ES422705A1 - Perfeccionamientos en envueltas estancas a la humedad para componentes electricos. - Google Patents

Perfeccionamientos en envueltas estancas a la humedad para componentes electricos.

Info

Publication number
ES422705A1
ES422705A1 ES422705A ES422705A ES422705A1 ES 422705 A1 ES422705 A1 ES 422705A1 ES 422705 A ES422705 A ES 422705A ES 422705 A ES422705 A ES 422705A ES 422705 A1 ES422705 A1 ES 422705A1
Authority
ES
Spain
Prior art keywords
moisture
electrical components
tight enclosures
tight
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES422705A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of ES422705A1 publication Critical patent/ES422705A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/144—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations comprising foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Installation Of Indoor Wiring (AREA)
  • Cable Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Details Of Resistors (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)
ES422705A 1973-01-30 1974-01-29 Perfeccionamientos en envueltas estancas a la humedad para componentes electricos. Expired ES422705A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2304412A DE2304412A1 (de) 1973-01-30 1973-01-30 Feuchtedichte umhuellung fuer elektrische bauelemente oder bauelementekombinationen

Publications (1)

Publication Number Publication Date
ES422705A1 true ES422705A1 (es) 1976-04-16

Family

ID=5870335

Family Applications (2)

Application Number Title Priority Date Filing Date
ES422706A Expired ES422706A1 (es) 1973-01-30 1974-01-29 Procedimiento para la fabricacion de una envuelta estanca ala humedad para componentes electricos.
ES422705A Expired ES422705A1 (es) 1973-01-30 1974-01-29 Perfeccionamientos en envueltas estancas a la humedad para componentes electricos.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
ES422706A Expired ES422706A1 (es) 1973-01-30 1974-01-29 Procedimiento para la fabricacion de una envuelta estanca ala humedad para componentes electricos.

Country Status (18)

Country Link
JP (1) JPS49105161A (es)
AT (1) AT327345B (es)
AU (1) AU6352073A (es)
BE (1) BE810374A (es)
BR (1) BR7309911D0 (es)
CH (1) CH562512A5 (es)
CS (1) CS170484B2 (es)
DD (1) DD109475A5 (es)
DE (1) DE2304412A1 (es)
ES (2) ES422706A1 (es)
FR (1) FR2215780B1 (es)
GB (1) GB1418949A (es)
IT (1) IT1006156B (es)
LU (1) LU68391A1 (es)
NL (1) NL7317195A (es)
SE (1) SE385757B (es)
SU (1) SU528892A3 (es)
ZA (1) ZA74310B (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4154344A (en) * 1976-11-09 1979-05-15 Minnesota Mining And Manufacturing Company Material for forming envelopes used to protect electronic components
DE2830472C3 (de) * 1978-07-11 1981-07-16 Siemens AG, 1000 Berlin und 8000 München Verfahren zum serienmäßigen Umhüllen elektrischer Bauelemente, insbesondere Kondensatoren
DE3216192A1 (de) * 1982-04-30 1983-11-03 Siemens AG, 1000 Berlin und 8000 München Elektrisches bauelement, das zentriert und justiert in einem gehaeuse untergebracht ist
DE3346896C2 (de) * 1983-12-23 1995-05-11 Siemens Ag Vorrichtung zum Schutz von Anzeigeelementen und mit diesen verbundenen Schaltungen vor Störungen durch elektrostatische Ladungen
DE3624852A1 (de) * 1986-01-10 1987-07-16 Orga Druck Gmbh Elektronische daten- und/oder programmtraeger und verfahren zu seiner herstellung
DE20011590U1 (de) * 2000-07-03 2000-09-07 Infineon Technologies AG, 81541 München Halbleiterchip-Modul mit Schutzfolie
EP2293657A1 (en) * 2009-08-24 2011-03-09 Schreiner Group GmbH & Co. KG Electronic component and method of forming an electronic component
US10834827B2 (en) 2017-09-14 2020-11-10 HELLA GmbH & Co. KGaA System for potting components using a cap

Also Published As

Publication number Publication date
IT1006156B (it) 1976-09-30
DE2304412A1 (de) 1974-08-01
SE385757B (sv) 1976-07-19
FR2215780A1 (es) 1974-08-23
CS170484B2 (es) 1976-08-27
LU68391A1 (es) 1973-11-22
ATA869073A (de) 1975-04-15
ZA74310B (en) 1974-11-27
JPS49105161A (es) 1974-10-04
BE810374A (fr) 1974-05-16
FR2215780B1 (es) 1977-09-23
BR7309911D0 (pt) 1974-10-22
ES422706A1 (es) 1976-04-16
AU6352073A (en) 1975-06-12
GB1418949A (en) 1975-12-24
CH562512A5 (es) 1975-05-30
NL7317195A (es) 1974-08-01
AT327345B (de) 1976-01-26
DD109475A5 (es) 1974-11-05
SU528892A3 (ru) 1976-09-15

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