ES422706A1 - Electrical component assemblies - Google Patents

Electrical component assemblies

Info

Publication number
ES422706A1
ES422706A1 ES422706A ES422706A ES422706A1 ES 422706 A1 ES422706 A1 ES 422706A1 ES 422706 A ES422706 A ES 422706A ES 422706 A ES422706 A ES 422706A ES 422706 A1 ES422706 A1 ES 422706A1
Authority
ES
Spain
Prior art keywords
components
combinations
electrical components
support frame
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES422706A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of ES422706A1 publication Critical patent/ES422706A1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3164—Partial encapsulation or coating the coating being a foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cable Accessories (AREA)
  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Installation Of Indoor Wiring (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)
  • Details Of Resistors (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

Procedure for the manufacture of a moisture-tight casing for electrical components or combinations thereof, with connecting wires facing in the same direction, composed of a sheet of embedded thermoplastic synthetic material, in one piece, and a resin closure hardenable filler in the area of the connecting wires characterized in that a support frame is equipped with several components or combinations of electrical components to achieve the pre-conformation of the filling space, the components or combinations of electrical components are raised at elevations that they exist in the support frame and serve for the pre-shaping of the filling space, and by which the components or combinations of components are wrapped by means of a sheet of embedded synthetic material. (Machine-translation by Google Translate, not legally binding)
ES422706A 1973-01-30 1974-01-29 Electrical component assemblies Expired ES422706A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2304412A DE2304412A1 (en) 1973-01-30 1973-01-30 MOISTURE-PROOF COVERING FOR ELECTRICAL COMPONENTS OR COMPONENT COMBINATIONS

Publications (1)

Publication Number Publication Date
ES422706A1 true ES422706A1 (en) 1976-04-16

Family

ID=5870335

Family Applications (2)

Application Number Title Priority Date Filing Date
ES422705A Expired ES422705A1 (en) 1973-01-30 1974-01-29 Electrical component assemblies
ES422706A Expired ES422706A1 (en) 1973-01-30 1974-01-29 Electrical component assemblies

Family Applications Before (1)

Application Number Title Priority Date Filing Date
ES422705A Expired ES422705A1 (en) 1973-01-30 1974-01-29 Electrical component assemblies

Country Status (18)

Country Link
JP (1) JPS49105161A (en)
AT (1) AT327345B (en)
AU (1) AU6352073A (en)
BE (1) BE810374A (en)
BR (1) BR7309911D0 (en)
CH (1) CH562512A5 (en)
CS (1) CS170484B2 (en)
DD (1) DD109475A5 (en)
DE (1) DE2304412A1 (en)
ES (2) ES422705A1 (en)
FR (1) FR2215780B1 (en)
GB (1) GB1418949A (en)
IT (1) IT1006156B (en)
LU (1) LU68391A1 (en)
NL (1) NL7317195A (en)
SE (1) SE385757B (en)
SU (1) SU528892A3 (en)
ZA (1) ZA74310B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4154344A (en) * 1976-11-09 1979-05-15 Minnesota Mining And Manufacturing Company Material for forming envelopes used to protect electronic components
DE2830472C3 (en) * 1978-07-11 1981-07-16 Siemens AG, 1000 Berlin und 8000 München Process for the serial encasing of electrical components, in particular capacitors
DE3216192A1 (en) * 1982-04-30 1983-11-03 Siemens AG, 1000 Berlin und 8000 München Electrical component which is accommodated in a housing in a centred and adjusted manner
DE3346896C2 (en) * 1983-12-23 1995-05-11 Siemens Ag Device for protecting display elements and the circuits connected to them against interference from electrostatic charges
DE3624852A1 (en) * 1986-01-10 1987-07-16 Orga Druck Gmbh Electronic data and/or programme carriers and production method therefor
DE20011590U1 (en) * 2000-07-03 2000-09-07 Infineon Technologies AG, 81541 München Semiconductor chip module with protective film
EP2293657A1 (en) * 2009-08-24 2011-03-09 Schreiner Group GmbH & Co. KG Electronic component and method of forming an electronic component
US10834827B2 (en) 2017-09-14 2020-11-10 HELLA GmbH & Co. KGaA System for potting components using a cap

Also Published As

Publication number Publication date
FR2215780B1 (en) 1977-09-23
CS170484B2 (en) 1976-08-27
SE385757B (en) 1976-07-19
DD109475A5 (en) 1974-11-05
ES422705A1 (en) 1976-04-16
BE810374A (en) 1974-05-16
CH562512A5 (en) 1975-05-30
JPS49105161A (en) 1974-10-04
BR7309911D0 (en) 1974-10-22
LU68391A1 (en) 1973-11-22
ZA74310B (en) 1974-11-27
AU6352073A (en) 1975-06-12
GB1418949A (en) 1975-12-24
AT327345B (en) 1976-01-26
IT1006156B (en) 1976-09-30
FR2215780A1 (en) 1974-08-23
SU528892A3 (en) 1976-09-15
ATA869073A (en) 1975-04-15
DE2304412A1 (en) 1974-08-01
NL7317195A (en) 1974-08-01

Similar Documents

Publication Publication Date Title
AU444985B2 (en) Process for preparing molded structure from polyphenylene sulfide resin and filler
JPS5679148A (en) Waterrreducing resin composition
NL7512225A (en) THERMOPLASTIC RESIN COMPOSITIONS.
AR205399A1 (en) AN IMPROVED THERMOPLASTIC POLYESTER MOLDABLE RESIN
SE412918B (en) PROCEDURE FOR PREPARING A THERMOPLASTIC COMPOSITION BASED ON THE BITUM AND AN ELAST
NL7500997A (en) RESIN MATERIAL.
ZA748230B (en) Closure mechanism for an injection molding machine or extrusion press
ES422706A1 (en) Electrical component assemblies
FR2283931A1 (en) MOLDING THERMOSETTING POLYESTER RESIN COMPOSITION
BE832160A (en) ADVANCED THERMOPLASTIC MOLDING RESINS
FR2290294A1 (en) IMPROVEMENTS IN INJECTION MOLDING MACHINES
CA922839A (en) Fast curing organosiloxane resins
ZA75678B (en) Epoxy resin composition
IL43345A0 (en) Thermosetting composition,a cured resin obtained therefrom and a fibrous material impregnated with said composition
GB1396213A (en) Silicone resin moulding compositions
NZ179219A (en) Homogeising mouliding material with filler in injection moulding machine
GB1502453A (en) Synthetic resin composition
GB1505403A (en) Thermoplastic resin composition
JPS5262362A (en) Thermoplastic resin composition
IE41695L (en) Glass-fibre reinforced vinyl resin composition
CS181756B2 (en) Composition for thermoplastic moulding
IT1052486B (en) PROCEDURE FOR PRODUCING POLYEGMENTED COPOLYMERS WITH THERMOPLASTIC PROPERTIES
JPS5278966A (en) Device for producing synthetic resin foil
JPS5222056A (en) Thermoplastic resin extruder
CA1020689A (en) Thermoplastic resin composition