CS170484B2 - - Google Patents

Info

Publication number
CS170484B2
CS170484B2 CS632A CS63274A CS170484B2 CS 170484 B2 CS170484 B2 CS 170484B2 CS 632 A CS632 A CS 632A CS 63274 A CS63274 A CS 63274A CS 170484 B2 CS170484 B2 CS 170484B2
Authority
CS
Czechoslovakia
Application number
CS632A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of CS170484B2 publication Critical patent/CS170484B2/cs

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components
    • H10W74/01
    • H10W74/144
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954Other details of electrical connections
    • H05K2201/10977Encapsulated connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1311Foil encapsulation, e.g. of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1316Moulded encapsulation of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1322Encapsulation comprising more than one layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cable Accessories (AREA)
  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Installation Of Indoor Wiring (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)
CS632A 1973-01-30 1974-01-30 CS170484B2 (cs)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2304412A DE2304412A1 (de) 1973-01-30 1973-01-30 Feuchtedichte umhuellung fuer elektrische bauelemente oder bauelementekombinationen

Publications (1)

Publication Number Publication Date
CS170484B2 true CS170484B2 (cs) 1976-08-27

Family

ID=5870335

Family Applications (1)

Application Number Title Priority Date Filing Date
CS632A CS170484B2 (cs) 1973-01-30 1974-01-30

Country Status (18)

Country Link
JP (1) JPS49105161A (cs)
AT (1) AT327345B (cs)
AU (1) AU6352073A (cs)
BE (1) BE810374A (cs)
BR (1) BR7309911D0 (cs)
CH (1) CH562512A5 (cs)
CS (1) CS170484B2 (cs)
DD (1) DD109475A5 (cs)
DE (1) DE2304412A1 (cs)
ES (2) ES422706A1 (cs)
FR (1) FR2215780B1 (cs)
GB (1) GB1418949A (cs)
IT (1) IT1006156B (cs)
LU (1) LU68391A1 (cs)
NL (1) NL7317195A (cs)
SE (1) SE385757B (cs)
SU (1) SU528892A3 (cs)
ZA (1) ZA74310B (cs)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4154344A (en) * 1976-11-09 1979-05-15 Minnesota Mining And Manufacturing Company Material for forming envelopes used to protect electronic components
DE2830472C3 (de) * 1978-07-11 1981-07-16 Siemens AG, 1000 Berlin und 8000 München Verfahren zum serienmäßigen Umhüllen elektrischer Bauelemente, insbesondere Kondensatoren
DE3216192A1 (de) * 1982-04-30 1983-11-03 Siemens AG, 1000 Berlin und 8000 München Elektrisches bauelement, das zentriert und justiert in einem gehaeuse untergebracht ist
DE3346896C2 (de) * 1983-12-23 1995-05-11 Siemens Ag Vorrichtung zum Schutz von Anzeigeelementen und mit diesen verbundenen Schaltungen vor Störungen durch elektrostatische Ladungen
DE3624852A1 (de) * 1986-01-10 1987-07-16 Orga Druck Gmbh Elektronische daten- und/oder programmtraeger und verfahren zu seiner herstellung
DE20011590U1 (de) * 2000-07-03 2000-09-07 Infineon Technologies AG, 81541 München Halbleiterchip-Modul mit Schutzfolie
EP2293657A1 (en) * 2009-08-24 2011-03-09 Schreiner Group GmbH & Co. KG Electronic component and method of forming an electronic component
US10834827B2 (en) 2017-09-14 2020-11-10 HELLA GmbH & Co. KGaA System for potting components using a cap

Also Published As

Publication number Publication date
DE2304412A1 (de) 1974-08-01
BE810374A (fr) 1974-05-16
SE385757B (sv) 1976-07-19
DD109475A5 (cs) 1974-11-05
SU528892A3 (ru) 1976-09-15
FR2215780A1 (cs) 1974-08-23
AT327345B (de) 1976-01-26
IT1006156B (it) 1976-09-30
NL7317195A (cs) 1974-08-01
GB1418949A (en) 1975-12-24
ES422705A1 (es) 1976-04-16
JPS49105161A (cs) 1974-10-04
CH562512A5 (cs) 1975-05-30
BR7309911D0 (pt) 1974-10-22
ZA74310B (en) 1974-11-27
LU68391A1 (cs) 1973-11-22
FR2215780B1 (cs) 1977-09-23
ATA869073A (de) 1975-04-15
AU6352073A (en) 1975-06-12
ES422706A1 (es) 1976-04-16

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