ES422705A1 - Perfeccionamientos en envueltas estancas a la humedad para componentes electricos. - Google Patents
Perfeccionamientos en envueltas estancas a la humedad para componentes electricos.Info
- Publication number
- ES422705A1 ES422705A1 ES422705A ES422705A ES422705A1 ES 422705 A1 ES422705 A1 ES 422705A1 ES 422705 A ES422705 A ES 422705A ES 422705 A ES422705 A ES 422705A ES 422705 A1 ES422705 A1 ES 422705A1
- Authority
- ES
- Spain
- Prior art keywords
- electrical component
- component assemblies
- connection
- preformed
- translation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000000712 assembly Effects 0.000 title 1
- 238000000429 assembly Methods 0.000 title 1
- 239000002985 plastic film Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 229920002994 synthetic fiber Polymers 0.000 abstract 1
- 229920001169 thermoplastic Polymers 0.000 abstract 1
- 239000004416 thermosoftening plastic Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3164—Partial encapsulation or coating the coating being a foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1311—Foil encapsulation, e.g. of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1322—Encapsulation comprising more than one layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Details Of Resistors (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Casings For Electric Apparatus (AREA)
- Installation Of Indoor Wiring (AREA)
- Cable Accessories (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2304412A DE2304412A1 (de) | 1973-01-30 | 1973-01-30 | Feuchtedichte umhuellung fuer elektrische bauelemente oder bauelementekombinationen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES422705A1 true ES422705A1 (es) | 1976-04-16 |
Family
ID=5870335
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES422705A Expired ES422705A1 (es) | 1973-01-30 | 1974-01-29 | Perfeccionamientos en envueltas estancas a la humedad para componentes electricos. |
| ES422706A Expired ES422706A1 (es) | 1973-01-30 | 1974-01-29 | Procedimiento para la fabricacion de una envuelta estanca ala humedad para componentes electricos. |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES422706A Expired ES422706A1 (es) | 1973-01-30 | 1974-01-29 | Procedimiento para la fabricacion de una envuelta estanca ala humedad para componentes electricos. |
Country Status (18)
| Country | Link |
|---|---|
| JP (1) | JPS49105161A (es) |
| AT (1) | AT327345B (es) |
| AU (1) | AU6352073A (es) |
| BE (1) | BE810374A (es) |
| BR (1) | BR7309911D0 (es) |
| CH (1) | CH562512A5 (es) |
| CS (1) | CS170484B2 (es) |
| DD (1) | DD109475A5 (es) |
| DE (1) | DE2304412A1 (es) |
| ES (2) | ES422705A1 (es) |
| FR (1) | FR2215780B1 (es) |
| GB (1) | GB1418949A (es) |
| IT (1) | IT1006156B (es) |
| LU (1) | LU68391A1 (es) |
| NL (1) | NL7317195A (es) |
| SE (1) | SE385757B (es) |
| SU (1) | SU528892A3 (es) |
| ZA (1) | ZA74310B (es) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4154344A (en) * | 1976-11-09 | 1979-05-15 | Minnesota Mining And Manufacturing Company | Material for forming envelopes used to protect electronic components |
| DE2830472C3 (de) * | 1978-07-11 | 1981-07-16 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum serienmäßigen Umhüllen elektrischer Bauelemente, insbesondere Kondensatoren |
| DE3216192A1 (de) * | 1982-04-30 | 1983-11-03 | Siemens AG, 1000 Berlin und 8000 München | Elektrisches bauelement, das zentriert und justiert in einem gehaeuse untergebracht ist |
| DE3346896C2 (de) * | 1983-12-23 | 1995-05-11 | Siemens Ag | Vorrichtung zum Schutz von Anzeigeelementen und mit diesen verbundenen Schaltungen vor Störungen durch elektrostatische Ladungen |
| DE3624852A1 (de) * | 1986-01-10 | 1987-07-16 | Orga Druck Gmbh | Elektronische daten- und/oder programmtraeger und verfahren zu seiner herstellung |
| DE20011590U1 (de) * | 2000-07-03 | 2000-09-07 | Infineon Technologies AG, 81541 München | Halbleiterchip-Modul mit Schutzfolie |
| EP2293657A1 (en) * | 2009-08-24 | 2011-03-09 | Schreiner Group GmbH & Co. KG | Electronic component and method of forming an electronic component |
| US10834827B2 (en) | 2017-09-14 | 2020-11-10 | HELLA GmbH & Co. KGaA | System for potting components using a cap |
-
1973
- 1973-01-30 DE DE2304412A patent/DE2304412A1/de active Pending
- 1973-09-10 LU LU68391A patent/LU68391A1/xx unknown
- 1973-10-11 AT AT869073A patent/AT327345B/de not_active IP Right Cessation
- 1973-11-30 GB GB5554773A patent/GB1418949A/en not_active Expired
- 1973-12-12 AU AU63520/73A patent/AU6352073A/en not_active Expired
- 1973-12-14 NL NL7317195A patent/NL7317195A/xx unknown
- 1973-12-18 BR BR9911/73A patent/BR7309911D0/pt unknown
-
1974
- 1974-01-03 SE SE7400046A patent/SE385757B/xx unknown
- 1974-01-16 ZA ZA740310A patent/ZA74310B/xx unknown
- 1974-01-22 CH CH85774A patent/CH562512A5/xx not_active IP Right Cessation
- 1974-01-25 IT IT19802/74A patent/IT1006156B/it active
- 1974-01-25 DD DD176196A patent/DD109475A5/xx unknown
- 1974-01-29 ES ES422705A patent/ES422705A1/es not_active Expired
- 1974-01-29 FR FR7402874A patent/FR2215780B1/fr not_active Expired
- 1974-01-29 SU SU1997125A patent/SU528892A3/ru active
- 1974-01-29 ES ES422706A patent/ES422706A1/es not_active Expired
- 1974-01-30 CS CS632A patent/CS170484B2/cs unknown
- 1974-01-30 BE BE140354A patent/BE810374A/xx unknown
- 1974-01-30 JP JP49011926A patent/JPS49105161A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DD109475A5 (es) | 1974-11-05 |
| BR7309911D0 (pt) | 1974-10-22 |
| DE2304412A1 (de) | 1974-08-01 |
| GB1418949A (en) | 1975-12-24 |
| FR2215780A1 (es) | 1974-08-23 |
| JPS49105161A (es) | 1974-10-04 |
| BE810374A (fr) | 1974-05-16 |
| AT327345B (de) | 1976-01-26 |
| NL7317195A (es) | 1974-08-01 |
| SU528892A3 (ru) | 1976-09-15 |
| SE385757B (sv) | 1976-07-19 |
| ZA74310B (en) | 1974-11-27 |
| LU68391A1 (es) | 1973-11-22 |
| CH562512A5 (es) | 1975-05-30 |
| AU6352073A (en) | 1975-06-12 |
| FR2215780B1 (es) | 1977-09-23 |
| ES422706A1 (es) | 1976-04-16 |
| ATA869073A (de) | 1975-04-15 |
| IT1006156B (it) | 1976-09-30 |
| CS170484B2 (es) | 1976-08-27 |
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