚醛、三苯酚基尹π —衣軋丙基 基乙烷、環氧化間二甲苯二胺、環！ ％氧化四笨酚 衣氧％己烧、援备 庚烷、環氧環戊烷等之化學構造。 乳二環 另外，除了卢片 外，較佳為具有合計3個以上”展虱基之 〜田締丙基、甲Α 基、胺基、羥基及羧基所構成之族 Α烯酸 部位。含有二種以上不同的化學 干反應 久愿α卩位之情形 單位分子内所具有之全部種類的化風 ，〜計 3個以上。雖然化學反應部位之位一“立數最好為 但較佳為至少在側鏈上具有化學予以特別限制’ 以使用二種以上之上述環氧樹脂。 也可 於本發明中，（1)接著劑層也可以含 加速劑。例如，可舉例：芳香族聚胺、2_烷基"：化 唑、2-苯基-4-烷基味唑等之。米唑衍生 /甲基味 -^ # ^ 物，一亂基二醢胺、 二本土膦、三氮雜二環十—稀等習 等之二種以上。 也了以使用此 #丨於本發明中，⑴接著劑層也可以含有⑻填充 填充劑只要為不損害接著劑之特性者，並未予以特 別限定，無機填充劑可舉例 ' 笪+人孟銀、銅、鐵、鎳、鋁 ^金屬訪；氫氧化鎂、氫氧化H㈣鹽水合 之金屬虱氧化物、氧化鋁、氧化锆、氧化鋅、三氧 化銻、五氧化銻、氧化鋁、 乳化鎮氧化鈦、氧化鐵、 氧化鈷、氧化鉻、滑石等之金屬氧化物；碳化石夕、碳化 鈦、二氧化_、氮化、氮化鈦、氮切、或碳酸約等 之無機鹽；碳黑、二氧仆功 .^ 乳化矽、玻璃等。其中，較佳使用 -10- 201207968 二氧化石夕、氧化銘、氮化銘、氫氧化鎂、氫氧化紹等。 於此，二氣化石夕可以為非晶、結晶中任一種按照各自 所具有的特性而可以適當使用，並未予以限定。以提古 此等之無機質填充劑之接著性或填充性等為目的，也； 以使用石夕炫搞合劑等而實施表面處理。無機質填充劑之 粒徑並未予以特別限定，但基於分散性及塗布性、透明 性等之觀點，平均粒徑較佳為0·02至3〇 μηι。 有機填充劑可舉例：苯乙烯、舰橡膠、丙烯酸橡 膠、聚醯胺、聚醯亞胺1氧燒等之交聯聚合物。若考 量分散安定性時，微粒狀之有機填充劑的平均粒徑較佳 為 0.2 至 5 μηι。 除了以上之成分以外，於不損害接著劑特性之範圍 内也含有抗氧化劑、離子捕捉劑等，並無特別之限制。 只要抗氧化劑為賦予抗氧化之機能者並未予以特另” 定，能夠使用盼系抗氧化劑、 氧化劑、胺系抗氧化劑等習知 此等之二種以上。 硫鱗系抗氧化劑、磷系抗 之抗氧化劑。也可以使用 本發明之金屬支撐可撓性基板俜 汉饰〔2 )支撐體利用金 屬箔所構成。能夠藉由將金屬箔用於 ja叉撐體而使電路基 板之熱傳導性提高，極小化散熱板 寸。還有，本發明 之里屬支撐可撓性基板係因穿孔加 工尋所造成的元件孔 之形成為容易’藉由使用元件孔而從電路形成面之背面 封裝IC4 LEC元件等之被封裝構件，能夠將（2)支樓 體本身作為散熱板使用或使對熱水槽之熱傳導性提高。 201207968 :屬較佳使用銅落、不銹鋼结、紹结 要求機能，也可以使用磷青鋼二…奴照用途· 鎂箔、鈦續劣入古μ ’。等之其他銅合金泊、鎳箔、 衡，勒咏 3 之合金箔等，配合封襞整體之均 、，“、、膨脹係數能夠適當 (2)古浐μ 田达擇10至3〇ppm/〇C之金屬猪。 )支禮體之厚度能夠配合 而適當選擇，較佳使用12二=的可撓性、撕裂強度 至75 _。 至150 更佳使用12 μιη 之易I : ’為（2)支撐體之金屬羯係以（1 )接著劑層 之易接著性或絕緣性之 笮4甩 # & 予、避免外觀光澤性之變更與 電路形成時之藥品曝露等 — 機耗合處理、◎全ί 貫施有機.無 虚理 或鍍金、祕脂被覆、陶瓷層形成等之表面 構成=(2)支撐體之（u接著劑層侧及/或其相反側 構成（3 )支撐體被覆層。 基於被覆強度與捲車由操作性均衡 電路導體層的絕緣信賴性強化之觀點，（3)支標體被覆 :之厚度的下限較佳為2,以上，更佳為2 5 _以上。 一外’上限較佳為100 _以下，更佳為1 0 μιη以下。進 步車乂佳為低於5 μηι。另外，（3 )支撐體被覆層之層 構造’可以為單層或複數層。 以將樹脂用於（3 )支撐體被覆層之情形，雖然並未予 以=別限定，較佳為使用具有優異的耐熱性•耐藥品性 ,知·亞胺秘爿曰或聚酸胺醯亞胺樹脂，從¢)•藥品性賦予 =易接著性賦予之觀點，特佳為使用聚醯胺醯亞胺樹 月曰。由於能夠獲得本發明之含有（A )二聚物酸殘基之聚 醯胺祕脂及含有（B )酚樹脂之（1 )接著劑層的高接著 -12- 201207968 力，特佳為聚醯胺醯亞胺樹脂。從耐濕熱性. _ 而ί樂品性 之觀點，可用於（3 )支撐體被覆層之聚醯胺醯亞胺樹脂，201207968 VI. OBJECTS OF THE INVENTION: 1. Field of the Invention The present invention relates to a metal-supported flexible circuit substrate, which is described as a "viomatic automatic bonding (TAB) or ball for packaging a semiconductor integrated circuit (IC). Format array (BGA) package: a substrate for semiconductor device connection such as a layer (interp〇Ser), two: a device for forming a package for a brush or a power element; and a structure: a metal-supported flexible substrate. [Prior Art] The flexible substrate is made of a carrier, and the substrate is formed by a substrate for forming a circuit for forming a conductor Μ which is excellent in flexibility. The conductor f-layer towel is then resisted or coated with a film to implement the circuit # 1 ^ ^ fine by the tin-nickel wiring or 1C package with the middle of the temple. . The various types of wiring boards widely used in the 7-layer. I1 is popular with electronic devices, p μ & ^ ^ rules, s and, has developed a variety of electronic components, and now with the small 4 Bu, ancient h _ ^• back to the progress of the circuit The power consumption per unit of the substrate is continuously increased, and the mother's early body is φ.^, so that the flexible circuit board is also required to be compatible with the applicable parts: in particular, because of the high driving voltage and the large amount of heat dissipation, In: Requires the plasma performance of the insulation performance, "Electricity Dingyi drive drive 1C flexible jade substrate" or the local heat dissipation caused by the T Fn _ A u package used for packaging led 7C In the flexible circuit of the device, in order to cope with the high-speed, high-speed, high-output, and high-output technology, the insulation performance is low and the curl is maintained. Make the problem of sputum. ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Proposal - a substrate capable of preventing wire bonding: a substrate in which a metal substrate having high heat dissipation property is used as a substrate, and a metal oxide varnish-based inorganic varnish insulating layer is also disposed in the gold Eyebrow/i is on the substrate (for example, see patent) ° However, since the cerium oxide-based inorganic varnish does not have flexibility in the flexible circuit substrate, + #w cracks in the insulating layer, or The circuit board can be curled to a large extent, and the processing flow from the reel to the reel can be used for the automatic bonding, and the semi-hardening control or perforation of the resin layer can be ensured. For problems such as difficulties. In addition, the use of a metal support layer half _ , . m 10000 method has been proposed for a liquid crystal workpiece TAB tape carrier, on the base metal of the complex, ...::: the adhesive is applied to the base document 2). ', ... steel pattern (for example, see, however, since the positive layer L of the insulating layer has a structure of a conductive layer and the formed circuit is disposed above, the oblique material lL Λ '' maintains circuit wiring insulation and each circuit on one side Wiring-supporting the insulation of the hook, and the TM Α for the plasma display with high driving voltage, and the 1C or the package substrate with a large amount of heat dissipation is used, and the performance is insufficient. In order to build the copper foil in the step of the customer, the copper layer is formed by the sound path, and the copper is formed by the circuit layer, and the moisture absorption of the adhesive layer without the adhesive layer is removed. [Knife removal] has a prior art document in the adhesive layer. [Library] 201207968 8-288605, Japanese Patent Publication No. 8-055880 Patent Document 1: 曰本特开平 Patent Document 2: 曰本特开平 [Abstract] [ OBJECTS TO BE SOLVED BY THE INVENTION For the purpose of processing in an excellent manner by the side, the present invention provides a metal-supported flexible substrate which maintains excellent insulation and perforation characteristics at the side, and - line, ?? σ I ·sheng Or low curling property, it is easy to design from reel to reel package design and heat dissipation. [Means for Solving the Problem] In order to solve the above problem, the metal paste is used to form (A) dimer acid residue [effect of the invention] The metal support of the present invention is a flexible substrate support, and (1) the adhesive layer contains a polyamine resin and (B) a phenol resin. According to the present invention, it is capable of maintaining excellent insulation properties and By perforating and having excellent wire bonding or low curling property on one side, it is possible to accommodate a package π meter and heat dissipation design. The electronic component using the metal supporting flexible soil plate of the present invention has the necessary resources for processing in the circuit. The high-voltage drive of the drug or metal-supported substrate circuit makes it possible to make the reel-to-reel processing or perforation processing, the formation of flying leads easy and easy to handle. "Electronic components are simple and low-cost. [Embodiment] [Embodiment] The present invention will be described in detail with reference to the present invention. The metal-supported flexible substrate-based adhesive layer of the present invention contains Polyamide resin containing (A) dimer acid residue. 201207968 The low-absorbency flexible substrate having a soft acid-polyamide resin which is the highest in the (A) industrial system and the soft acid-polyamide resin The strong bond of the amide bond maintains the hole-punching property as required by the diene flexible substrate. In addition, the abrasion inhibits the foaming of the adhesive. The toughness has a carbon number of 36 diammonic acid residues. The polyamine can also be contained by using adipic acid synthesis component other than the dimer acid having two dimers. It is also preferred in the present invention that the price is preferably 0.5 to the titration. The dibasic acid in the dimer of the polyamidamine resin of the polyacid amine equivalent of the polyacid amine equivalent of the polyamine resin has a bulk. Thereby, the two derived from the dimer acid maintains the richness and toughness while maintaining the solubility in the organic solvent necessary for realizing the metal branch of the present invention. More resistant to hydrolysis or flame retardancy. Therefore, the polyamine resin which owes the residue can maintain the chemical resistance, flame retardancy and low curling property of the residue, and the tape type automatic bonding method and the like can be used for the metal layer for the post-hole arrangement circuit. From the viewpoint of the resin moisture-absorbing property at the time of complete hardening, the film forming property and the processability, a polyamine resin having an acid residue is preferred. If it is a resin, it is possible to use various trees or more. The polyamine resin of the acid residue is obtained by polycondensation of a common side with a diamine. In this case, a dicarboxylic acid such as disuccinic acid or sebacic acid can be used as the diamine. Ethylenediamine can be used. The amine and the alpha base are used in two types with _L. The polyamine resin having a dimer acid residue is preferably 0.5, more preferably from 0.5 to 8. Here, in the hydrochloric acid required for the amine resin 1 g, hydrogen hydroxide is used. The acid-accumulating polymer containing two or more kinds of polyamidamide resins and the softening can be derived from an amine system which is a polymerized grease, a copolymer of a copolymer, etc., which can be formed by a good one. Potassium Form, 201207968 The amount of mg of potassium hydroxide equivalent to the amount of potassium hydroxide equivalent required to mix the resin mixture of each polyamide resin in the ratio of the amount of the drop in the adhesive layer. The amine price shown. When the amine value is 0.5 or more, (1) the crosslinking density of the subsequent layer becomes high, so that the obtained flexible substrate can be improved not only for chemical resistance or insulation durability of the lye or organic acid mixture, but also The bonding of the metal supporting layer to the wire can be avoided by limiting the deformation of the resin by wire bonding or flip chip thermal stress during IC packaging. In addition, when the amine value is 1 Torr or less, the absolute value of the amount of crimping of the wiring board obtained after the processing can be reduced, and since the crosslinking reaction rate of the adhesive can be appropriately maintained, it is possible to ensure the semi-hardening state of the adhesive. Preservation stability, stability in the processing steps. The polyamidamide resin having a dimer acid residue is preferably 丨9 (the melt viscosity of rc is preferably l〇Pa.s or more, more preferably 4 2 〇Pa·s or more. If the melt viscosity at 19 〇t is 1 〇Pa. s or more, since it can be obtained (the film-forming property of the adhesive layer, or the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Further, the melt viscosity at 1 90 c is preferably 丨9〇Pa·s or less, more preferably 100 Pa·s or less. If the melt viscosity at 190t is preferably 19〇h or less, the circuit is disposed. When forming a metal layer, it is possible to minimize the thermal deterioration of the circuit layer or the thermal deer force due to the necessity of processing at a high temperature. Here, the melting viscosity in (4) can be expressed in accordance with nSK721(B) 999 subsidiary tc. The viscosity of the view is determined: the case where two or more kinds of polyamine resin are used, and the mixture of α(1) and 3 of the d layer is mixed with the resin of each polyamine resin. 201207968 In addition, there is a dimer. The polyamine resin of the acid residue preferably contains a polyether phthalamide resin. In the case of high molecular weight, it is also flexible and reduces the absolute value of the amount of crimping of the wiring board obtained after processing. Further, the metal-supported flexible substrate (丨) adhesive layer of the present invention contains (B) The phenol resin is not particularly limited as long as it contains two or more phenolic hydroxyl groups in one molecule, and any of conventional phenol resins such as a novolac type phenol resin and a resol type phenol resin can be used. Specifically, for example, an alkyl-substituted phenol having a phenol, a cresol, a p-tertiary butyl phenol, a nonyl phenol, a p-phenylphenol or the like; a cyclic alkyl group of Zhuang, Dicyclopentadiene or the like can be exemplified. Phenolic phenol; a functional group having a hetero atom containing a nitro group, a leucoyl group, a cyano group, an amine group or the like; a skeleton having a naphthalene or an anthracene; a bisphenol F, a bisphenol A, a bisphenol S, an isophthalic acid A resin composed of a plurality of phenols such as diphenol or pyrogallol, and two or more of the above may be used. From the viewpoint of insulation reliability, a resol type phenol resin is preferably used. 1) in the adhesive layer, relative to the poly(醯) containing the (A) dimer acid residue The content of the (B) phenol resin is preferably 10 parts by weight or more, more preferably 3 parts by weight or more, more preferably 200 parts by weight or less, still more preferably 16 parts by weight or less. (B) The content of the phenol resin is 1 part by weight or more, the insulating reliability, the durability of the adhesive force under the high-temperature and high-humidity treatment is improved, and when it is 2 parts by weight or less, the flexibility is excellent. The t, (丨) adhesive layer of the present invention may also contain (c) an epoxy resin. The epoxy resin preferably has two or more epoxy groups, preferably has a double fluorene A 'double F, double s , isophthalic acid, dipyridyl naphthalene, two 201207968 cyclopentadiene diphenol, dicyclononadiene xylenol, etc.; phenol phenolic aldehyde, cresol novolac, trisphenol yin π Ethane, epoxidized m-xylene diamine, ring! % Oxidation of tetraphenylphenol Oxygen is burned, and chemical structures such as heptane and epoxycyclopentane are supported. Further, in addition to the ruthenium, the ruthenium ring is preferably a decenoic acid moiety having a total of three or more "extension bases", a hydrazide group, an amino group, a hydroxyl group and a carboxyl group. A variety of different chemical dry reactions, long-awaited α-position, all types of chemical winds in the unit molecule, ~ 3 or more. Although the position of the chemical reaction site is "the best number, but preferably at least There is a chemical restriction on the side chain to use two or more of the above epoxy resins. Also in the present invention, (1) the adhesive layer may also contain an accelerator. For example, an aromatic polyamine, a 2-alkyl group, a azole, a 2-phenyl-4-alkyl oxazole or the like can be exemplified. Mazole-derived / methyl-flavor - ^ # ^ substance, a chaotic diamine, two indigenous phosphine, triazabicyclo-decaine, etc., two or more. In addition, in the present invention, (1) the adhesive layer may contain (8) the filler filler as long as it does not impair the characteristics of the adhesive, and is not particularly limited. The inorganic filler may be exemplified as '笪+人孟银, copper, iron, nickel, aluminum ^ metal visit; magnesium hydroxide, H(tetra) hydroxide, metal lanthanum oxide, alumina, zirconia, zinc oxide, antimony trioxide, antimony pentoxide, alumina, emulsified town oxidation a metal oxide of titanium, iron oxide, cobalt oxide, chromium oxide, talc, or the like; an inorganic salt such as carbon carbide, titanium carbide, titanium dioxide, nitrogen nitride, titanium nitride, nitrogen cut, or carbonic acid; carbon black, Dioxane servant. ^ Emulsified enamel, glass, etc. Among them, it is preferred to use -10- 201207968 dioxide dioxide, oxidation, nitriding, magnesium hydroxide, hydrazine and the like. Here, the two gas fossils may be suitably used in any of amorphous and crystalline, and are not limited as long as they have respective characteristics. For the purpose of the adhesion or filling property of the inorganic fillers of the above-mentioned inorganic fillers, the surface treatment is carried out by using Shi Xixuan or the like. The particle size of the inorganic filler is not particularly limited, but the average particle diameter is preferably from 0·02 to 3 〇 μηι from the viewpoints of dispersibility, coatability, transparency and the like. The organic filler may, for example, be a crosslinked polymer of styrene, marine rubber, acrylic rubber, polyamide or polyoxyimide. When the dispersion stability is considered, the average particle diameter of the particulate organic filler is preferably from 0.2 to 5 μη. In addition to the above components, an antioxidant, an ion scavenger, and the like are also contained within a range not impairing the characteristics of the adhesive, and are not particularly limited. As long as the antioxidant is not a function of the antioxidant function, it is possible to use two or more kinds of antioxidants, an oxidizing agent, an amine-based antioxidant, etc., sulfur-based antioxidants, phosphorus-based antioxidants. The antioxidant can also be used. The metal-supported flexible substrate of the present invention can be made of a metal foil. The support can be made of a metal foil by using a metal foil for the y-fork support. Further, in the present invention, the support for the flexible substrate is formed by the hole punching, and the formation of the component hole is easy to 'package the IC4 LEC from the back surface of the circuit forming surface by using the component hole. The packaged member such as a component can use (2) the building body itself as a heat sink or improve the thermal conductivity of the hot water tank. 201207968: It is a better use of copper drop, stainless steel knot, and the function required for the knot, and can also be used. Phosphorus-green steel II...susage use · Magnesium foil, titanium continuation into ancient μ '. Other copper alloy mooring, nickel foil, balance, alloy foil of Lele 3, etc., together with the overall sealing, Expansion coefficient can be appropriately ,, (2) Old Field of Ba μ to 10 Optional 3〇ppm / porcine 〇C of metal. The thickness of the ritual body can be appropriately selected according to the fit, and it is preferable to use 12 2 = flexibility and tear strength to 75 _. To 150, it is better to use 12 μιη Easy I: '(2) The metal lanthanide of the support is (1) the adhesion or insulation of the adhesive layer is 甩4甩, and the appearance gloss is avoided. Change and the exposure of the drug during the formation of the circuit - machine consumption treatment, ◎ full organic, non-virtual or gold plating, secret coating, ceramic layer formation, etc. Surface composition = (2) support (u adhesive The layer side and/or the opposite side thereof constitutes (3) the support coating layer. (3) The support body is covered: the lower limit of the thickness of the support based on the strength of the coating and the insulation reliability enhancement of the conductor layer of the operational equalization circuit. Preferably, it is 2 or more, more preferably 2 5 _ or more. The outer upper limit is preferably 100 Å or less, more preferably 10 μιη or less. The improved rut is preferably less than 5 μηι. In addition, (3) support The layer structure ' of the body coating layer' may be a single layer or a plurality of layers. In the case where the resin is used for the (3) support coating layer, although it is not limited, it is preferably used to have excellent heat resistance and drug resistance. Sex, knowing imine secrets or polyamidamine resin, from ¢) = Viewpoint of imparting easy adhesion, particularly preferred is the use of said polyamide-imide tree months. Since the polyamine amine ester containing the (A) dimer acid residue of the present invention and the (1) adhesive layer containing the (B) phenol resin are high, the -12-201207968 force is obtained. Amine amide resin. From the viewpoint of heat and humidity resistance _ and _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _

Tg (玻璃轉移溫度）較佳為3〇〇t以上，重量平均八曰 量較佳為1 0000以上，為了獲得與本發明之（^ )接== 層之高接著力，環氧樹脂較佳的已混合硬化者β .„ u )重ϊ %以 力汗3 )支撐體被覆層能夠按照目的而必 置於（1 )接著劑層側及其相反側中任一側，其中 或任兩側也可以賦予剥離性。所謂剝 =任—側 (3)支撐體被覆層之（2)支撐體剝離（2)支俨-&置有 部分，或是相反地’（3 )支撐體被覆層之：體之-⑺支撐體之表面’或是不會引起在盆他 刀殘留於 而能多_ ( 3)支撐體被覆層。將剝離性職之刻離， 著劑層側之（3)支撐體被覆層之情形，便能（1)接 後製品之無基材化；將剝離性賦予（丨）接著^成為加工 侧之（3 )支撐體被覆層之情形，維持對現存層側相反 線之耐藥液性之狀態，便能夠得到活用（2子的電路加工 散熱性基板。此情形下，（3 )支撐體被覆層土：體之高 上之層構造，連接於（2)支撐體之第一 / A、有二層以 或熱可塑性樹脂，第一層以外之至少一層曰黏著材及/ 烯烴、聚苯硫醚、聚乙烯丁縮醛、聚醋ϋ聚略、聚 醇、聚碳酸酷、聚醯胺、聚酿亞胺、聚酿胺“聚乙埽 甲基丙烯酸甲酯所選出的一種以上。藉此，亞胺及聚 有剝離性，另外上述第一層以外之至—屏第t 一層係具 保電路加工時之耐藥液性，且一邊確保剝二，邊確 度而易剝離化。 夺之板伸強 201207968 另外，在藉由穿孔等而形成元件孔或鉸鏈孔等之際 的孔剖面’以避免絕緣保護或電路形成時之藥品曝露為 目的，也可以實施利用電極沉積等所導致的樹脂被覆、 或氧化皮膜形成等之處理而進一步追加（4)孔剖面被覆 層。將樹脂用於（4)孔剖面被覆層之情开[較佳為使用 具優越之絕緣性、耐熱性、耐藥品性之環氧樹脂或聚醯 亞胺樹脂、聚醯胺醯亞胺樹脂、丙稀酸樹脂。 另外，於電路形成時，以避免對藉（2)支撐體或穿 孔所形成的元件孔剖面或鉸鏈孔剖面的藥品曝露之目 的，較佳為將光阻塗布於金屬支撐可撓性基板整面，另 外較佳為將背面封止材塗布於（2)支撐體之（丨）接著 劑層的相反側整面。 於電路形成時，大多使用藥品，藉由將光阻塗布於 金屬支撐可撓性基板之整面，避免在（2)支撐體上無（丄〕 接著劑層而使（2 )支撐體所露出之部分受到藥品之暴 露，能夠藉此而防止金屬支撐可撓性基板之損傷。另外， 藉由將背面封止材塗布於（2 )支撐體之（〇接著劑層 的相反側整面，能夠避免元件孔剖面或鉸鏈孔剖面的^ 品曝露。 本發明之金屬支撐可撓性基板也可以藉由於配置電 路形成用金屬層之前，在半硬化狀態下維持（1)接著劑 層，配置（5 )保護膜而作成金屬支撐承載帶。保護膜不 會損壞（1 )接著劑層之形態及機能而能夠剝離的話，並 未予以特別限定’㈣如’可舉例：$酯、聚稀烴、聚苯 硫醚、聚氯乙烯、聚四氟乙烯、聚偏氟乙烯、聚敦乙烯、 -14- 201207968 聚乙烯 醯胺、聚 此專缚膜 膜及積層 的紙等。 金屬 要的元件 置電路形 (飛線） 承載帶之 等，不僅 能夠利用 縮破壞所 接著 法，舉例 (a) 於溶劑中 乾燥，形 性基板。 機能的話 但為了維 布，更佳 未予以特 角輪）方 方式、照 '縮酸、聚醋酸乙掄、取 醯亞胺、聚 承乙烯醇、聚碳酸酯、聚 也甲基丙稀酸甲护堃#也 實施石夕氧化㈣= ㈣膜；對 此等薄膜之 A 之脫模齊1塗布處理的薄 、，、S浸或塗布具有脫模性之樹脂 支揮承載帶係藉由利用穿孔加工裳 孔後，剝離保1膜.. 專而於形成必 成用金屬層 積層法或喷霧法而配 风用金屬層’便能夠在 。若為使用飛線之封駐 成中空配線 表面或背面中任一 Γ:，由於能夠從金屬支樓 被封裝構件之配置性· IC < LED元件 線結合法而進—步避，政熱設計性將提高，也 造成的支撐體金屬步：免電:成為問題之絕緣層壓 ，針對本發明之製造金:形成層之絕緣破壞。 而加以說明。“金屬支樓可撓性基板之方 藉由將構成（1 )技发 而形成接著#丨塗料，在^層之樹脂組成物溶解 成（1 )接著劑層而獾 布 若符合接著性本發明之金屬支樓可挽 ，雖然（1)接著劑層少时、 寸 < 谷要本 之膜厚並未予以特別限定， 持可撓性，較佳成為 成為…。_的方㈣的方式來塗 別限定，可以配合塗从式來塗布。雖然塗方法並 式、唇型方式、㈣Μα 相凹版方式等之4=Meyerbar(梅爾棒） 版性塗布設備。乾燥條件通 -15- 201207968 节為1 00至2GGt、1至5分鐘。溶劑並未予以特別限 二…苯、氯苯等之芳香族系；f基乙基酮、 =丁基酮等之酮系，·二⑴醯胺、二甲基乙醯胺、 N-甲基…等之非質子系；乙醇、甲醇、異丙醇、正 :醇、卞醇等之醇系溶劑’也可以使用二種以上之此 溶劑。另外，使用不溶於 j 〔 D)硬化加速劑或（E ) 真充叙情形下，使用均㈣拌機、珠磨機、砂磨機、 ，氣触方式所進行的分散裝置等，能夠適合採用預先分 放於溶劑中之方法、或是使用擠壓機或班伯里混授機等 而預先㈣•分散構成⑴接著_之各㈣中^= 以上之方法等。 住 (b )利用記載於（a )夕古.土 &…1 , 戶中，^ i ± )之方法所形成的（1 )接著劑 增T ’必要時也可以積層 , ^ n 檟層具有脫模性之（5 )保護臈而獲 付本發明之金屬支撐可撓 卢 視性基板。進一步增加接著劑厚 所形成的⑴接著❹。Λ 疋 數積層 , 1 , 層另外’在（5 )保護膜上預先 金屈 積層（2 )支撐體而獲得本發明之 金屬支撐可撓性基板。 i ^ , f(3)支撐體被覆層配設於（2) 支探體上之情形下，較 ； 被覆層之樹脂溶解或分 又访菔 支樓 、 政於有機溶劑中之塗料，在（2 ) 支撐體X進仃塗布•乾燥而預先形成（3) 又货肢破覆層，另外， 之愔拟了 ^ 配置剝雒性的（3 )支撐體被覆層 燥所獲得之葙@德 積s法專而預先將進行塗布•乾 層所必f D於用以保持剝離剝離性樹脂 要的拉伸強度之薄膜。 -16- 201207968 對（2 )支撐體之（1 )接著劑層的積層條件通常係 溫度50至160°C、按壓0.1至〇.5MPae能夠判斷：積層 溫度較佳為140°C以下，若為12(rc以下的話則為良好γ 若為100°C以下的話 之 / 八1牙歷 )接著劑層側構成（3 )支撐體被覆層之情形，成 為將（1)接著劑層積層於在（2)支撐體配設有（3)支 撐體被覆層者，此情形也較佳為利用與對（2 )支撐體直 接積層（1 )接著劑層積層之情形同樣的條件進行積層。 於獲得本發明之金屬支撐可撓性基板後，也可以在 例如40至100。〇、進行20至300小時左右熱處理而調節 (1)接著劑層之硬化度。藉由調節硬化度，具有防止將 電路形成用金屬層配置於金屬支撐可撓性電路基板之際 的接著劑流動過多’同時也防止因加熱硬化時之水分所 造成的發泡之效果。 於使用本發明之金屬支撐可撓性基板的電路加工之 際，將（4 )孔剖面被覆層配設於所形成的元件孔或錢鏈 孔之情形’較佳為利用穿孔等而形成孔之後，利用電極 沉積塗裝法而使其形成。電極沉積塗裝法較佳為將負電 壓外加於（2 )支撐體’使正向分極的環氧樹脂系、聚醯 亞胺樹脂系等之電極沉積塗料析出於（2 )支樓體之孔剖 面的陽離子電極沉積塗裝法。另外，較佳為於實施電極 沉積塗裝後，使其電極沉積塗料加熱固定。 使用本發明之金屬支撐可換性基板之電子零件係對 電路加工具有必要之耐藥品性或對金屬支撐基板具有必 要之絕緣性，捲盤至捲盤之加工或穿孔加工，飛線之形 -17- 201207968 易’便能夠較習知之電子構件為簡單且低成本散 實施例 ’顯示本發明實施形態之—例，但是本發明並 不文此等之實施例 例之評估方法。 I先，說明在實施例及比較 金屬支撐可撓性電路基板之絕緣信賴性評估 3〇C、85%RH環境下，將100 V電壓外加於在 f導^^比較例中所獲得之金屬支料撓性電路基板 又50 μχη、導體間距離5〇 )， 直到1〇 Ω以nr炎L 士 為止之日守間設為絕緣耐久時間，絕緣耐久 時間較佳為25〇小時以上。 (2 )金屬支撐可撓性基板之捲曲量評估 藉使用氣化鐵之減去;^ (触刻）而去除在各實施例 及比k例所獲得之電路形成用賦銅箔的金屬支撐可撓性 基板之電路形成用銅箔後，裁斷成35 mmx 190 mm，作 成捲曲里6平估用金屬支撐可撓性基板。於23 °C /5 5 % RH 下’進灯捲曲量評估用金屬支撐可撓性基板之24小時調 濕後’將捲曲的基板端部朝上而靜置於玻璃板上之狀態 下’量測從經硬化之護膜被覆電路基板的玻璃板之最高 尚度位置而設為捲曲量。能夠判斷：若捲曲量為7 mm 以下的話則為良好，若為3 mm以下的話則極為良好。 (3 )金屬支撐可撓性基板之發泡評估 利用金屬顯微鏡而觀察上述（2)捲曲量評估用金屬 支樓可撓性基板之（1 )接著劑層來進行發泡評估。將直 -18- 201207968 徑5 μιη以上者視為發泡，將完全無發泡者標示〇，確認 將直控5 μηι以上且低於5〇 μιη之發泡為1至1 〇個以内 者標示△’確認將直徑μιη以上之發泡或是直徑5 μιη 以上且低於50 μηι之發泡為π個以上者標示X。能夠判 斷：若為△以上的話，則為良好；若為〇的話，則極為 良好。 (4 )金屬支撐可撓性電路基板之耐壓接著性評估 在各實施例及比較例所獲得之金屬支撐可撓性電路 基板（導體寬度50 μιη、導體間距離50 μπ〇 ，利用ACF 結合器（TCW-125、日本 Avionics(股）製），於 200°C、 1秒知、工具壓力係每一條配線成為5 〇 g / 2 5 0 0 μ m2的方 式來加熱加壓，進行線結合等之耐壓接著性評估。量測 耐壓接著用試樣之工具壓接面的電路圖案銅之隱沒量， 能夠判斷：若為3·0 μπι以内的話則為合格，若為2.0 μπι 以内的話則為良好，若為1.0 μιη以内的話則極為良好。 (5 )金屬支撐可撓性基板之穿扎性評估 利用加壓模具而將在各實施例及比較例所獲得之金 屬支撐可撓性基板開啟0.250 mm<D、0.350 ηιηιφ、0.500 ιηιηΦ之圓孔，觀察其剖面而作為穿孔性評估。能夠判 斷：在孔之剖面，若無長度10 μιη以上之（1 )接著劑層 滴流或溢料’或是長度1 〇 Μ· m以上之（1 )接著劑層裂痕 或缺口，在孔之周圍，若無與（2)支撐體之剝離，為了 飛線形成或元件設計性而良好地形成元件孔或連絡孔係 極為良好；在孔之剖面’若無長度20 μτη以上之（1 )接 著劑層滴流或溢料’或是長度20 μιη以上之（1 )接著劑 -19- 201207968 層裂痕或缺口，在孔之周圍，若無與（2)支撐體之剝離 係良好；在孔之剖面發生長度20 μιη以上之（1 )接著劑 層滴流或溢料，或是長度20 μπι以上之（1 )接著劑層裂 痕或缺〇’在孔之周圍發生與（2 )支撐體之剝離之情形 係不良。 (6)金屬支撐可撓性基板及附鉸鏈孔之金屬支樓可 撓性基板之耐藥液性評估 藉由觀察將在各實施例及比較例所獲得之金属支樓 可撓性基板、附鉸鏈孔之金屬支撐可撓性基板分別浸潰 於1.氣化鐵溶液（4(TC、37% )、2·氫氧化鈉溶液（3〇〇c、 1 N)、3.無電解錫鍍敷浴溶液（7〇°c、“Timp〇sit”lt_34、The Tg (glass transition temperature) is preferably 3 〇〇t or more, and the weight average erbium amount is preferably 1 0000 or more. In order to obtain a high adhesion force with the (^) connection == layer of the present invention, the epoxy resin is preferably used. The mixed hardener β. „ u ) heavy ϊ % 汗 sweat 3) The support coating can be placed on either side of the (1) adhesive layer side and its opposite side, depending on the purpose, It is possible to impart peelability. The so-called stripping of the (3) support coating layer (2) support stripping (2) support - & part or vice versa : The body - (7) the surface of the support 'does not cause the residual knife in the potion to be more _ (3) the support coating layer. The exfoliation is removed, the agent layer side (3) support In the case of the body coating layer, it is possible to (1) the substrateless after the product is attached; the peeling property is imparted to the (3) support coating layer on the processing side, and the opposite side of the existing layer is maintained. In the state of resistance to liquidity, it can be used effectively (2 sub-circuit processing heat-dissipating substrate. In this case, (3) support-coated layer soil The upper layer structure of the body is connected to (2) the first/A of the support, the second layer or the thermoplastic resin, the at least one layer of the first layer and the olefin, the polyphenylene sulfide, the poly Ethylene butyral, polyacetate polycondensate, polyalcohol, polycarbonate, polydecylamine, polyaniline, polyamine, "polyethyl methacrylate" selected more than one. And the stripping property is gathered, and the layer of the first layer other than the first layer is used to protect the liquid resistance during the processing of the circuit, and it is easy to peel off while ensuring stripping, and it is easy to peel off. It is also possible to perform resin coating or oxide film by electrode deposition or the like for the purpose of forming a hole in the case of forming a component hole or a hinge hole by perforation or the like to avoid exposure of the insulating material or the formation of a circuit. Further, (4) a hole-section coating layer is added for the formation of the film, etc. The resin is used for the (4) hole-section coating layer. It is preferable to use an epoxy resin having excellent insulating properties, heat resistance and chemical resistance. Poly-imine resin, polyamidoxime Imine resin, acrylic resin. In addition, in the formation of the circuit, in order to avoid the exposure of the component hole or the hole of the hinge hole by the (2) support or perforation, it is preferable to coat the photoresist. It is preferable to apply the back sealing material to the entire surface on the opposite side of the (2) adhesive layer of the support body on the entire surface of the metal supporting flexible substrate. Applying a photoresist to the entire surface of the metal-supported flexible substrate prevents the (2) subsequent layer from being exposed on the support (2) and exposing the exposed portion of the support to the drug. Preventing metal from supporting the damage of the flexible substrate. Further, by applying the back sealing material to the (2) support (the entire surface opposite to the adhesive layer), it is possible to avoid the cross section of the element hole or the cross section of the hinge hole. exposure. In the metal supporting flexible substrate of the present invention, the (1) adhesive layer may be maintained in a semi-hardened state before the metal layer for circuit formation is disposed, and the protective film may be disposed (5) to form a metal supporting carrier tape. The protective film is not particularly damaged if it is capable of being peeled off (1) in the form and function of the adhesive layer. (4) For example, 'ester, polyester, polyphenylene sulfide, polyvinyl chloride, polytetraethylene Vinyl fluoride, polyvinylidene fluoride, polydene ethylene, -14- 201207968 Polyethylene decylamine, poly-bonded membrane and laminated paper. Metal components The circuit type (flying wire) carrier tape, etc., can be used not only by shrinkage, but also by (a) drying in a solvent, a shaped substrate. If it is functional, but for Weibu, it is better not to have a special angle round.) Way, according to 'Acid acid, polyacetate, bismuth imine, polyvinyl alcohol, polycarbonate, polymethyl methacrylate堃 堃 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也 也After processing the skirting holes, peeling off the film 1 can be used in order to form a metal layer with a metal layering method or a spray method. If it is used to form a hollow wiring surface or a back surface using a flying wire seal, it can be removed from the arrangement of the metal branch building and the IC <LED component line bonding method. Sex will increase, also caused by the support metal step: no electricity: the problem of insulation lamination, for the manufacture of gold according to the invention: the formation of the layer of insulation damage. And explain it. "The side of the flexible substrate of the metal branch is formed by the technique of forming (1), and the resin composition of the layer is dissolved into (1) an adhesive layer. The metal branch can be pulled, although (1) the adhesive layer is small, and the thickness of the grain is not particularly limited, and it is flexible, and it is preferably coated as a square. It is not limited, it can be coated with the coating method. Although the coating method is combined, the lip type, (4) Μα phase gravure method, etc. 4=Meyerbar (Meer bar) plate coating equipment. Dry conditions pass -15- 201207968 section 1 00 to 2GGt, 1 to 5 minutes. The solvent is not particularly limited to two aromatic groups such as benzene and chlorobenzene; ketone systems such as f-ethyl ketone and = butyl ketone, and di(1) decylamine and dimethyl An aprotic system such as acetamide or N-methyl group; an alcohol solvent such as ethanol, methanol, isopropanol or n-alcohol or decyl alcohol, or two or more solvents may be used. In the case of j [ D) hardening accelerator or (E ) true replenishment, use (4) mixer, bead mill, sand mill The dispersing device and the like which are carried out by the gas contact method can be suitably used in a method of being previously dispensed in a solvent, or by using an extruder or a Banbury mixer, etc. (4) • Dispersing the composition (1) Next (4)中^= The above method, etc.. (b) formed by the method described in (a) 夕古土土;amp;...1, household, ^ i ± ) (1) the adhesive increases T 'if necessary It is possible to laminate, the n 槚 layer has a release property (5) to protect the ruthenium and obtain the metal-supported flexible Luminous substrate of the present invention. Further increase the thickness of the adhesive (1) followed by ❹. 疋 积 number of layers, 1 The layer additionally has a gold-supported layer (2) support on the (5) protective film to obtain the metal-supported flexible substrate of the present invention. i ^ , f(3) support layer is disposed on (2) In the case of the probe, the resin of the coating layer is dissolved or divided into the coating of the branch building and the organic solvent, and (2) the support X is coated, dried, and pre-formed (3) The limb is broken, and in addition, the 雒 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置The Des s method is specially applied in advance and the dry layer must be used to maintain the tensile strength of the peeling resin. -16- 201207968 Pair (2) Support (1) Adhesive layer The lamination condition is usually 50 to 160 ° C and a press of 0.1 to MPa 5 MPa. It can be judged that the lamination temperature is preferably 140 ° C or less, and if it is 12 (r or less, it is good γ if it is 100 ° C or less). / 8 1 dental calendar) The adhesive layer side constitutes (3) the support coating layer, and the (1) adhesive layer is laminated on the (2) support body and the (3) support coating layer is disposed. In other cases, it is preferable to laminate the same conditions as in the case where the (2) support is directly laminated (1) the adhesive layer is laminated. After obtaining the metal-supported flexible substrate of the present invention, it may be, for example, 40 to 100. 〇, heat treatment is carried out for about 20 to 300 hours to adjust (1) the degree of hardening of the adhesive layer. By adjusting the degree of hardening, it is possible to prevent excessive flow of the adhesive when the metal layer for forming a circuit is placed on the metal-supported flexible circuit board, and also to prevent foaming due to moisture during heat curing. In the case of using the metal-supported flexible substrate of the present invention for the circuit processing, the (4) hole-section coating layer is disposed in the formed element hole or the money-chain hole, and it is preferable to form the hole by using a hole or the like. It is formed by electrodeposition coating. The electrodeposition coating method preferably applies a negative voltage to the (2) support body to make the electrodeposited coating of the epoxy resin type, the polyimine resin type, etc. which are positively polarized, and the (2) hole of the branch body. A cationic electrode deposition coating method of the profile. Further, it is preferred to heat-fix the electrodeposition coating after electrode deposition coating. The electronic component using the metal supporting exchangeable substrate of the invention has the necessary chemical resistance for the circuit processing or the necessary insulation for the metal supporting substrate, the processing of the reel to the reel or the perforation processing, and the shape of the flying wire - 17-201207968 The electronic components that can be more conventionally described are simple and low-cost examples of the embodiments of the present invention, but the present invention does not describe the evaluation methods of the embodiments. I first, in the embodiment and comparative metal-supported flexible circuit substrate insulation reliability evaluation 3〇C, 85% RH environment, the voltage of 100 V is added to the metal branch obtained in the comparative example The flexible circuit board is further 50 μχη, and the distance between the conductors is 5〇), and the insulation durability time is preferably 25 〇 or more until 1 〇Ω is set to the insulation endurance time. (2) Evaluation of the amount of crimping of the metal-supported flexible substrate by using the subtraction of the vaporized iron; ^ (touching) to remove the metal support of the copper-formed foil for circuit formation obtained in each of the embodiments and the example k After the copper foil for circuit formation of the flexible substrate was cut into 35 mm x 190 mm, a flexible substrate was supported by a metal ferrule. Under the condition of 23 °C /5 5 % RH, the amount of curling of the light is evaluated by the metal-supported flexible substrate after 24 hours of conditioning, and the end of the curled substrate is placed upside down and placed on the glass plate. The highest order position of the glass plate covering the circuit board from the hardened film was measured and the amount of curl was set. It can be judged that it is good if the amount of curl is 7 mm or less, and it is extremely good if it is 3 mm or less. (3) Foaming evaluation of the metal-supported flexible substrate The foaming evaluation was carried out by observing (1) the adhesive layer of the (2) metal substrate flexible substrate for curl amount evaluation using a metal microscope. For those who are straight -18-201207968 with a diameter of 5 μm or more, they are marked as foaming, and those who have no foaming at all are marked with 〇, and it is confirmed that the foaming of 5 μηι or more and less than 5 〇μιη is 1 to 1 直. △' It is confirmed that the foaming of the diameter μιη or more or the foaming of the diameter of 5 μm or more and less than 50 μη is π or more. It can be judged that it is good if it is △ or more, and it is excellent if it is 〇. (4) Pressure-resistant adhesion of the metal-supported flexible circuit substrate. The metal-supported flexible circuit substrate obtained in each of the examples and the comparative examples (conductor width 50 μm, distance between conductors 50 μπ〇, using ACF combiner) (TCW-125, manufactured by Avionics Co., Ltd.), heating and pressurizing, wire bonding, etc., at a temperature of 200 ° C, 1 second, and tool pressure for each wire to be 5 〇g / 2 500 μm 2 Evaluation of the withstand voltage. The pressure is measured by the amount of copper in the circuit pattern of the tool crimping surface of the sample. It can be judged that if it is within 3·0 μπι, it is acceptable. If it is within 2.0 μπι It is excellent, and it is extremely good if it is within 1.0 μm. (5) Evaluation of the puncture property of the metal-supported flexible substrate The metal-supported flexible substrate obtained in each of the examples and the comparative examples is opened by a press mold. 0.250 mm<D, 0.350 ηιηιφ, 0.500 ιηιηΦ round hole, observe the cross section and evaluate it as perforation. It can be judged that: in the cross section of the hole, if there is no length of 10 μιη or more (1) the adhesive layer dripping or flashing ' Or Degree 1 〇Μ·m or more (1) The adhesive layer is cracked or notched, and if there is no peeling from the (2) support around the hole, the element hole or contact is formed well for flying line formation or component design. The hole system is extremely good; in the section of the hole, if there is no length of 20 μτη or more (1) the adhesive layer dripping or flashing 'or the length of 20 μm or more (1) the adhesive -19-201207968 layer crack or gap, Around the hole, if there is no peeling from the (2) support, the length of the hole is 20 μm or more (1) the adhesive layer dripping or flashing, or the length of 20 μπι or more (1) Then, the crack or defect of the agent layer is not good around the hole and (2) the peeling of the support. (6) The metal substrate supports the flexible substrate and the metal substrate of the hinged hole is resistant to the flexible substrate. The liquid property evaluation was carried out by observing the metal substrate flexible substrate obtained in each of the examples and the comparative examples, and the metal-supported flexible substrate with the hinge holes, respectively, in 1. a gasified iron solution (4 (TC, 37%), 2·sodium hydroxide solution (3〇〇c, 1 N), 3. electroless tin plating Bath solution (7〇°c, “Timp〇sit” lt_34,

Rohm & Haas公司製）後之外觀而作為耐藥液性評估。 判斷基準係如下所示： (6-1 )金屬支撐可撓性基板之情形 A級：依序於丨之藥液中浸潰5分鐘、接著於2之藥液 中浸潰5分鐘、進一步於3之藥液中浸潰5分鐘之際， 任一種皆符合下列（丨）及（Η )的要件之情形。 B級：雖然上述A級之要件未符合’但依序於丨之藥液 中浸潰3分鐘、接著於2之藥液中浸潰3分鐘、進一步 於3之藥液中浸潰3分鐘之際，任—種皆符合下列⑴ 及（i i )的要件之情形。 C級：依序於i之藥液中浸潰3分鐘、接著於2之藥液 中浸潰3分鐘、進一步於3之藥液中浸潰3分鐘之際， 雖然下列（i)的要件符合’但下列（Η)的要件則未符 合之情形。 -20- 201207968 F級：依序於1之藥液中浸潰3分鐘、接著於2之藥液 中浸潰3分鐘、進一步於3之藥液中浸潰3分鐘之際， 任一種皆未符合下列（i )及（ii )的要件之情形。 (i )在（1 )接著劑層之表面外觀，未觀察到因藥液所 造成的明顯損傷。 (ii )在（2 )支撐體之（1 )接著劑層的相反側未形成 (3)支撐體被覆層之情形，在與（2)支撐體之（1)接 著劑層相反側面之表面外觀，未觀察到因藥液所造成的 明顯損傷。另外，在（2 )支撐體之（1 )接著劑層的相 反側形成（3 )支撐體被覆層之情形，在形成於（2 )支 撐體之（1 )接著劑層相反側的（3 )支撐體被覆層之與 (2 )支撐體相反側面之表面外觀，未觀察到因藥液所造 成的明顯損傷。 (6-2 )附鉸鏈孔之金屬支撐可撓性基板之情形 A級：依序於1之藥液中浸潰5分鐘、接著於2之藥液 中浸潰5分鐘、進一步於3之藥液中浸潰5分鐘之際， 全部符合下列（i )至（iii )的要件之情形。 A ’級：雖然上述A級的要件未符合，但依序於1之藥液 中浸潰3分鐘、接著於2之藥液中浸潰3分鐘、進一步 於3之藥液中浸潰3分鐘之際，全部符合下列（i )至（iii ) 的要件之情形。 B級：依序於1之藥液中浸潰3分鐘、接著於2之藥液 中浸潰3分鐘、進一步於3之藥液中浸潰3分鐘之際， 符合下列（i )至（iii )的要件中任二個之情形。 -21 - 201207968 C級：依序於1之藥液中浸潰3分鐘、接著於 、z之藥泼 中浸潰3分鐘、進一步於3之藥液中浸潰3分 僅符合下列（i )至（iii )的要件中任一個之情形 T' ’ F級：依序於1之藥液中浸潰3分鐘、接著於 、4之藥分 中浸潰3分鐘、進一步於3之藥液中浸潰3分 、夂 全部未符合下列（i )至（i i i )的要件之情形。 T' ’ (i)在（1)接著劑層之表面外觀， 造成的明顯損傷。 未觀察到gj 藥液所 (11 )在（2 )支撐體之（1 )接著劑層的相反 未形成 (.3)支撐體被覆層之情形，在與（2)支撐體之（ι)战 著劑層相反側面之表面外觀’未觀察到因藥液所造成接 明顯損傷。另外，在（2 )支撐體之（1)接著劑層的的 反側形成（3 )支撐體被覆層之情形，在形成於（2 )目 撐體之（1 )接著劑層相反側的.（3 )支撐體被覆層之與 (2 )支撐體相反側面之表面外觀，未觀察到因藥液所造 戍的明顯損傷。 (iii)在孔剖面未觀察到因藥液所造成的明顯損傷。 (7)金屬支樓可挽性電路基板之接著力 使用在各實施例及_例所獲得之金屬支撐可燒性 電路基板（導體寬度50叫，使用猶 (東洋Baldwin公司製），於9〇度方向以5〇匪/分鐘 <速度而撕下導體 省為8 N/cm以上， 為良好。 ’則&此時之撕下強度。能夠判斷： 則極太6 , 句良好；若為6 N/cm以上，則 -22- 201207968 (實施例1 ) (a )接著劑層薄片之製作 添加（A )二聚物酸聚醯胺樹脂（“Sunmide，，（註冊 商才示）HT-100G、Air Products Japan 公司製、胺價 1、 熔融黏度7.0 Pa · s ) 1 〇〇重量份、（b )曱階酚醛酚樹脂 (CKM1634昭和高分子公司製）5〇重量份、（c)環氧 树月日（Epicoat ( s主冊商標）yl98〇、japan Epoxy Resin 公司製）80重量份、（D )硬化加速劑（2_乙基_4甲基 咪嗤（2E4MZ )、東京化成公司製）2重量份、乙醇/曱 苯混合溶劑（混合重量比率乙醇1 :曱苯4)，於30〇C 攪拌，混合而製作固形物濃度25重量％接著劑組成物。 利用棒塗布機，在（5 )保護膜（附矽氧烷脫模劑之厚度 25 μιη之聚對苯二曱酸乙二酯薄膜（藤森工業（股）製 “FUmbyna”（註冊商標）GT))上，使此接著劑組成物 成為約12pm之乾燥厚度的方式來塗布，於ΐ5〇β(：乾燥* 分鐘後’使別的（5 )保護膜貼合於所形成的（丨）接著 劑層面而製得利用（5 )保護膜爽住兩側之接著劑層薄片。 (b)金屬支撐可撓性基板與金屬支撐可撓性電路基 板之製作 記載之方法所獲得之接著劑層 剝離利用在上述 薄片的（5)保護膜之單側，以1〇『c、〇·3 Mpa之條件 而積層於（2)支撐體（壓紋銅箱（ΒΉγ_22Β τ) 7〇 厚度（日鑛金屬（股）製）線膨脹係數為ΐ6 〇 ρρ〇， 獲得金屬支撐可撓性基板。 -23- 201207968 剝離金屬支撐可撓性基板之（5)保護腹 〇·3 MPa壓力之條件而積層 、，以14(TC、 卞向槓層18 μιη之電解 於空氣烘相中，依序進行於8〇。 者 '之金屬支撑可撓性基板。利用常用方法而在二= 附電路形成用銅箱之金屬支撐可撓性基板之蔓：： 銅箱面進行光阻膜形成、蝕刻、光阻 f ^ 形成配線間 距H)—(導體寬度50μη〇之對向電極電路後，於氟 棚酸系（Rohm & Haas公司製錫鍍敷液（商品名） “TINPOSIT”（註冊商標）LT_34 )之無電解锡鍍敷液中， 70°C、5分鐘浸潰處理，實施0.5 μιη厚度之鍍敷，製得 金屬支撐可撓性電路基板。 利用上述方法所獲得之評估用金屬支撐可撓性基 板、附電路形成用銅箔之金屬支撐可撓性基板、金屬1 撐可撓性電路基板，進行該（1 )至（7 )之評估。 (實施例2 ) 於接著劑層薄片之製作時，除了（ A )至（D)成分 係使用（A )二聚物酸聚酿胺樹脂（“ T 〇 m i d e ’’（註冊商標） TXC-232C、富士化成工業公司製、胺價ΐ〇·〇、熔融黏度 24.0Pa.s)100重量份、（Β)曱階酚醛酚樹脂（CKM1634 昭和高分子公司製）5〇重量份、（C )環氧樹脂（“Epicoat” (註冊商標）YL980、Japan Epoxy Resin 公司製）80 重 量份、（D )硬化加速劑（2-乙基-4-曱基咪唑（2E4MZ )、 東京化成公司製）2重量份以外’利用與實施例1同樣 的方法而製作，進行5亥（1)至（7)記載之評估。 -24- 201207968 (實施例3) 於接著劑層薄片之製作時，除了（ A )至（D )成分 係使用（A ) 一聚物酸聚趟酿胺樹脂（“ τ 〇 m i d e，，（註冊商 標）PA-200 '富士化成工業公司製、胺價3、熔融黏度 40_0 Pa · s) 1〇〇重量份、（B)曱階酚醛酚樹脂（ckm1634 昭和高分子公司製）50重量份、（C)環氧樹脂（“Epic〇at” (註冊商標）YL980、Japan Epoxy Resin 公司製）8〇 重 里Ί刀、（D)硬化加速劑（2 -乙基-4-甲基〇米嗤（2E4MZ)、 東尽化成公司製）2重量份以外，利用與實施例1同樣 的方法而製作，進行該（1 )至（7 )記載之評估。 (實施例4 ) 於接著劑層薄片之製作時’除了（ A )至（D )成分 係使用（A )二聚物酸聚醚醯胺樹脂（“Tomide”（註冊商 標）PA-200、富士化成工業公司製、胺價3、熔融黏度 40.0 Pa · s ) 1 〇〇重量份、（B ).甲階酚醛盼樹月旨（CKM 1 634 昭和高分子公司製）50重量份、（C )環氧樹脂（“Epicoat” (註冊商標）YL980、Japan Epoxy Resin 公司製）80 重 量份、（D )硬化加速劑（2-乙基-4-曱基咪唑（2E4MZ )、 東京化成公司製）2重量份，另外，於乙醇/曱苯混合溶 劑（混合重量比率乙醇1 ··甲苯4 )中添加有（E)鈒 填充材（“Adomafine”（註冊商標）AO-502、平均粒徑 0·7 μιη、Adomatech(股）製）300重量份的方式來預先使 用砂磨機所分散處理的混合溶劑以外，利用與實施例1 同樣的方法而製作，進行該（1 )至（7 )記載之評估。 -25- 201207968 (實施例5 ) (a )接著劑層薄片之製作 於接著劑層薄片之製作時，除了（ A )至（D )成分 係使用（A )二聚物酸聚醚醯胺樹脂（“T〇mide”（註冊商 標）PA-200、富士化成工業公司製、胺價3、熔融黏度 40·0 Pa · s) 1〇〇重量份、（b )甲階酚醛酚樹脂（CKM1634 昭和高分子公司製）50重量份、（C )環氧樹脂（“Epicoat，， (5主冊商標）YL980、Japan Epoxy Resin 公司製）80 重 星伤、（D )硬化加速劑（2_乙基_4_曱基咪唑（2E4mz )、 東京化成公司製）2重量份以外，利用與實施例1同樣 的方法而製作接著劑薄片。 (b)金屬支撐可撓性基板與附鉸鏈孔之金屬支撐可 撓性電路基板及金屬支撐可撓性基板之製作 將利用在上述（a )記載之方法所獲得之接著劑薄片 切斷成30 mm寬度後’剝離（5 )保護膜之單側，以i〇〇〇c、 0.3 MPa之條件而層壓（2 )支撐體（鋁箔50 μπι厚度、 35 mm寬度（住輕紹（股）製）線膨脹係數22.0 ρρηι )， 獲得金屬支撐可撓性基板。 在金屬支撐可撓性基板，利用模具，藉由兩端各1 列鑽孔而形成欽鍵孔（孔徑1.98 mmxl.98 mm 之正方 形、間距4.75 mm ) ’獲得附鉸鏈孔之金屬支撐可撓性 基板。 剝離附鉸鏈孔之金屬支撐可撓性基板之（5 )保護 膜，以140°C、0.3 MPa壓力之條件而積層i 8 μιη之電解 銅箔。接著，於空氣烘箱中，依序進行於8〇。〇/3小時、 -26- 201207968 於1〇(rC/5小時、於15(rc/5小時之加熱處 路形成用銅箱之金屬支撐可撓性基板。 “于附電 :用常用方法而進行所獲得之附電路形成用銅笛之 金屬支#可撓性基板的電路形成用顧j肖面側之整 之光阻膜形成、曝光、顯影，接著在其背面整面，：: 刷子而塗布背面封止材mm材❸真充绞 孔。之後，進行蝕刻、光阻剝離'背面封止材剝離\ 成配線間距100，（導體寬度50 μη〇之對向電極電路 後’於氟棚酸系（Rohm & Haas公司製錫錢敷液（商品 名）“TINP0SIT”（註冊商標）LT〇4 )之無電解錫錢敷 液中，70°C、5分鐘浸潰處理，實施〇 5 μιη厚度之鍍敷， 製得金屬支撐可撓性電路基板。 利用上述方法所獲得之評估用金屬支撐可撓性基 =、附鉸鏈孔之金屬支撐可撓性基板、附電路形成用銅 泊之金屬支撐可撓性基板、金屬可撓性電路基板進行 該（1 )至（7 )記載之評估。 (實施例6 ) 除了使用作為（3)支樓體被覆層之Tg3〇〇。。、重量 平均为子量1 10 0 0、環氧樹脂混合比率丨〇 %之聚醯胺醯 亞胺樹脂3.0μπι來被覆為（2)支撐體之鋁箔（5〇4^1厚 度（住輕銘（版）製）線膨脹係數2 2. 〇 p p m )之兩面以外， 利用與貫施例5同樣的方法而製作，進行該（丄）至（7 ) 記載之評估。 (實施例7) 除了使用作為（3 )支撐體被覆層之Tg 300艽、重量 平均分子量1 1000、環氧樹脂混合比率1〇%之聚醯胺醯 -27- 201207968 亞胺樹脂15 μΐΏ來被覆為（2)支撐體之紹辖（5〇 _ 厚度（住輕紹（股）製）線膨脹係數MO ppm)之兩面以 外，利用與實施例5同樣的方法而製作，進行該（丨）至 (7 )記載之評估。 (實施例8) 除了使用作為（3 )支撐體被覆層之Tg 25〇t：、重量 平均分子量8000、環氧樹脂混合比率1〇%之聚醯胺醯亞 胺樹脂3.0 μΙη來被覆為（2)支撐體之鋁箱（5〇 ^^厚 度（住輕鋁（股）製）線膨脹係數22 〇 ppm )之兩面以外， 利用與實施例5同樣的方法而製作，進行該（i )至（7 ) 記載之評估。 (實施例9) 除了使用作為（3)支撐體被覆層之Tg 3〇(TC、重量 平均分子量12000之聚醯亞胺樹脂3 〇 μηι來被覆為（2) 支撐體之鋁箔（50 μηι厚度（住輕鋁（股）製）線膨脹係數 22·0 Ppm)之兩面以外，利用與實施例$同樣的方法而 製作’進行該（1 )至（7 )記載之評估。 (實施例10 ) 於接著劑層薄片之製作時，除了（ A )成分係使用（A ) 一 +物酸聚醢胺樹脂（“ T 〇 m丨d e ”（註冊商標）p a - 1 〇 〇、 富士化成工業公司製、胺價〇、熔融黏度18〇 〇 Pa . 100重量份以外，利用與實施例6同樣的方法而製作， 進行該（1 )至（7 )記載之評估。 (貫施例11 ) 於接著劑層薄片之製作時，除了（ A )成分係使用（A ) 二聚物酸聚醯胺樹脂（“T〇mide，，（註冊商標）PA-100、 -28- 201207968 苜士化成工業公司製、胺價〇、熔融黏度180.0 Pa.s) 100重量份以外，利用與實施例7同樣的方法而製作， 進行該（1 )至（7 )記載之評估。 (實施例1 2 ) 除了使用作為（3 )支撐體被覆層之Tg 30(rc、重量 平均分子量1 1 〇〇〇之聚醯亞胺樹脂3 μηι來被覆為（2 ) 支撐體之銘箱（5〇 μηι厚度（住輕鋁（股）製）線膨脹係數 22.0 ppm )之（i )接著劑層側，於3(rc輥積層相反面側 與在聚對苯二甲酸乙二酯膜上由黏著劑所構成的裱褙膠 帶KT-50 (河村產業公司製）（剝離性黏著劑層2〇 、 聚對苯二曱酸乙二酯膜5 0 Pm )以外，利用與實施例5 同樣的方法而製作，進行該（i )至（7 )記載之評估。 (實施例1 3 ) 於附鉸鏈孔之金屬支撐可撓性基板之製作時，除了 在鉸鏈孔剖面，將樹脂份為環氧樹脂系之電極沉積塗料 £16〇〇^八1\40(311丨111^511(股）製）電極沉積成膜厚度1〇 μιη，於1 00°C進行1 5分鐘之乾燥處理而形成（4 )孔剖 面被覆層以外，利用與實施例6同樣的方法而製作，進 行該（1 )至（7 )記載之評估。 (實施例14 ) 於附鉸鏈孔之金屬支撐可撓性基板之製作時，除了 將樹脂份為聚醯亞胺樹脂系之電極沉積塗料Elec〇at pj (Shimitsu(股）製）作成（4)孔剖面被覆層以外，利用 與實施例13同樣的方法而製作，進行該（1 )至（7 )記 載之評估。 -29- 201207968 (實施例1 5 ) 於接著劑層薄片之製作時，除了（ A )至（D )成分 係使用（A )二聚物酸聚醚醯胺樹脂（“T〇mide”（註冊商 標）PA-200'富士化成工業公司製、胺冑3、溶融黏度 40.0Pa s)100重1份、（b)甲階酚醛酚樹脂（CKM1634 昭和南分子公司製）50重量份、（C )環氧樹脂（“Epic〇at” (註冊商標）YL980 ' japan Ep〇xy Resin 公司製）8〇 重 量份、（D)硬化加速劑（2_乙基·4_甲基。米唑（2E4mz)、 東京化成公司製）2重量份，另外，於乙醇/曱苯混合溶 劑（混合重量比率乙醇1 :曱笨4)中添加有（E)鋁 填充材（“Adomafine”（註冊商標）a〇_502、平均粒徑 0.7 μιη、Adomatech(股）公司製）3〇〇重量份的方式來預 先使用砂磨機所分散處理的混合溶劑，進一步使用 SUS3 1 6箔（70 μπι厚度（東洋精箔（股）製）線膨脹係數 18.5 ppm)以外，利用與實施例i同樣的方法而製作， 進行該（1 )至（7 )記載之評估。 (實施例1 6 ) 於接著劑層薄片之製作時，除了（ A )至（D )成分 係使用（A ) —聚物酸聚謎酿胺樹脂（“ τ 〇 m丨d e ”（註冊商 標）PA-200、富士化成工業公司製、胺價3、熔融黏度 40.0Pa.s)100重量份、（B)曱階盼越盼樹脂（CKM1634 昭和高分子公司製）50重量份、（c )環氧樹脂（“Epicoat” (註冊商標）YL980、Japan Epoxy Resin 公司製）8〇 重 量份、（D )硬化加速劑（2 -乙基-4-甲基味唾（2E4MZ )、 東京化成公司製）2重量份’另外，於乙醇/曱苯混合溶 -30 - S. 201207968 劑（混合重量比率乙醇1 :甲苯4)中添加有（E)鋁 填充材（“Adomafine”（註冊商標）AO-502、平均粒徑 0.7 μιη、Adomatech(股）公司製）300重量份的方式來預 先使用砂磨機所分散處理的混合溶劑，進一步（2 )支撐 體係使用鋁羯（50 μιη厚度（住輕鋁（股）製）線膨脹係數 22.0 ppm)以外，利用與實施例1同樣的方法而製作， 進行該（1 )至（7 )記載之評估。 (實施例1 7 ) 於接著劑層薄片之製作時，除了（A)至（D)成分 係使用（A )二聚物酸聚醚醯胺樹脂（“T〇mide”（註冊商 標）PA-200、富士化成工業公司製、胺價3、溶融黏度 40·0 Pa · s ) 1 00重量份、（B )曱階盼駿齡樹脂（ckM 1 634 昭和高分子公司製）50重量份、（C )環氧樹脂（“Epicoat” (註冊商標）YL980、Japan Epoxy Resin 公司製）8〇 重 里份、（D)硬化加速劑（2-乙基-4-甲基咪η坐（2E4MZ)、 東厅、化成公司製）2重量份，另外，於乙醇/曱苯混合溶 劑（混合重量比率乙醇1 :甲苯4)中添加有（Ε)氮 化鋁填充材（Η、平均粒徑1.7 μΓη、T〇kuyama(股）公司 製）300重量份的方式來預先使用砂磨機所分散處理的 混合溶劑以外，利用與實施例丨同樣的方法而製作，進 行該（1 )至（7 )記載之評估。 (實施例1 8 ) 於接著劑層薄片之製作時，除了（A)至（D)成分 係使用（A )二聚物酸聚醚醯胺樹脂（“T〇mide”（註冊商 標）PA-200、富士化成工業公司製、胺價i、熔融黏度 201207968 40.0 Pa · s ):二聚物酸聚醯胺樹脂（“T〇Inide”（註冊商 標）PA-100、富士化成工業公司製、胺價〇、熔融黏度 18 0.0 Pa · s ):二聚物酸聚醯胺樹脂（“T〇inide”（註冊 商標）5 3 5、富士化成工業公司製、胺價5 〇、熔融黏度 1.0 Pa · s)之重量比2 : i : 〇 5混合物（胺價7丨、熔融 黏度80 Pa . s )(二聚物酸聚醚醯胺樹脂）1〇〇重量份、 (B)曱p白驗祕紛樹脂（CKM1634昭和高分子公司製） 50重量份、（C )環氧樹脂（“Epicoat”（註冊商標）γ[98〇、 Japan Epoxy Resin公司製）8〇重量份、（〇 )硬化加速 劑（2-乙基-4-甲基咪唑（2E4MZ)、東京化成公司製）2 重量份以外’利用與實施例1同樣的方法而製作，進行 該（1 )至（7 )記載之評估。 (實施例1 9 ) 於接著劑層薄片之製作時，除了 （ A )至（D )成分 係使用（A )二聚物酸聚醯胺樹脂（“Macr〇melt，，（註冊 商標）690 0、Henkel Japan公司製、胺價〇、熔融黏度 10 Pa · s) 100重量份、（B)曱階酚醛酚樹脂（CKM163 4 昭和高分子公司製）50重量份、（C)環氧樹脂（“Epic〇at” (註冊商標）YL980、Japan Epoxy Resin 公司製）8〇 重 量份、（D )硬化加速劑（2-乙基-4-曱基咪唑（2E4MZ)、 東厅、化成公司製）2重直份以外，利用與實施例1同樣 的方法而製作，進行該（1 )至（7 )記載之評估。 (實施例20) 於接著劑層薄片之製作時’除了 （ A )至（D )成分 係使用（A )二聚物酸聚醯胺樹脂（“T〇mide”（註冊商標） 1350、富士化成工業公司製、胺價10、炫融黏度pa. s) -32- 201207968 100重量份、（B )曱階酚醛酚樹脂（CKM1634昭和高 分子公司製）50重量份、（C )環氧樹脂（“Epicoat”（註 冊商標）YL980、Japan Epoxy Resin公司製）80重量份、 (D )硬化加速劑（2-乙基-4-曱基咪唑（2E4MZ )、東 京化成公司製）2重量份以外，利用與實施例1同樣的 方法而製作，進行該（1 )至（7 )記載之評估。 (實施例2 1 ) 於接著劑層薄片之製作時，除了（ A )至（D )成分 係使用（A )二聚物酸聚醯胺樹脂（“Tomide”（註冊商標） ΡΑ-1〇〇、富士化成工業公司製、胺價0、熔融黏度180.0 Pa · s ) 1 〇〇重量份、（B )曱階酚醛酚樹月旨（CKM 1 634昭 和高分子公司製）50重量份、（C )環氧樹脂（“Epicoat” (註冊商標）YL980、Japan Epoxy Resin 公司製）80 重 量份、（D )硬化加速劑（2-乙基-4-曱基咪唑（2E4MZ )、 東京化成公司製）2重量份以外，利用與實施例1同樣 的方法而製作，進行該（1 )至（7 )記載之評估。 (比較例1 ) 於接著劑層薄片之製作時，除了（ A )、（ C )、（ D ) 成分係使用（A )二聚物聚醯胺樹脂（“Macromelt，，（註 冊商標）6900、Henkel Japan公司製、胺價〇、炼融黏度 10 Pa · s) 1〇〇 重量份、（C)環氧樹脂（“Epicoat”（註 冊商標）YL980、Japan Epoxy Resin公司製）80重量份、 (D )硬化加速劑（2-乙基-4-甲基咪唑（2E4MZ )、東 京化成公司製）2重量份、不使用（B )成分以外，利用 與實施例1同樣的方法而製作’進行該（1 )至（7 )記 载之評估。 -33- 201207968 (比較例2) 於接著劑層薄片之製作時，除了（ A )至（D )成分 係使用（A )丙稀猜聚丁·一細樹脂（“ N i p 〇 1 ’’（古主冊商標） 1043、日本Zeon公司製）100重量份、（b)曱階紛酿 紛樹脂（CKM1634昭和南分子公司製）5〇重量份、（c) 環氧樹脂（“Epicoat”（註冊商標）YL980、Japan Ep0Xy Resin公司製）80重量份、（D)硬化加速劑（2乙基.4_ 甲基咪嗤（2E4MZ )、東京化成公司製）2重量份以外， 利用與實施例1同樣的方法而製作，進行該（丄）至（7 ) 記載之評估。 (比較例3 ) 除了將銘羯（50 μηι厚度（住輕鋁（股）製）線膨脹係 數22.0 ppm )作為（2 )支撐體使用以外，利用與比較例 2同樣的方法而製作，進行該（丨）至（7 )記載之評估。 (比較例4) 除了使用以作為（3)支撐體被覆層之Tg3〇〇°C、重 量平均分子量1 1000、環氧樹脂混合比率1〇%之聚醯胺 醯亞胺樹脂3.0μηι被覆為（2)支撐體之鋁箔（5〇 μιη厚 度（住輕鋁（股）製）線膨脹係數22.0 ppm)之兩面者以 外，利用與比較例2同樣的方法而製作，進行該（夏）至 (7 )記載之評估。 將在各實施例、比較例所使用的（i )接著劑層、（2 ) 支撐組、（3 )支撐體被覆層、（4 )孔剖面被覆層顯示 ; 2另外將電路形成用銅箔之積層體溫度及測定 結果顯示於表3、4。 -34- !； 201207968 (4)洞剖面 被覆層 樹脂 1 m #- 瑞 環氧樹脂 聚醯亞胺 樹脂 (3)支撐體被覆層 m 〇 〇 r*^ 〇 〇 •-Η ο 1 〇 〇 fN 〇 〇 r-^ Ο Ο o o 1 〇 〇 τΉ 〇 〇 〇 ΓΟ 〇 m ο <Ν Ο m Ο m Ο o m 1 Ο m 〇 〇 rn i〇 Ο c^i ο rn ο cn ·-Η O cn 〇 ο rn Ο fO 荜 饍甾 Dm tea η； 甾耷 鳕粜 嫿槳 嫿绪 胡靼 谱萆 4^ iJtn t& OIZ 嫿甾 培i i)〇i >€3 to? 甾耷 饍粜 龄《X 鍩荜 饍粜 ύ ϋ狴 筚每 谱甾 趟aim «3 ΒΧ； 饍粜 «4 «Η (2)支樓體 ^ P ^ E 發§： 癍一 ^ B 〇 趔說塚域 ^ ί« ⑴接著劑層 域 頌 碳 N S S CS Ν s ω (Ν Ν S S (Ν N S S (N N s S CN N 2 S CN Ν s ω <Ν Ν S s (N N S S <N Ν 2 s CN Ν S 5 CN N S S (N Ν S S (Ν Ν S S (Ν H·.*» 念 ο 1 U 芝 Ό ϊ υ ?： VO S U 寸 S Ϊ U 寸 S u 艺 VO r-< S U 寸 S ι·Η S u 芝 v〇 s u 寸 3 T—Η U 寸 cn v〇 § U 芝 s〇 i u 寸 S U 寸 m v〇 Ϊ U 寸 S r-H Ϊ 〇 ffif狴 § S g 3 § 2 > g 2 • o 00 3 > s s 卜 g 3 s 3 g 3 >-· g 3 g 2 g S > § S § 2 JtD ns： Μ . ® (£ 紱u q 〇 〇 o ο O O ο § § ο 〇 〇 ο m CO m m o o cn ΓΛ Si S银 il ® ^ am If S ^ 成础 丨1柯 怒率 Ί f 龚淫 鉍瘤 Ί f 潜荜 客粜 M W «ν jjm βγΓ π^ 怒耷 #绪 Ί W 鉍谱 Μ l1 蓉甾 丨1 I 蓉鸪 鉍谱 丨1 f 好Jtn SI il ® Dot 45*< I ^ 衾雄 >1 S BiT 齧率 蓉绪 丨1 I 湓率 荽甾 '11 龚绪 好嫿 Ί W 謀 ο 〇 1ξ § Η ⑺Ε U (Ν S 〇 X Η 〇 CS < CU 〇 <N < cu Ο CN < α. 〇 (Ν < 0-. Ο (Ν <； CL, ο (Ν < (X 〇 (N < CU o < CL, o < Ph 〇 CN < 〇 (N < 〇 CM < Ah 省— ίψο： ^ (K 5 ik 5 资竺 省卜 W 省00 诺2 争:5 丧二 %SK 5 镩2 料5 201207968 (4)洞剖面 被覆層 11 ts *4τ» 1 1 1 1 1 1 1 1 \ 1 1 (3)支撐體被覆層 41 11000 〇 厚度 _ 〇 ΓΟ 聚醯胺醯 亞胺樹脂 (2)支撐體 熱膨脹係數 [ppm/°C] yn 00 VO ο 〇 〇 竦 SUS 316 壓延 銅备 壓延 銅结 (1)接著劑層 填充劑 氧化鋁 氧化鋁 氮化鋁 硬化劑 2E4MZ 2E4MZ 2Ε4ΜΖ 2E4MZ 2E4MZ ! 2E4MZ 2E4MZ 2E4MZ 2E4MZ 2E4MZ 2E4MZ 酚樹脂 CKM1634 CKM1634 CKM1634 _ CKM1634 CKM1634 CKM1634 CKM1634 1 CKM1634 CKM1634 CKM1634 環氧 樹脂 YL980 YL980 YL980 YL980 YL980 YL980 YL980 YL980 YL980 YL980 YL980 Dm BSj •+Τ-» ® ^ ； 过 Ει ο 〇 〇 g 〇 〇 ΓΛ 〇 m 〇 〇 〇 〇 1 1 1 Ί If Ί W Ί f #粜 丨1齧 二聚物酸 聚醯胺樹脂 二聚物酸 聚醯胺樹脂 二聚物酸 聚醯胺樹脂 二聚物酸 聚醯胺樹脂 丙烯腈聚 丁二烯樹脂 丙烯腈聚 丁二烯樹脂 丙稀腈聚 丁二烯樹脂 名稱 PA-200 PA-200 PA-200 _i 二聚物酸 聚醚醯胺 樹脂1 Macromelt 6900 Tomide 1350 PA-100 Macromelt 6900 Nipol 1043 Nipol 1043 Nipol 1043 省2 诺；2 ΐΚ 5 驷5 鸯2 省2 雀5 私5 錄—1 £ W 比較 例2 比較 例4 201207968 〔e<〕 接著力 [N/cm] 卜 卜 卜 卜 ν〇 Ο v〇 o < 对藥液性 W Si 垓趔 芸Μ 1 1 1 1 C級 1 Β級 1____ Β級 Β級 Β級 B級 B級 B級 A級 A級 金屬支撐 可撓性 基板 C級 C級 i c級 C級 C級 丨 Α級 1_____ Β級 Β級 :Α級 A級 B級 A級 A級 A級 穿扎性 剝離 缺口 長度 [μπι] ο Γ〇 cn 〇 <Ν fS o o o o 溢料 長度 [μπι] 〇〇 oo CN cs <N CN (Ν fS CN *-H o <N <N <N 耐壓 接著性 配線 沒入量[μπι] ο cn 〇 Ό 00 ο <Γ) yn ο Ο r*H o o 04 o <N 〇 O 〇 發泡 〇:無 △ : 1至10個 X : 50μπι以上或11個以上 < 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 捲曲量 [mm] ο p ο ο ο ο ο ο ο ο ο Ο ο o CN 〇 o o d o o o o 〇 o 絕緣信賴性 絕緣耐久 時間[hr] 280 350 390 320 390 ! 450 1_ 420 丨 450 450 300 275 450 450 450 ㈣ r—1 P § o 110 110 110 110 ο τ—Η 110 110 o 140 110 110 o 實施例1 實施例2 實施例3 實施例4 實施例5 實施例6 實施例7 實施例8 實施例9 實施例10 實施例11 實施例12 實施例13 實施例14 ,Li, 201207968 接著力 [N/cm] νο 卜 卜 卜 卜 卜 卜 寸 m 财藥液性 Μ地 τί驾 玆筇 £ y 1 1 i 1 1 1 1 1 1 I 1 金屬支撐 可撓性 基板 C級 C級 i C級 c級 1 C級 C級 1_ C級 C級 F級 F級 c級 剝離 雄 缺口 長度 [μπι]; 1 m 〇 r-H 00 〇 «ο 1〇 (Ν 溢料 長度 [μπι] is (N CM <N ο os IT) m 耐壓 接著性 配線 沒入量 [μηι] oo ο 00 o 00 d ν-ϊ ο Ο Γ〇 «λ d ο ΓΟ 〇 v〇 q O O 發泡 〇：無 △ : 1至10個 X : 50μΓη以上或11個以上 〇 〇 〇 〇 〇 <3 <1 〇 X X X 捲縮量 [mm] ο »-Η q i-H ο r·! Ο Ο ο Ο d 11.0 12.0 12.0 絕緣信賴性 絕緣耐久 時間[hr] 380 300 250 1 450 270 330 1 250 § «η m «〇 m m 塚靶 it'fftl IpOr 2 110 o 110 ^-Η ο »-Η 140 ο 140 140 o 實施例15 實施例16 實施例17 實施例18 實施例19 實施例20 實施例21 比較例1 比較例2 比較例3 比較例4 201207968 〔產業上利用之可能性〕 若根據本發明，由於一邊維持優異的絕緣性及穿孔 性，且一邊具有優異的線結合性或低捲曲性，便能夠容 易的封裝設計與散熱設計。使用本發明之金屬支撐可撓 性配線板的電子零件係具有使電路加工所必要的耐藥品 性或在金屬支撐可撓性基板之高電壓驅動成為可能的絕 緣性，使捲盤至捲盤之加工或穿孔加工、飛線之形成為 容易，且便能夠較習知之電子構件為簡單且低成本散熱 設計。 【圖式簡單說明】 無。 【主要元件符號說明】 無。 -39-The appearance of the Rohm & Haas company was evaluated as a drug resistance liquidity. The judgment criteria are as follows: (6-1) Metal-supported flexible substrate A grade: immersed in a liquid solution of sputum for 5 minutes, followed by immersion in 2 medicinal liquid for 5 minutes, further When the liquid medicine of 3 is immersed for 5 minutes, any one of them meets the requirements of the following (丨) and (Η). Grade B: Although the above-mentioned requirements of Class A did not meet the requirements, it was dipped for 3 minutes in the liquid solution of the cockroach, followed by dipping for 3 minutes in the liquid of 2, and further dipped for 3 minutes in the liquid of 3 In the case of any of the following (1) and (ii) requirements. Grade C: immersed in the liquid of i for 3 minutes, then dipped in the liquid of 2 for 3 minutes, and further dipped for 3 minutes in the liquid of 3, although the following items (i) meet the requirements. 'But the following (Η) requirements are not in compliance with the situation. -20- 201207968 Class F: Immersion for 3 minutes in the liquid of 1st, followed by dipping for 3 minutes in the liquid of 2, and further dipping for 3 minutes in the liquid of 3, none of them Compliance with the requirements of (i) and (ii) below. (i) On the surface appearance of (1) the adhesive layer, no significant damage due to the chemical solution was observed. (ii) in the case where the (3) support coating layer is not formed on the opposite side of the (1) adhesive layer of the (2) support, the surface appearance on the side opposite to the (1) adhesive layer of the (2) support No obvious damage caused by the liquid was observed. Further, in the case where (2) the support coating layer is formed on the opposite side of the (1) adhesive layer of the (2) support, (3) is formed on the opposite side of the (1) adhesive layer of the (2) support. The surface appearance of the support coating layer and (2) the opposite side of the support body, no significant damage due to the chemical liquid was observed. (6-2) Case of metal-supported flexible substrate with hinge hole A grade: immersed in the liquid solution of 1 for 5 minutes, followed by immersion in 2 liquid for 5 minutes, further 3 When the liquid was immersed for 5 minutes, all of the following conditions (i) to (iii) were met. A 'Class: Although the above-mentioned A-level requirements are not met, it is dipped for 3 minutes in the liquid solution of 1 and then 3 minutes in the liquid of 2, and further dipped for 3 minutes in the liquid of 3 All of the following conditions (i) to (iii) are met. Grade B: The following (i) to (iii) were met when the solution was immersed for 3 minutes in the liquid of 1 and then immersed in the liquid of 2 for 3 minutes and further immersed for 3 minutes in the liquid of 3 Any two of the requirements. -21 - 201207968 Grade C: immersed in the liquid of 1 for 3 minutes, then dipped in the drug for 3 minutes, and further dipped 3 points in the liquid of 3 to meet the following (i) In the case of any of the requirements of (iii), T' 'F class: immersed in the liquid solution of 1 for 3 minutes, then dipped in 4 parts of the drug for 3 minutes, further in the liquid of 3 Three conditions of immersion and 夂 all fail to meet the requirements of (i) to (iii) below. T' ’ (i) is a significant damage caused by the appearance of (1) the surface of the adhesive layer. It is not observed that the gj solution (11) is in the (2) support layer (1) and the support layer is not formed (.3) on the support layer, and in the (2) support (1) The surface appearance of the opposite side of the coating layer was not observed to be significantly damaged by the chemical solution. Further, in the case where (2) the support layer is formed on the opposite side of the (1) adhesive layer, the support coating layer is formed on the opposite side of the (1) adhesive layer formed on the (2) mesh support. (3) The surface appearance of the support coating layer and (2) the opposite side of the support body, and no obvious damage due to the sputum of the chemical liquid was observed. (iii) No obvious damage due to the chemical solution was observed in the hole profile. (7) Adhesiveness of the metal-supportable circuit board The metal-supported flammable circuit board obtained in each of the examples and the examples (the conductor width is 50, and the system is used by Toyo (Baldwin)). The direction of the conductor is 5 〇匪 / min < speed and the conductor is 8 N / cm or more, which is good. ' Then & tear strength at this time. Can judge: then it is too 6, the sentence is good; if it is 6 N/cm or more, then -22-201207968 (Example 1) (a) Preparation of an adhesive layer sheet (A) Dimer acid polyamide resin ("Sunmide, (registered by registrar) HT-100G) , manufactured by Air Products Japan, amine price 1, melt viscosity 7.0 Pa · s ) 1 〇〇 by weight, (b) phenolic phenolic resin (CKM1634 Showa Polymer Co., Ltd.) 5 parts by weight, (c) epoxy 80% by weight of (Epicoat (s) brand yl 98 〇, japan Epoxy Resin), (D) hardening accelerator (2_ethyl_4 methyl amide (2E4MZ), manufactured by Tokyo Chemical Industry Co., Ltd.) 2 parts by weight, ethanol/nonylbenzene mixed solvent (mixed weight ratio ethanol 1: toluene 4), stirred at 30 ° C, mixed Solid content concentration: 25% by weight of the composition of the adhesive. Using a bar coater, (5) protective film (polyethylene terephthalate film with a thickness of 25 μm with a deoxixing mold release agent) In the "FUmbyna" (registered trademark) GT)), the adhesive composition was applied in a dry thickness of about 12 pm, and the other (5) protective film was made after 干燥5〇β (: drying * minutes) Bonding to the formed (丨) adhesive layer to produce (5) a protective film to cool the adhesive layer sheets on both sides. (b) Fabrication of a metal-supported flexible substrate and a metal-supported flexible circuit substrate The adhesive layer obtained by the method described above is peeled off on one side of the (5) protective film of the above-mentioned sheet, and laminated on (2) the support body (embossed copper box (1) under conditions of 1 〇 c c, 〇 3 Mpa ( ΒΉγ_22Β τ) 7〇 thickness (made by Nippon Mining Metal Co., Ltd.) The linear expansion coefficient is ΐ6 〇ρρ〇, and the metal-supported flexible substrate is obtained. -23- 201207968 Stripped metal-supported flexible substrate (5) Protective belly · 3 MPa pressure conditions and laminated, with 14 (TC, 卞 bar layer 18 The electrolysis of μιη is carried out in an air-baked phase, followed by 8 Å. The metal-supported flexible substrate of the 'metal' is supported by a conventional method to form a metal substrate for a flexible substrate with a copper box with a circuit: The copper box surface is formed by photoresist film, etching, and photoresist f ^ to form the wiring pitch H) - (the conductor width is 50 μη〇 of the counter electrode circuit, and then the fluorolubic acid system (Rohm & Haas tin plating solution ( In the electroless tin plating solution of "TINPOSIT" (registered trademark) LT_34, the metal-supported flexible circuit board was obtained by performing a plating treatment at a thickness of 0.5 μm at 70 ° C for 5 minutes. The metal supporting flexible substrate and the metal 1-bond flexible circuit substrate of the evaluation metal supporting flexible substrate obtained by the above method and the copper foil for circuit formation were evaluated by the above (1) to (7). (Example 2) In the production of the adhesive layer sheet, (A) dimer acid polyamine resin ("T 〇mide '' (registered trademark) TXC-232C was used in addition to the components (A) to (D). , manufactured by Fuji Chemical Industry Co., Ltd., amine price ΐ〇·〇, melt viscosity 24.0 Pa·s) 100 parts by weight, (Β) phenolic phenol resin (CKM1634 Showa Polymer Co., Ltd.) 5 parts by weight, (C) ring Oxygen resin ("Epicoat" (registered trademark) YL980, manufactured by Japan Epoxy Resin Co., Ltd.) 80 parts by weight, (D) hardening accelerator (2-ethyl-4-mercaptoimidazole (2E4MZ), manufactured by Tokyo Chemical Industry Co., Ltd.) 2 weight In addition to the parts, the same method as in Example 1 was used to carry out the evaluation described in 5 (1) to (7). -24-201207968 (Example 3) In the production of the adhesive layer sheet, except (A) To (D) component, (A) monomeric acid polyamine resin (" τ 〇mide, (registered trademark) PA-200 'Fuji Chemical Industry Co., Ltd., amine price 3, melt viscosity 40_0 Pa · s 50 parts by weight, (B) phenolic phenol resin (manufactured by ckm1634 Showa Polymer Co., Ltd.), 50 parts by weight, C) Epoxy resin ("Epic〇at" (registered trademark) YL980, manufactured by Japan Epoxy Resin Co., Ltd.) 8 〇 heavy boring tool, (D) hardening accelerator (2-ethyl-4-methyl glutinous rice glutinous rice (2E4MZ) The results described in (1) to (7) were produced by the same method as in Example 1 except that the amount was 2 parts by weight. (Example 4) In the production of the adhesive layer sheet, (A) dimer acid polyether phthalamide resin ("Tomide" (registered trademark) PA-200, Fuji, was used in addition to the components (A) to (D). Chemical Industry Co., Ltd., amine price 3, melt viscosity 40.0 Pa · s) 1 〇〇 by weight, (B). Resole phenolic sapwood (CKM 1 634 Showa Polymer Co., Ltd.) 50 parts by weight, (C) Epoxy resin ("Epicoat" (registered trademark) YL980, manufactured by Japan Epoxy Resin Co., Ltd.) 80 parts by weight, (D) hardening accelerator (2-ethyl-4-mercaptoimidazole (2E4MZ), manufactured by Tokyo Chemical Industry Co., Ltd.) 2 In addition, (E) 鈒 filler ("Adomafine" (registered trademark) AO-502, average particle size 0·7 was added to the ethanol/nonylbenzene mixed solvent (mixed weight ratio ethanol 1 ··toluene 4). In the same manner as in Example 1, except that the mixed solvent in which the sand mill was dispersed and treated was used in advance, the evaluation described in (1) to (7) was carried out in an amount of 300 parts by weight. . -25-201207968 (Example 5) (a) Preparation of an adhesive layer sheet In the production of an adhesive layer sheet, (A) dimer acid polyether amide resin was used in addition to (A) to (D) components. ("T〇mide" (registered trademark) PA-200, manufactured by Fuji Chemical Industry Co., Ltd., amine price 3, melt viscosity 40·0 Pa · s) 1 part by weight, (b) resol phenolic resin (CKM1634 Showa 50 parts by weight of the polymer company, (C) epoxy resin ("Epicoat, (5 main volume) YL980, made by Japan Epoxy Resin Co., Ltd.) 80 heavy star injury, (D) hardening accelerator (2_ethyl An adhesive sheet was produced in the same manner as in Example 1 except that _4_mercaptoimidazole (2E4mz), manufactured by Tokyo Chemical Industry Co., Ltd.) (b) metal-supported flexible substrate and metal support with hinged holes The flexible circuit board and the metal-supported flexible substrate are produced by cutting the adhesive sheet obtained by the method described in the above (a) into a width of 30 mm and then peeling off (5) one side of the protective film, i层压c, 0.3 MPa condition and laminate (2) support (aluminum foil 50 μm thick, 35 mm wide) The degree of linear expansion (22.0 ρρηι) is obtained by the degree of the linear expansion coefficient (22.0 ρρηι). The metal-supported flexible substrate is formed by a hole in the metal-supported flexible substrate by drilling one hole at each end. (square with a hole diameter of 1.98 mmxl.98 mm, pitch 4.75 mm) 'Get a metal-supported flexible substrate with a hinge hole. Strip the metal-supported flexible substrate with a hinge hole (5) protective film at 140 ° C, An electrolytic copper foil of i 8 μm is laminated under the conditions of a pressure of 0.3 MPa, and then sequentially carried out in an air oven at 8 Torr. 〇/3 hours, -26-201207968 at 1 〇 (rC/5 hours, at 15 ( The rc/5-hour heating path forms a metal-supported flexible substrate with a copper box. "Electrical connection: a metal branch of a copper flute formed by a conventional method obtained by a conventional method. Forming, exposing, and developing the photoresist film on the side of the surface of the j-side, and then coating the back-sealing material mm material on the entire surface of the back surface with a brush: after the etching, the photoresist is peeled off. 'Back seal material peeling \ wiring spacing 100, (conductor width 50 μ对 对 对 电极 于 于 于 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟 氟C, 5 minutes of impregnation treatment, plating of 〇 5 μιη thickness, to obtain a metal-supported flexible circuit substrate. The evaluation metal obtained by the above method supports the flexible base =, the metal support with the hinge hole can be The flexible substrate, the metal-supporting flexible substrate for copper plating, and the metal flexible circuit substrate are evaluated by the above (1) to (7). (Example 6) A Tg3 crucible was used as the (3) branch coating layer. . The average weight is 1 10 0 0, the epoxy resin mixing ratio 丨〇% of the polyamido quinone imide resin 3.0 μπι is coated as (2) the support of the aluminum foil (5 〇 4 ^ 1 thickness (live Ming The (system) system was produced in the same manner as in Example 5 except for the two sides of the coefficient of linear expansion (2 〇ppm), and the evaluations described in (丄) to (7) were performed. (Example 7) A coating was carried out using 15 μΐΏ of a polyamine 醯-27- 201207968 imine resin as a (3) support coating layer of Tg 300 艽, a weight average molecular weight of 1 1000, and an epoxy resin mixing ratio of 1% by weight. It is produced in the same manner as in the fifth embodiment except for the two sides of the (2) support (5 〇 _ thickness (manufactured by Light Industries, Inc.) linear expansion coefficient MO ppm), and the (丨) is performed until (7) The assessment of the records. (Example 8) A coating was carried out (2) using a polyacrylamide imine resin 3.0 μΙη as a (3) support coating layer, Tg 25〇t: weight average molecular weight 8000, and epoxy resin mixing ratio of 1% by weight. In the same manner as in Example 5, the aluminum box (5 〇^^ thickness (manufactured by Light Aluminum Co., Ltd.) linear expansion coefficient 22 〇 ppm) of the support was produced, and the (i) to ( 7) The assessment of the records. (Example 9) An aluminum foil (50 μηι thickness (50) supported as a (2) support was used as a (3) support coating layer of Tg 3 〇 (TC, a weight average molecular weight of 12,000 polyimine resin 3 〇μηι) The evaluation described in (1) to (7) was carried out in the same manner as in Example $ except that the two sides of the linear aluminum alloy (manufactured by Light Aluminum Co., Ltd.) were linearly expanded by a coefficient of 22·0 Ppm. (Example 10) In the preparation of the layer of the layer, the (A)-component acid-polyamide resin ("T 〇m丨de" (registered trademark) pa - 1 〇〇, manufactured by Fuji Chemical Industry Co., Ltd., The evaluation of the above (1) to (7) was carried out in the same manner as in Example 6 except that the amine valence and the melt viscosity were 18 ÅPa. 100 parts by weight. (Example 11) In the production of the sheet, in addition to the (A) component, (A) dimer acid polyamide resin ("T〇mide, (registered trademark) PA-100, -28-201207968, manufactured by Gentleman Chemical Industry Co., Ltd., amine) The same method as in Example 7 except that the valence and the melt viscosity were 180.0 Pa·s) and 100 parts by weight. The evaluations described in (1) to (7) were carried out. (Example 1 2) In addition to the use of Tg 30 as a (3) support coating layer, rc, a polyiminoimine having a weight average molecular weight of 1 〇〇〇 The resin 3 μηι is coated as (2) the support box of the support (5〇μηι thickness (made of light aluminum (manufactured)) linear expansion coefficient 22.0 ppm) (i) the adhesive layer side, at 3 (rc roll layer opposite KT-50 (manufactured by Kawamura Sangyo Co., Ltd.) consisting of an adhesive on the polyethylene terephthalate film (peelable adhesive layer 2 聚, polyethylene terephthalate film) In the same manner as in Example 5, the evaluation described in (i) to (7) was carried out except for 50 Pm). (Example 1 3) When a metal-supported flexible substrate with a hinge hole was produced In addition to the cross-section of the hinge hole, the electrode part of the epoxy resin-based electrode deposition coating is 16 〇〇 ^ 八 1 / 40 (311 丨 111 ^ 511 (manufactured)) electrode deposition film thickness 1 〇 μιη, at 1 It was produced by the same method as in Example 6 except that the (4) hole cross-section coating layer was formed by drying at 00 ° C for 15 minutes. The evaluation described in (1) to (7) is carried out. (Example 14) In the production of a metal-supported flexible substrate with a hinge hole, except that the resin portion is a polyimide resin-based electrodeposition coating Elec〇 In the same manner as in Example 13, except that the (b) hole cross-section coating layer was produced, the evaluation described in (1) to (7) was carried out. -29-201207968 (Example 1 5) In the production of the adhesive layer sheet, (A) dimer acid polyether amide resin ("T〇mide" (registered) was used in addition to (A) to (D) components. Trademark) PA-200'Fuji Chemical Industry Co., Ltd., Amine 胄3, Solubility Viscosity 40.0Pa s) 100 parts by weight, (b) Resole phenolic resin (CKM1634 Showa South Molecular Co., Ltd.) 50 parts by weight, (C) Epoxy resin ("Epic〇at" (registered trademark) YL980 'made by japan Ep〇xy Resin Co., Ltd.) 8 parts by weight, (D) hardening accelerator (2_ethyl·4_methyl. imiazole (2E4mz) 2 parts by weight of Tokyo Chemical Co., Ltd., and (E) aluminum filler ("Adomafine" (registered trademark) a〇_ added to the ethanol/nonylbenzene mixed solvent (mixed weight ratio ethanol 1: 曱 4 4) 502, an average particle diameter of 0.7 μm, and a product of 3 parts by weight of Adomatech Co., Ltd., previously using a mixed solvent dispersed by a sand mill, and further using SUS3 16 6 foil (70 μm thickness (Toyo Fine Foil ( In the same manner as in Example i, except that the coefficient of linear expansion was 18.5 ppm) The evaluations described in (1) to (7). (Example 1 6) In the production of the adhesive layer sheet, (A)-polymeric polyacrylamide resin ("τ 〇m丨de" (registered trademark) was used in addition to the components (A) to (D). PA-200, manufactured by Fuji Chemical Industry Co., Ltd., amine price 3, melt viscosity 40.0 Pa.s) 100 parts by weight, (B) 曱 盼 盼 盼 树脂 树脂 ( CK CK CK CK CK CK CK CK CK CK CK CK CK CK CK CK CK CK CK CK CK Oxygen resin ("Epicoat" (registered trademark) YL980, manufactured by Japan Epoxy Resin Co., Ltd.) 8 parts by weight, (D) hardening accelerator (2-ethyl-4-methyl scent (2E4MZ), manufactured by Tokyo Chemical Industry Co., Ltd.) 2 parts by weight 'In addition, (E) aluminum filler ("Adomafine" (registered trademark) AO-502 is added to the ethanol/toluene mixed solution -30 - S. 201207968 agent (mixing weight ratio ethanol 1: toluene 4) , an average particle diameter of 0.7 μm, manufactured by Adomatech Co., Ltd., 300 parts by weight, in advance using a mixed solvent dispersed by a sand mill, and (2) a support system using aluminum crucible (50 μm thickness (residing light aluminum ( The same method as in Example 1 except that the coefficient of linear expansion was 22.0 ppm) Production, and the evaluation described in (1) to (7) is performed. (Example 1 7) In the production of the adhesive layer sheet, (A) dimer acid polyether phthalamide resin ("T〇mide" (registered trademark) PA- was used in addition to the components (A) to (D). 200, manufactured by Fuji Chemical Industry Co., Ltd., amine price 3, melt viscosity 40·0 Pa · s ) 100 parts by weight, (B) 50 parts by weight of Chunshen resin (manufactured by ckM 1 634 Showa Polymer Co., Ltd.), ( C) Epoxy resin ("Epicoat" (registered trademark) YL980, manufactured by Japan Epoxy Resin Co., Ltd.) 8 〇 heavy parts, (D) hardening accelerator (2-ethyl-4-methyl MM sitting (2E4MZ), East 2 parts by weight of the company, manufactured by Kasei Co., Ltd., and a (Ε) aluminum nitride filler (Η, average particle size 1.7 μΓη, T) is added to the ethanol/nonylbenzene mixed solvent (mixed weight ratio ethanol 1: toluene 4). In the same manner as in Example 300, the method described in (1) to (7) was carried out in the same manner as in Example 300, using a mixed solvent of a dispersion treatment by a sand mill in advance, in a manner of 300 parts by weight of 〇kuyama Co., Ltd. . (Example 1 8) In the production of the adhesive layer sheet, (A) dimer acid polyether phthalamide resin ("T〇mide" (registered trademark) PA- was used in addition to the components (A) to (D). 200, Fuji Chemical Co., Ltd., amine price i, melt viscosity 201207968 40.0 Pa · s): Dimer acid polyamide resin ("T〇Inide" (registered trademark) PA-100, manufactured by Fuji Chemical Co., Ltd., amine Price 熔融, melt viscosity 18 0.0 Pa · s ): Dimer acid polyamide resin ("T〇inide" (registered trademark) 5 3 5, manufactured by Fuji Chemical Industry Co., Ltd., amine price 5 〇, melt viscosity 1.0 Pa · s) weight ratio 2 : i : 〇5 mixture (amine price 7 丨, melt viscosity 80 Pa. s) (dimer acid polyether amide resin) 1 〇〇 part by weight, (B) 曱p white test secret 50 parts by weight of (C) epoxy resin ("Epicoat" (registered trademark) γ [98〇, manufactured by Japan Epoxy Resin Co., Ltd.) 8 parts by weight, (〇) hardening accelerator (2-ethyl-4-methylimidazole (2E4MZ), manufactured by Tokyo Chemical Industry Co., Ltd.), except for 2 parts by weight, was produced by the same method as in Example 1. The line (1) to (7) described in the evaluation. (Example 1 9) In the production of the adhesive layer sheet, (A) dimer acid polyamine resin ("Macr〇melt, (registered trademark) 690 0) was used in addition to the components (A) to (D). , manufactured by Henkel Japan Co., Ltd., amine valence, melt viscosity 10 Pa · s) 100 parts by weight, (B) 50 parts by weight of phenolic phenolic resin (CKM163 4 manufactured by Showa Polymer Co., Ltd.), (C) epoxy resin (" Epic〇at" (registered trademark) YL980, manufactured by Japan Epoxy Resin Co., Ltd.) (8) parts by weight, (D) hardening accelerator (2-ethyl-4-mercaptoimidazole (2E4MZ), manufactured by Dongsei, Kasei Co., Ltd.) 2 The evaluations of the above (1) to (7) were carried out in the same manner as in Example 1 except that the weight was straight. (Example 20) In the production of the adhesive layer sheet, except for (A) to (D) The component is (A) dimer acid polyamide resin ("T〇mide" (registered trademark) 1350, manufactured by Fuji Chemical Industry Co., Ltd., amine price 10, viscous viscosity pa. s) -32- 201207968 100 weight (B) phenolic phenol resin (manufactured by CKM1634 Showa Polymer Co., Ltd.) 50 parts by weight, (C) epoxy resin ("Epicoat (registered trademark) YL980, manufactured by Japan Epoxy Resin Co., Ltd., used and implemented in addition to 2 parts by weight of (D) hardening accelerator (2-ethyl-4-mercaptoimidazole (2E4MZ), manufactured by Tokyo Chemical Industry Co., Ltd.) In the same manner as in Example 1, the evaluations described in (1) to (7) were carried out. (Example 2 1) In the production of the adhesive layer sheet, (A) to (D) were used (A). Dimer acid polyamide resin ("Tomide" (registered trademark) ΡΑ-1〇〇, manufactured by Fuji Chemical Industry Co., Ltd., amine price 0, melt viscosity 180.0 Pa · s) 1 〇〇 by weight, (B) 曱50 parts by weight of phenolic phenolic resin (manufactured by CKM 1 634 Showa Polymer Co., Ltd.), (C) epoxy resin ("Epicoat" (registered trademark) YL980, manufactured by Japan Epoxy Resin Co., Ltd.) 80 parts by weight, (D) hardening acceleration The evaluations described in (1) to (7) were carried out in the same manner as in Example 1 except that 2 parts by weight of a solvent (2-ethyl-4-mercaptoimidazole (2E4MZ), manufactured by Tokyo Chemical Industry Co., Ltd.) was used. (Comparative Example 1) In addition to the (A), (C), and (D) components in the production of the adhesive layer sheet (A) Dimer polyamine resin ("Macromelt, (registered trademark) 6900, manufactured by Henkel Japan Co., Ltd., amine valence, smelting viscosity 10 Pa · s) 1 part by weight, (C) epoxy 80 parts by weight of resin ("Epicoat" (registered trademark) YL980, manufactured by Japan Epoxy Resin Co., Ltd.), (D) 2 parts by weight of a hardening accelerator (2-ethyl-4-methylimidazole (2E4MZ), manufactured by Tokyo Chemical Industry Co., Ltd.) The evaluation described in (1) to (7) was carried out in the same manner as in Example 1 except that the component (B) was not used. -33-201207968 (Comparative Example 2) In the production of the adhesive layer sheet, in addition to the components (A) to (D), (A) propylene guessing polybutylene resin ("N ip 〇1 '' ( Cologne brand) 1043, manufactured by Zeon Co., Ltd., 100 parts by weight, (b) 曱 纷 纷 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( In the same manner as in Example 1, except that 80 parts by weight of (D), a hardening accelerator (2 ethyl.4_methylimidazole (2E4MZ), manufactured by Tokyo Chemical Industry Co., Ltd.) was used in an amount of 80 parts by weight, which is a trademark of YL980 and Japan Ep0Xy Resin Co., Ltd. The method described was carried out, and the evaluations described in (丄) to (7) were carried out. (Comparative Example 3) In addition to the inscription (50 μηι thickness (manufactured by Light Aluminum), the linear expansion coefficient was 22.0 ppm) as (2) The use of the support was carried out in the same manner as in Comparative Example 2, and the evaluations described in (丨) to (7) were carried out. (Comparative Example 4) Tg3 〇〇 was used as the (3) support coating layer. C. Polyamido quinone imine resin 3 having a weight average molecular weight of 1 1000 and an epoxy resin mixing ratio of 1% by weight In the same manner as in Comparative Example 2, except that both sides of the aluminum foil (5 〇μηη thickness (manufactured by Light Aluminum Co., Ltd.) linear expansion coefficient: 22.0 ppm) of the support (2) were coated, the same was carried out. Evaluations described in the summers to (7). (i) the adhesive layer, the (2) support group, the (3) support coating layer, and the (4) hole cross-section coating layer used in each of the examples and the comparative examples. 2 Further, the laminated body temperature and measurement results of the copper foil for circuit formation are shown in Tables 3 and 4. -34- !; 201207968 (4) Hole section coating resin 1 m #- 瑞 epoxy resin polyimide resin (3) Support coating m 〇〇r*^ 〇〇•-Η ο 1 〇〇fN 〇〇r-^ Ο oo oo 1 〇〇τΉ 〇〇〇ΓΟ 〇m ο <Ν Ο m Ο m Ο Om 1 Ο m 〇〇rn i〇Ο c^i ο rn ο cn ·-Η O cn 〇ο rn Ο fO 荜 甾 Dm tea η; 甾耷鳕粜婳 paddle 婳 靼 靼 靼 ^ 4^ iJtn t&amp OIZ 婳甾培ii)〇i >€3 to? 粜食粜“X 鍩荜食粜ύ ϋ狴筚A spectrum 甾趟aim «3 ΒΧ; 粜«4 «Η (2) Branch body ^ P ^ E §: 癍一^ B 〇趔 冢 ^ ^ ^ ^ (1) Adhesive layer 颂 carbon NSS CS Ν s ω (Ν Ν SS (Ν NSS (NN s S CN N 2 S CN Ν s ω <Ν Ν S s (NNSS <N Ν 2 s CN Ν S 5 CN NSS (N Ν SS (Ν · SS (Ν H·.*»念ο 1 U 芝Ό ϊ υ ? : VO SU inch S Ϊ U inch S u art VO r-< SU inch S ι·Η S u 芝 v〇su inch 3 T—Η U inch cn v〇§ U 芝 s〇iu inch SU inch mv〇Ϊ U 寸 S rH Ϊ 〇ffif狴§ S g 3 § 2 > g 2 • o 00 3 > ss 卜 g 3 s 3 g 3 >-· g 3 g 2 g S > § S § 2 JtD ns : Μ . ® (£ 绂uq 〇〇o ο OO ο § § ο 〇〇ο m CO mmoo cn ΓΛ Si S silver il ® ^ If If S ^ 丨 丨 1 怒 Ί Ί f 铋 淫 铋 Ί f潜客客粜MW «ν jjm βγΓ π^ 怒耷#绪Ί W 铋谱Μ l1 蓉甾丨1 I 蓉鸪铋谱丨1 f Good Jtn SI il ® Dot 45*< I ^ 衾雄>1 S BiT 啮 蓉 丨 丨 I I I I 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 < CU 〇<N < cu Ο CN < α. 〇(Ν < 0-. Ο (Ν <; CL, ο (Ν < (X 〇(N < CU o < CL, o < Ph 〇CN < 〇 (N < 〇CM < Ah Province - ίψο: ^ (K 5 ik 5 竺省省卜W Province 00 No 2 contend: 5 mourning 2% SK 5 镩 2 material 5 201207968 (4) Cave section coating layer 11 ts *4τ» 1 1 1 1 1 1 1 1 \ 1 1 (3) Support coating layer 41 11000 〇 Thickness _ 醯 Polyamide amide imine resin (2) Support body thermal expansion Coefficient [ppm/°C] yn 00 VO ο 〇〇竦 SUS 316 Calendered copper rolled copper (1) Adhesive layer filler Alumina alumina aluminum nitride hardener 2E4MZ 2E4MZ 2Ε4ΜΖ 2E4MZ 2E4MZ ! 2E4MZ 2E4MZ 2E4MZ 2E4MZ 2E4MZ 2E4MZ Phenol Resin CKM1634 CKM1634 CKM1634 _ CKM1634 CKM1634 CKM1634 CKM1634 1 CKM1634 CKM1634 CKM1634 Epoxy YL980 YL980 YL980 YL980 YL980 YL980 YL980 YL980 YL980 YL980 YL980 Dm BSj •+Τ-» ® ^ ; Ει ο 〇〇g 〇〇ΓΛ 〇m 〇〇〇〇1 1 1 Ί If Ί W Ί f #粜丨1 二Dimer acid Polyamide resin dimer acid polyamide resin dimer acid polyamide resin dimer acid polyamide resin acrylonitrile polybutadiene resin acrylonitrile polybutadiene resin acrylonitrile polybutadiene resin Name PA-200 PA-200 PA-200 _i Dimer acid polyether amide resin 1 Macromelt 6900 Tomide 1350 PA-100 Macromelt 6900 Nipol 1043 Nipol 1043 Nipol 1043 Province 2 Connaught; 2 ΐΚ 5 驷 5 鸯 2 Province 2 Finch 5 Private 5 Record - 1 £ W Comparative Example 2 Comparative Example 4 201207968 [e<] Next force [N/cm] Bubbu ν〇Ο v〇o < For liquid chemical W Si 垓趔芸Μ 1 1 1 1 C grade 1 Β grade 1____ Β grade Β grade B grade B grade B grade B grade A grade A grade metal support flexible substrate C grade C grade ic grade C grade C grade 丨Α grade 1_____ Β grade Β grade: Α Grade A grade B grade A grade A grade A grade wear stripping gap length [μπι] ο Γ〇cn 〇<Ν fS oooo flash length [μπι] 〇〇oo CN cs <N CN (Ν fS CN * -H o <N <N <N pressure-resistant adhesive wiring immersion [μπι] ο cn 00 00 ο <Γ) yn ο Ο r*H oo 04 o &lt ; N 〇 O 〇 foaming 〇: no △: 1 to 10 X: 50 μπι or more or 11 or more < 〇〇〇〇〇〇〇〇〇〇〇〇〇 curl amount [mm] ο p ο ο ο ο ο ο ο ο ο Ο ο o CN 〇oodoooo 〇o Insulation reliability insulation endurance time [hr] 280 350 390 320 390 ! 450 1_ 420 丨450 450 300 275 450 450 450 (4) r-1 P § o 110 110 110 110 ο τ—Η 110 110 o 140 110 110 o Embodiment 1 Embodiment 2 Embodiment 3 Embodiment 4 Embodiment 5 Embodiment 6 Example 7 Example 8 Example 9 Example 10 Example 11 Example 12 Example 13 Example 14 , Li, 201207968 Then force [N/cm] νο 卜 卜 卜 卜 姆 姆 姆 姆 姆 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克Substrate C grade C grade i C grade c grade 1 C grade C grade 1_ C grade C grade F grade F grade c grade stripping male notch length [μπι]; 1 m 〇rH 00 〇«ο 1〇 (Ν flash length [μπι] is (N CM <N ο os IT) m pressure-resistant adhesive wiring immersion [μηι] oo ο 00 o 00 d ν-ϊ ο Ο Γ〇« λ d ο ΓΟ 〇v〇q OO Foaming 〇: No △: 1 to 10 X: 50μΓη or more or more than 11〇〇〇〇〇<3 <1 〇XXX Retraction [mm] ο »- Η q iH ο r·! Ο Ο ο Ο d 11.0 12.0 12.0 Insulation reliability insulation endurance time [hr] 380 300 250 1 450 270 330 1 250 § «η m «〇mm 冢 target it'fftl IpOr 2 110 o 110 ^-Η ο »-Η 140 ο 140 140 o Example 15 Example 16 Example 17 Example 18 Example 19 Example 20 Example 21 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 201207968 [Industrial use According to the present invention, it is possible to easily design a package and heat dissipation while maintaining excellent insulation properties and puncture properties while having excellent wire bonding properties or low curl properties. The electronic component using the metal-supported flexible wiring board of the present invention has the chemical resistance necessary for circuit processing or the high-voltage driving of the metal-supported flexible substrate, making the reel-to-reel Processing or perforation processing, flying line formation is easy, and the electronic components can be designed in a simple and low-cost heat dissipation. [Simple description of the diagram] None. [Main component symbol description] None. -39-

Claims (1)

201207968 七、申請專利範圍： 1 · 一種金屬支撐可撓性基板，其特徵係在由（丨）接著 劑層與（2 )支撐體所構成的金屬支撐可撓性基板， (2 )支撐體係利用金屬箔所構成，且（丨）接著劑層 為含有3 ( A)二聚物酸殘基之聚醯胺樹脂及（B )酚 樹脂。 2. 如申請專利範圍第！項之金屬支撐可撓性基板，其中 在（2 )支撐體之（丨）接著劑層側及/或其相反側構 成（3)支撐體被覆層。 3. 如申請專利範圍第2項之金屬支撐可撓性基板，其中 (3 )支撐體被覆層係對（2 )支撐體具有剝離性。 4. 如申請專利範圍第2或3項之金屬支撐可撓性基板， 其中（3)支撐體被覆層之厚度為2μιη以上且ι〇〇μιη 以下。 5 .如申請專利範圍第 性基板，其中（3 ) 胺樹脂。 2至4項中任—項之金屬支撐可撓 支撙體被覆層為含有聚醯胺醯亞 =請專利範圍第H 可挽 土板，其中含（Α)二聚物酸殘基之聚醯 胺價為0.5至1〇。 'I”利範圍第1至6項中任一項之金屬支撐可撓 二基板，其中⑺支撐體係由鋼羯、不錄鋼馆、銘 治及鎳箔所選出的一種。 種 =帶式自動結合用金屬支樓承栽帶，其係使用如 =專利範圍第…項中任-項之金屬支撐可撓性 丞敬0 -40- 201207968 9. 一種LED封裝用金屬可撓性電路基板，其係使用如申 請專利範圍第1至7項中任一項之金屬支撐可撓性基 板。 10. —種經電路形成用銅箔積層之金屬支標可撓性電路 基板’其特徵使用如申請專利範圍第1至7項中任一 項之金屬支撐可撓性基板之經電路形成用銅箔積層 之金屬支撐可撓性電路基板，藉由電路形成用之金屬 層所形成的電路為具有飛線（flying lesd)構造。 -41 - 201207968 四、指定代表圖： (一） 本案指定代表圖為：無。 (二） 本代表圖之元件符號簡單說明： 無。 五、本案若有化學式時，請揭示最能顯示發明特徵的化學式:201207968 VII. Patent application scope: 1 · A metal-supported flexible substrate characterized by a metal-supported flexible substrate composed of a (丨) adhesive layer and (2) a support, (2) a support system utilization The metal foil is composed of, and the (丨) adhesive layer is a polyamine resin containing 3 (A) dimer acid residues and (B) a phenol resin. 2. If you apply for a patent scope! The metal-supporting flexible substrate comprises (3) a support coating layer on the side of the (2) adhesive layer and/or the opposite side thereof. 3. The metal-supported flexible substrate of claim 2, wherein (3) the support coating layer has a peeling property to the (2) support. 4. The metal-supported flexible substrate according to claim 2 or 3, wherein (3) the thickness of the support coating layer is 2 μm or more and ι 〇〇 μη or less. 5. A patented range of substrates, (3) an amine resin. The metal-supported flexible support body coating of any of items 2 to 4 is a polyamidoxime-containing material. The scope of the patented H-thickness plate containing the (Α) dimer acid residue The amine price is from 0.5 to 1 Torr. The metal support flexible substrate of any one of items 1 to 6 of the 'I' range, wherein (7) the support system is selected from the steel shovel, the non-recorded steel hall, the Mingzhi and the nickel foil. The use of a metal branch bearing belt, which is used as a metal support for any of the patent scopes... Item: 0-40-201207968 9. A metal flexible circuit board for LED packaging, A metal-supported flexible substrate as in any one of claims 1 to 7 is used. 10. A metal-clad flexible circuit substrate which is laminated by a copper foil for circuit formation is used as a patent application The metal-supported flexible circuit board of the metal-supporting flexible substrate of the metal-supporting flexible substrate according to any one of the first to seventh aspects, wherein the circuit formed by the metal layer for circuit formation has a flying lead ( Flying lesd) Structure -41 - 201207968 IV. Designated representative map: (1) The representative representative of the case is: No. (2) The symbol of the representative figure is simple: No. 5. If there is a chemical formula in this case, please reveal Most able to display inventions Chemical formula of the levy:
TW100110739A 2010-03-30 2011-03-29 Metallic supporting flexible substrate and metallic supporting carrier tape for tape automated bonding using same, metallic supporting flexible circuit substrate for LED mounting and copper foil laminated metallic supporting flexible TW201207968A (en)

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US10292262B2 (en) 2012-07-18 2019-05-14 Kaneka Corporation Reinforcing-plate-integrated flexible printed circuit board

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TWI800261B (en) * 2022-02-15 2023-04-21 台虹科技股份有限公司 Method for manufacturing a rolled laminate

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US10045433B2 (en) 2012-07-18 2018-08-07 Kaneka Corporation Conductive-layer-integrated flexible printed circuit board
US10292262B2 (en) 2012-07-18 2019-05-14 Kaneka Corporation Reinforcing-plate-integrated flexible printed circuit board

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