GB1418949A - Electrical component assemblies - Google Patents

Electrical component assemblies

Info

Publication number
GB1418949A
GB1418949A GB5554773A GB5554773A GB1418949A GB 1418949 A GB1418949 A GB 1418949A GB 5554773 A GB5554773 A GB 5554773A GB 5554773 A GB5554773 A GB 5554773A GB 1418949 A GB1418949 A GB 1418949A
Authority
GB
United Kingdom
Prior art keywords
component
resin
potting
components
foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5554773A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of GB1418949A publication Critical patent/GB1418949A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3164—Partial encapsulation or coating the coating being a foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Details Of Resistors (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Installation Of Indoor Wiring (AREA)
  • Cable Accessories (AREA)
  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)

Abstract

1418949 Capacitors; semiconductor devices; resistors; component assemblies SIEMENS AG 30 Nov 1973 [30 Jan 1973] 55547/73 Headings H1K H1M H1R and H1S An electrical component or component assembly 1 having lead wires 2, 3 extending in the same direction is encased by thermoforming a synthetic resin foil to conform to the shape of the component or assembly and to provide a space for receiving hardenable potting resin 5 to complete a moisture-tight envelope. The foil may be polycarbonate, polyethylene, polypropylene or polysulphone, or a laminate wherein one resin is selected for its good bonding to the potting material, the other for its moisture-proofness. The eventual outer surface may be coated with aluminium by vapour deposition. A plurality of components may be encased simultaneously by placing each on a projection on a holding plate, the projection corresponding to the potting space (Fig. 2, not shown). The lead wires pass through holes in the plate, which also has holes for withdrawing air to draw heated resin foil around the components and projections. The plate is removed and components separated and the potting material introduced. The envelope may be formed so as to provide feet 6, 7 for spacing the component when mounted on a printed circuit board.
GB5554773A 1973-01-30 1973-11-30 Electrical component assemblies Expired GB1418949A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2304412A DE2304412A1 (en) 1973-01-30 1973-01-30 MOISTURE-PROOF COVERING FOR ELECTRICAL COMPONENTS OR COMPONENT COMBINATIONS

Publications (1)

Publication Number Publication Date
GB1418949A true GB1418949A (en) 1975-12-24

Family

ID=5870335

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5554773A Expired GB1418949A (en) 1973-01-30 1973-11-30 Electrical component assemblies

Country Status (18)

Country Link
JP (1) JPS49105161A (en)
AT (1) AT327345B (en)
AU (1) AU6352073A (en)
BE (1) BE810374A (en)
BR (1) BR7309911D0 (en)
CH (1) CH562512A5 (en)
CS (1) CS170484B2 (en)
DD (1) DD109475A5 (en)
DE (1) DE2304412A1 (en)
ES (2) ES422705A1 (en)
FR (1) FR2215780B1 (en)
GB (1) GB1418949A (en)
IT (1) IT1006156B (en)
LU (1) LU68391A1 (en)
NL (1) NL7317195A (en)
SE (1) SE385757B (en)
SU (1) SU528892A3 (en)
ZA (1) ZA74310B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002003460A2 (en) * 2000-07-03 2002-01-10 Infineon Technologies Ag Semiconductor chip module with a protective film
US10834827B2 (en) 2017-09-14 2020-11-10 HELLA GmbH & Co. KGaA System for potting components using a cap

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4154344A (en) * 1976-11-09 1979-05-15 Minnesota Mining And Manufacturing Company Material for forming envelopes used to protect electronic components
DE2830472C3 (en) * 1978-07-11 1981-07-16 Siemens AG, 1000 Berlin und 8000 München Process for the serial encasing of electrical components, in particular capacitors
DE3216192A1 (en) * 1982-04-30 1983-11-03 Siemens AG, 1000 Berlin und 8000 München Electrical component which is accommodated in a housing in a centred and adjusted manner
DE3346896C2 (en) * 1983-12-23 1995-05-11 Siemens Ag Device for protecting display elements and the circuits connected to them against interference from electrostatic charges
DE3624852A1 (en) * 1986-01-10 1987-07-16 Orga Druck Gmbh Electronic data and/or programme carriers and production method therefor
EP2293657A1 (en) * 2009-08-24 2011-03-09 Schreiner Group GmbH & Co. KG Electronic component and method of forming an electronic component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002003460A2 (en) * 2000-07-03 2002-01-10 Infineon Technologies Ag Semiconductor chip module with a protective film
WO2002003460A3 (en) * 2000-07-03 2002-07-18 Infineon Technologies Ag Semiconductor chip module with a protective film
US10834827B2 (en) 2017-09-14 2020-11-10 HELLA GmbH & Co. KGaA System for potting components using a cap

Also Published As

Publication number Publication date
DD109475A5 (en) 1974-11-05
BR7309911D0 (en) 1974-10-22
DE2304412A1 (en) 1974-08-01
FR2215780A1 (en) 1974-08-23
JPS49105161A (en) 1974-10-04
BE810374A (en) 1974-05-16
AT327345B (en) 1976-01-26
NL7317195A (en) 1974-08-01
SU528892A3 (en) 1976-09-15
SE385757B (en) 1976-07-19
ZA74310B (en) 1974-11-27
LU68391A1 (en) 1973-11-22
CH562512A5 (en) 1975-05-30
AU6352073A (en) 1975-06-12
ES422705A1 (en) 1976-04-16
FR2215780B1 (en) 1977-09-23
ES422706A1 (en) 1976-04-16
ATA869073A (en) 1975-04-15
IT1006156B (en) 1976-09-30
CS170484B2 (en) 1976-08-27

Similar Documents

Publication Publication Date Title
GB1067195A (en) New or improved heat transferring mounting panel assemblies
AU539067B2 (en) Producing a laminate including a conductive polymer layer
DE59502482D1 (en) Base film for chip card
KR970061017A (en) Anisotropic conductive sheet with conductor layer and wiring board using the same
GB2252878A (en) A housing provided with conductive wires therein.
GB738265A (en) Improvements in or relating to printed or otherwise deposited circuits
EP0303225A3 (en) Epoxy resin film covered with metal foil and flexible printed wiring board
GB1418949A (en) Electrical component assemblies
CA1025072A (en) Electrolytic capacitor package having a grommet with tapered lead holes
DE3069160D1 (en) Process for preparing resin impregnated substrates, resin impregnated substrate and electrical laminate therefrom
IE802648L (en) Electrical component
CA2095562A1 (en) Energy dissipation resistor for implantable defibrillation circuitry
GB1513184A (en) Electronic components
NZ184575A (en) Encapsulated electrical apparatus with a phenolic resin
CA991315A (en) Composite printed circuit board
GB1397615A (en) Method of manufacturing a base for a printed electrical circuit
GB983846A (en) Improvements in printed circuit and method of making the same
JPS57120361A (en) Structure of film substrate
GB1230795A (en)
JPS547441A (en) Adhesive composition
JPS5717193A (en) Printed circuit board assembly for hybrid thick film circuit
EP0224922A3 (en) Invar foil
EP0203680A3 (en) Electrical device including a printed circuit
JPS5292288A (en) Manufacture of copper-clad laminate of unsaturated polyester resin
JPS55103751A (en) Semiconductor device

Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee