DE2304412A1 - MOISTURE-PROOF COVERING FOR ELECTRICAL COMPONENTS OR COMPONENT COMBINATIONS - Google Patents
MOISTURE-PROOF COVERING FOR ELECTRICAL COMPONENTS OR COMPONENT COMBINATIONSInfo
- Publication number
- DE2304412A1 DE2304412A1 DE2304412A DE2304412A DE2304412A1 DE 2304412 A1 DE2304412 A1 DE 2304412A1 DE 2304412 A DE2304412 A DE 2304412A DE 2304412 A DE2304412 A DE 2304412A DE 2304412 A1 DE2304412 A1 DE 2304412A1
- Authority
- DE
- Germany
- Prior art keywords
- components
- component combinations
- moisture
- plastic film
- potting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004382 potting Methods 0.000 claims description 23
- 239000002985 plastic film Substances 0.000 claims description 18
- 229920006255 plastic film Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 8
- 238000005266 casting Methods 0.000 claims description 5
- 229920001169 thermoplastic Polymers 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 125000006850 spacer group Chemical group 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims 1
- -1 polyethylene Polymers 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3164—Partial encapsulation or coating the coating being a foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1311—Foil encapsulation, e.g. of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1322—Encapsulation comprising more than one layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Details Of Resistors (AREA)
- Casings For Electric Apparatus (AREA)
- Installation Of Indoor Wiring (AREA)
- Cable Accessories (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
Feuchtedichte Umhüllung für elektrische Bauelemente oder Bauelementekombinationen Moisture-proof casing for electrical components or component combinations
Die Erfindung betrifft eine feuchtedichte Umhüllung für elektrische Bauelemente oder Bauelementekombinationen mit Anschlußdrähten, die in die gleiche Richtung weisen, bestehend aus einer einstückigen, tiefgezogenen, thermoplastischen Kunststoffolie und einem Abschluß aus einem härtbaren Vergußharz im Bereich der Anschlußdrähte.The invention relates to a moisture-proof casing for electrical Components or component combinations with lead wires pointing in the same direction, consisting made of a one-piece, deep-drawn, thermoplastic plastic film and a closure made of a curable potting resin in the area of the connecting wires.
Elektrische Bauelemente im Sinne der Erfindung sind aktive und passive Bauelemente wie zum Beispiel Transistoren, Kondensatoren, Widerstände, Induktivitäten, Thermistoren sowie Kombinationen dieser elektrischen Bauelemente.Electrical components within the meaning of the invention are active and passive components such as transistors, capacitors, Resistors, inductors, thermistors and combinations of these electrical components.
Aus der DT-OS 1 764 266 ist ein Verfahren zum Umhüllen eines Metallgehäuses für ein elektrisches Bauelement bekannt, wobei das Metallgehäuse mit einer tiefgezogenen Kunststoffolie umgeben wird. Bei diesem bekannten Verfahren ist das Bauelement bereits fest in ein Gehäuse eingebaut.From DT-OS 1 764 266 a method for wrapping a Known metal housing for an electrical component, the metal housing being surrounded by a deep-drawn plastic film will. In this known method, the component is already permanently installed in a housing.
Aufgabe der vorliegenden Erfindung ist es, eine feuchtedichte Umhüllung für elektrische Bauelemente oder Bauelementekombinationen anzugeben, welche unabhängig von der Form der zu umhüllenden Teile ist und eine billige Herstellungsweise gestattet.The object of the present invention is to provide a moisture-proof covering for electrical components or component combinations which is independent of the shape of the to be enveloped Parts is permitted and inexpensive to manufacture.
Diese Aufgabe wird bei einer feuchtedichten Umhüllung der eingangs angegebenen Art erfindungsgemäß dadurch gelöst, daß der Vergußraum durch die Kunststoffolie vorgeformt ist.This task is performed in the case of a moisture-proof enclosure of the initially specified type solved according to the invention in that the potting space is preformed by the plastic film.
VPA 9/U0/3Ö04 Sac/DxVPA 9 / U0 / 3Ö04 Sac / Dx
409831/1046409831/1046
Damit wird der Vorteil erzielt, daß Bauelemente oder BauelementekomMnationen beliebiger Größe umhüllt werden können, ohne daß man Schwankungen in den Abmessungen, die durch verschiedene Toleranzen entstehen können, zu beachten braucht und daß der Vergußraum unabhängig von diesen Toleranzschwankungen immer die gleiche Größe aufweist. Dadurch gestaltet sich das Vergießen des Abschlusses wesentlich einfacher, da die Menge des benötigten Vergußharzes bei jeder Umhüllung gleich ist. Weiterhin gestattet der stets gleichgeformte Vergußraum die Verwendung der geringstmöglichen Vergußmenge, so daß dadurch eine beträchtliche Kostenersparnis ermöglicht wird.This has the advantage that components or component communications Any size can be enveloped without fluctuations in the dimensions caused by different Tolerances can arise, must be taken into account and that the casting space always independent of these tolerance fluctuations is the same size. This makes potting the closure much easier, since the amount of the required Potting resin is the same for each envelope. Furthermore, the potting space, which is always shaped in the same way, allows it to be used the smallest possible amount of potting, so that considerable cost savings are made possible.
Tiefziehfähige, thermoplastische Kunststoffolien sind zum Beispiel Folien aus Polycarbonat, Polyäthylen, Polypropylen beziehungsweise Polysulfon.Thermoformable, thermoplastic plastic films are for example Films made of polycarbonate, polyethylene, polypropylene or polysulfone.
Gemäß einer Weiterbildung der Erfindung sind am Vergußraum Abstandsfüße vorhanden.According to a further development of the invention, spacer feet are located on the casting space available.
Durch diese Maßnahme wird erreicht, daß zum Beispiel bei zweiseitigen Leiterbahnen von gedruckten Schaltungen das flüssige Lot gut zur anderen Seite gelangen kann.This measure ensures that, for example, with two-sided Conductor tracks of printed circuits, the liquid solder can easily get to the other side.
Für erhöhte Anforderungen ist die Kunststoffolie der feuchtedichten Umhüllung als Verbundfolie ausgebildet, zum Beispiel Polycarbonat/Polypropylen oder mit Aluminium bedampfte Kunststoffolie. Durch diese Ausbildung wird dem Umstand Rechnung getragen, daß oft Kunststoffolien, welche geringe Feuchtedurchlässigkeit aufweisen, mit· einem Vergußharz nur eine ungenügende Verbindung eingehen. Die Verbundfolie kann so ausgebildet sein, daß außen eine feuchtesichere Folie und innen eine Folie vorhanden ist, an der das Vergußharz gut haftet.For increased requirements, the plastic film is the moisture-proof one Sheath designed as a composite film, for example polycarbonate / polypropylene or plastic film vapor-coated with aluminum. This training takes into account the fact that often plastic films, which have low moisture permeability have only an inadequate connection with a potting resin. The composite film can be designed in this way Be that there is a moisture-proof film on the outside and a film on the inside to which the potting resin adheres well.
VPA 9/H0/3004 - 3 -VPA 9 / H0 / 3004 - 3 -
409831 / 1046409831/1046
Bei Verwendung einer klaren, farblosen Kunststoffolie kann die Stempelung schon auf dem Bauelement beziehungsweise auf der BauelementekomMnation angebracht sein. Die Kennzeichnung ist auf diese Weise besonders sicher angebracht, da sie wischfest ist.When using a clear, colorless plastic film, the stamping can already be on the component or on the Component communication be attached. The marking is particularly securely attached in this way because it is smudge-proof is.
Bei einem Verfahren zur Herstellung einer feuchtedichten Umhüllung für elektrische Bauelemente oder Bauelementekombinationen wird ein Halterahmen mit mehreren elektrischen Bauelementen oder Bauelementekombinationen bestückt, wobei die Bauelemente beziehungsweise Bauelementelcombinationen auf Erhebungen gesteckt werden, welche auf dem Halterahmen vorhanden sind und die zur Vorformung des Vergußraums dienen, und anschließend werden die Bauelemente beziehungsweise Bauelementekombinationen in bekannter Weise mittels einer tiefgezogenen Kunststoffolie umhüllt. Nach Erkalten der tiefgezogenen Folie wird diese mitsamt den umzogenen Bauelementen oder Bauelementekombinationen von dem Halterahmen entfernt und anschließend die Vergußräume mit einem härtbaren Vergußharz ausgegossen. Nach dem Aushärten des Vergußharzes werden die umhüllten Bauelemente oder Bauelementekombinationen einzeln ausgestanzt oder ausgeschnitten. In a method for the production of a moisture-tight casing A holding frame with several electrical components is used for electrical components or component combinations or component combinations, the components or component combinations on elevations are inserted, which are present on the holding frame and which are used to preform the potting space, and then the components or component combinations are made in a known manner by means of a deep-drawn plastic film enveloped. After the deep-drawn film has cooled down, it is used together with the covered components or component combinations removed from the holding frame and then poured the potting spaces with a curable potting resin. To After the potting resin has cured, the encased components or component combinations are individually punched out or cut out.
Durch das Verfahren wird eine automatische Zentrierung der Bauelemente oder Bauelementekombinationen wie auch der Anschlußdrähte zu den Außenkonturen ganz unabhängig von Toleranzen in den Außenabmessungen der zu umhüllenden Bauelemente beziehungsweise Bauelementekombinationen gewährleistet. Außerdem sind spezielle Vergußhorden nicht mehr nötig, da das Vergießen in der Palette erfolgen kann, welche aus der Kunststoffolie mit den darin befindlichen umzogenen Bauelementen beziehungsweise Bauelementekombinationen gebildet wird. Zweckmäßigerweise werden 300 bis 400 Bauelemente beziehungsweise Bauelementekombinationen auf einen Halterahmen aufgesteckt und später auch gemeinsam vergossen.The method automatically centering the components or component combinations as well as the connecting wires to the outer contours completely independent of tolerances in the outer dimensions of the components to be encased, respectively Component combinations guaranteed. In addition, special potting trays are no longer necessary since potting can be done in the pallet, which consists of the plastic film with the covered components located therein, respectively Component combinations is formed. It is expedient to use 300 to 400 components or component combinations attached to a holding frame and later also potted together.
VPA 9/140/3004 - 4 -VPA 9/140/3004 - 4 -
409831 / 1 046409831/1 046
Die Erfindung wird an Hand der Zeichnung näher erläutert. Es zeigen:The invention is explained in more detail with reference to the drawing. Show it:
Pig. 1 einen Schnitt durch ein fertig umhülltes elektrisches Bauelement,Pig. 1 shows a section through a completely encased electrical component,
Pig. 2 einen Schnitt durch den Halterahmen mit darauf befindlichen elektrischen Bauelementen.Pig. 2 shows a section through the holding frame with the frame thereon electrical components.
Pig. 1 zeigt ein fertig umhülltes elektrisches Bauelement 1 mit Anschlußdrähten 2, 3. Die Umhüllung besteht aus einer tiefgezogenen, thermoplastischen Kunststoffolie 4 und einem härtbaren Vergußharz 5 im Bereich der Anschlußdrähte 2, 3. An der Umhüllung sind ferner Abstandsfüße 6, 7 vorhanden.Pig. 1 shows a completely covered electrical component 1 with connecting wires 2, 3. The covering consists of a deep-drawn, thermoplastic plastic film 4 and a curable potting resin 5 in the area of the connecting wires 2, 3. At the Enclosure, spacer feet 6, 7 are also present.
In Pig. 2 ist ein Längsschnitt durch die Halteplatte 8 mit darauf befindlichen Bauelementen 1 dargestellt. Auf der Halteplatte 8 sind Erhebungen 9 vorhanden, die der Vorformung des Vergußraums für das Vergußharz 5 dienen. Das Bauelement 1 wird auf diese Erhebungen 9 gesteckt, wobei die Anschlußdrähte 2, durch dafür in der Halterung vorgesehene Löcher 10 geführt werden. Der Tiefziehvorgang der Kunststoffolie 4 erfolgt in bekannter Weise dadurch, daß die Polie erwärmt wird und die Luft durch dafür in der Halterung vorgesehene Löcher 11 in Richtung der Pfeile nach unten abgesaugt wird. Dadurch legt sich die Kunststoffolie 4 eng und ohne Zwischenraum an die zu umhüllenden elektrischen Bauelemente 1 an. Nach Abkühlen der Kunststoffolie 4 wird die Halterung 8 entfernt. Sodann können die durch die Erhebung 9 vorgebildeten Vergußräume ausgegossen werden und die umhüllten Bauelemente einzeln ausgestanzt beziehungsweise ausgeschnitten werden.In Pig. 2 shows a longitudinal section through the holding plate 8 with components 1 located thereon. On the holding plate 8 there are elevations 9 which serve to preform the potting space for the potting resin 5. The component 1 is plugged onto these elevations 9, the connecting wires 2 being guided through holes 10 provided for this purpose in the holder will. The deep-drawing process of the plastic film 4 takes place in a known manner in that the polie is heated and the Air through holes 11 in Suction downwards in the direction of the arrows. As a result, the plastic film 4 fits tightly and without a gap to the enveloping electrical components 1. After the plastic film 4 has cooled, the holder 8 is removed. Then you can the casting spaces pre-formed by the elevation 9 are poured out and the encased components are individually punched out or be cut out.
VPA 9/H0/3004 - 5 _VPA 9 / H0 / 3004 - 5 _
409831 / 1046409831/1046
An die Stelle der in der Zeichnung dargestellten Bauelemente 1 können auch Bauelementekombinationen treten.Component combinations can also take the place of the components 1 shown in the drawing.
7 Patentansprüche
2 Figuren7 claims
2 figures
VPA 9/HO/3OO4 . - 6 -VPA 9 / HO / 3OO4. - 6 -
40983 1 / 1 04640983 1/1 046
Claims (7)
Priority Applications (20)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2304412A DE2304412A1 (en) | 1973-01-30 | 1973-01-30 | MOISTURE-PROOF COVERING FOR ELECTRICAL COMPONENTS OR COMPONENT COMBINATIONS |
LU68391A LU68391A1 (en) | 1973-01-30 | 1973-09-10 | |
AT869073A AT327345B (en) | 1973-01-30 | 1973-10-11 | PROCESS FOR PRODUCING A MOISTURE-PROOF COATING FOR ELECTRICAL COMPONENTS OR COMPONENT ELEMENTS COMBINATIONS |
GB5554773A GB1418949A (en) | 1973-01-30 | 1973-11-30 | Electrical component assemblies |
AU63520/73A AU6352073A (en) | 1973-01-30 | 1973-12-12 | Electrical component assemblies |
NL7317195A NL7317195A (en) | 1973-01-30 | 1973-12-14 | |
BR9911/73A BR7309911D0 (en) | 1973-01-30 | 1973-12-18 | UNIT PROOF WRAPPING FOR ELECTRIC CONSTRUCTION ELEMENTS OR COMBINATIONS OF THE SAME AND PROCESS FOR ITS MANUFACTURING |
SE7400046A SE385757B (en) | 1973-01-30 | 1974-01-03 | MOISTURE-SEAL COVER FOR ELECTRICAL COMPONENTS AND PROCEDURES FOR THE PRODUCTION OF A SUITABLE MOISTURE-SEAL COVER |
ZA740310A ZA74310B (en) | 1973-01-30 | 1974-01-16 | Improvements in or relating to electrical component assemblies |
CH85774A CH562512A5 (en) | 1973-01-30 | 1974-01-22 | |
IT19802/74A IT1006156B (en) | 1973-01-30 | 1974-01-25 | MOISTURE-TIGHT ENCLOSURE FOR ELECTRICAL COMPONENTS OR COMBINATIONS OF ELECTRICAL COMPONENTS |
DD176196A DD109475A5 (en) | 1973-01-30 | 1974-01-25 | |
FR7402874A FR2215780B1 (en) | 1973-01-30 | 1974-01-29 | |
ES422705A ES422705A1 (en) | 1973-01-30 | 1974-01-29 | Electrical component assemblies |
SU1997125A SU528892A3 (en) | 1973-01-30 | 1974-01-29 | Method of sealing electrical parts with unidirectional leads |
ES422706A ES422706A1 (en) | 1973-01-30 | 1974-01-29 | Electrical component assemblies |
BE140354A BE810374A (en) | 1973-01-30 | 1974-01-30 | HUMIDITY-TIGHT ENCLOSURE FOR COMPONENTS OR COMBINATIONS OF ELECTRICAL COMPONENTS |
JP49011926A JPS49105161A (en) | 1973-01-30 | 1974-01-30 | |
CS632A CS170484B2 (en) | 1973-01-30 | 1974-01-30 | |
DE19752535173 DE2535173A1 (en) | 1973-01-30 | 1975-08-06 | Moisture-proof encapsulations for module combinations - has elements mounted on common support frame in vacuum chamber with suction plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2304412A DE2304412A1 (en) | 1973-01-30 | 1973-01-30 | MOISTURE-PROOF COVERING FOR ELECTRICAL COMPONENTS OR COMPONENT COMBINATIONS |
Publications (1)
Publication Number | Publication Date |
---|---|
DE2304412A1 true DE2304412A1 (en) | 1974-08-01 |
Family
ID=5870335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2304412A Pending DE2304412A1 (en) | 1973-01-30 | 1973-01-30 | MOISTURE-PROOF COVERING FOR ELECTRICAL COMPONENTS OR COMPONENT COMBINATIONS |
Country Status (18)
Country | Link |
---|---|
JP (1) | JPS49105161A (en) |
AT (1) | AT327345B (en) |
AU (1) | AU6352073A (en) |
BE (1) | BE810374A (en) |
BR (1) | BR7309911D0 (en) |
CH (1) | CH562512A5 (en) |
CS (1) | CS170484B2 (en) |
DD (1) | DD109475A5 (en) |
DE (1) | DE2304412A1 (en) |
ES (2) | ES422705A1 (en) |
FR (1) | FR2215780B1 (en) |
GB (1) | GB1418949A (en) |
IT (1) | IT1006156B (en) |
LU (1) | LU68391A1 (en) |
NL (1) | NL7317195A (en) |
SE (1) | SE385757B (en) |
SU (1) | SU528892A3 (en) |
ZA (1) | ZA74310B (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2750357A1 (en) * | 1976-11-09 | 1978-05-11 | Minnesota Mining & Mfg | MATERIAL FOR THE MANUFACTURING OF PROTECTIVE COVERINGS FOR ELECTRONIC COMPONENTS |
DE2830472A1 (en) * | 1978-07-11 | 1980-01-24 | Siemens Ag | METHOD FOR SERIAL COVERED ELECTRICAL COMPONENTS, IN PARTICULAR CAPACITORS |
DE3216192A1 (en) * | 1982-04-30 | 1983-11-03 | Siemens AG, 1000 Berlin und 8000 München | Electrical component which is accommodated in a housing in a centred and adjusted manner |
DE3346896A1 (en) * | 1983-12-23 | 1985-07-11 | Siemens AG, 1000 Berlin und 8000 München | Device for the protection of display elements, and circuits connected thereto to protect against disturbances (defects, faults) caused by electrostatic discharges |
DE3624852A1 (en) * | 1986-01-10 | 1987-07-16 | Orga Druck Gmbh | Electronic data and/or programme carriers and production method therefor |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE20011590U1 (en) * | 2000-07-03 | 2000-09-07 | Infineon Technologies Ag | Semiconductor chip module with protective film |
EP2293657A1 (en) * | 2009-08-24 | 2011-03-09 | Schreiner Group GmbH & Co. KG | Electronic component and method of forming an electronic component |
US10834827B2 (en) | 2017-09-14 | 2020-11-10 | HELLA GmbH & Co. KGaA | System for potting components using a cap |
-
1973
- 1973-01-30 DE DE2304412A patent/DE2304412A1/en active Pending
- 1973-09-10 LU LU68391A patent/LU68391A1/xx unknown
- 1973-10-11 AT AT869073A patent/AT327345B/en not_active IP Right Cessation
- 1973-11-30 GB GB5554773A patent/GB1418949A/en not_active Expired
- 1973-12-12 AU AU63520/73A patent/AU6352073A/en not_active Expired
- 1973-12-14 NL NL7317195A patent/NL7317195A/xx unknown
- 1973-12-18 BR BR9911/73A patent/BR7309911D0/en unknown
-
1974
- 1974-01-03 SE SE7400046A patent/SE385757B/en unknown
- 1974-01-16 ZA ZA740310A patent/ZA74310B/en unknown
- 1974-01-22 CH CH85774A patent/CH562512A5/xx not_active IP Right Cessation
- 1974-01-25 IT IT19802/74A patent/IT1006156B/en active
- 1974-01-25 DD DD176196A patent/DD109475A5/xx unknown
- 1974-01-29 FR FR7402874A patent/FR2215780B1/fr not_active Expired
- 1974-01-29 ES ES422705A patent/ES422705A1/en not_active Expired
- 1974-01-29 ES ES422706A patent/ES422706A1/en not_active Expired
- 1974-01-29 SU SU1997125A patent/SU528892A3/en active
- 1974-01-30 BE BE140354A patent/BE810374A/en unknown
- 1974-01-30 CS CS632A patent/CS170484B2/cs unknown
- 1974-01-30 JP JP49011926A patent/JPS49105161A/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2750357A1 (en) * | 1976-11-09 | 1978-05-11 | Minnesota Mining & Mfg | MATERIAL FOR THE MANUFACTURING OF PROTECTIVE COVERINGS FOR ELECTRONIC COMPONENTS |
DE2830472A1 (en) * | 1978-07-11 | 1980-01-24 | Siemens Ag | METHOD FOR SERIAL COVERED ELECTRICAL COMPONENTS, IN PARTICULAR CAPACITORS |
DE3216192A1 (en) * | 1982-04-30 | 1983-11-03 | Siemens AG, 1000 Berlin und 8000 München | Electrical component which is accommodated in a housing in a centred and adjusted manner |
DE3346896A1 (en) * | 1983-12-23 | 1985-07-11 | Siemens AG, 1000 Berlin und 8000 München | Device for the protection of display elements, and circuits connected thereto to protect against disturbances (defects, faults) caused by electrostatic discharges |
DE3624852A1 (en) * | 1986-01-10 | 1987-07-16 | Orga Druck Gmbh | Electronic data and/or programme carriers and production method therefor |
Also Published As
Publication number | Publication date |
---|---|
AU6352073A (en) | 1975-06-12 |
ES422706A1 (en) | 1976-04-16 |
AT327345B (en) | 1976-01-26 |
NL7317195A (en) | 1974-08-01 |
SU528892A3 (en) | 1976-09-15 |
BE810374A (en) | 1974-05-16 |
JPS49105161A (en) | 1974-10-04 |
FR2215780A1 (en) | 1974-08-23 |
CH562512A5 (en) | 1975-05-30 |
DD109475A5 (en) | 1974-11-05 |
SE385757B (en) | 1976-07-19 |
LU68391A1 (en) | 1973-11-22 |
ZA74310B (en) | 1974-11-27 |
FR2215780B1 (en) | 1977-09-23 |
GB1418949A (en) | 1975-12-24 |
BR7309911D0 (en) | 1974-10-22 |
IT1006156B (en) | 1976-09-30 |
ES422705A1 (en) | 1976-04-16 |
CS170484B2 (en) | 1976-08-27 |
ATA869073A (en) | 1975-04-15 |
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