MY117983A - Electronic chip component and method of manufacturing the same - Google Patents

Electronic chip component and method of manufacturing the same

Info

Publication number
MY117983A
MY117983A MYPI96001993A MYPI9601993A MY117983A MY 117983 A MY117983 A MY 117983A MY PI96001993 A MYPI96001993 A MY PI96001993A MY PI9601993 A MYPI9601993 A MY PI9601993A MY 117983 A MY117983 A MY 117983A
Authority
MY
Malaysia
Prior art keywords
electrode layers
manufacturing
same
chip component
electronic chip
Prior art date
Application number
MYPI96001993A
Inventor
Masato Hashimoto
Tsuyoshi Himori
Suzushi Kimura
Kazunori Omoya
Mitsuru Harada
Takashi Obayashi
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP12616395A external-priority patent/JP3739830B2/en
Priority claimed from JP7278805A external-priority patent/JPH09129406A/en
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of MY117983A publication Critical patent/MY117983A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C8/00Non-adjustable resistors consisting of loose powdered or granular conducting, or powdered or granular semi-conducting material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Details Of Resistors (AREA)
  • Non-Adjustable Resistors (AREA)

Abstract

IN A CHIP RESISTOR COMPRISING OF A RESISTOR LAYER 4, A PAIR OF UPPER SURFACE ELECTRODE LAYERS 2, A PROTECTION LAYER 6 FORMED ON THE SURFACE OF A SUBSTRATE 1, AND A PAIR OF EXTERNAL ELECTRODES COMPOSED OF FIRST ELECTRODE LAYERS 3 AND SECOND ELECTRODE LAYERS 7 OF SOLDER AT BOTH SIDES, AN ELECTRO-CONDUCTIVE MATERIAL IN WHICH ELECTRO-CONDUCTIVE METAL POWDER HAVING PLURAL PROJECTIONS ON THE SURFACE AND RESIN BINDER ARE MIXED IS USED FOR MAKING THE FIRST ELECTRODE LAYERS 3, IN ORDER TO IMPROVE THE MECHANICAL STRENGTH OF THE EXTERNAL ELECTRODES. (FIG. 1)
MYPI96001993A 1995-05-25 1996-05-25 Electronic chip component and method of manufacturing the same MY117983A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP12616395A JP3739830B2 (en) 1995-05-25 1995-05-25 Chip-shaped electronic component and manufacturing method thereof
JP7278805A JPH09129406A (en) 1995-10-26 1995-10-26 Electronic component and manufacture thereof

Publications (1)

Publication Number Publication Date
MY117983A true MY117983A (en) 2004-08-30

Family

ID=26462384

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI96001993A MY117983A (en) 1995-05-25 1996-05-25 Electronic chip component and method of manufacturing the same

Country Status (4)

Country Link
KR (1) KR100212225B1 (en)
CN (1) CN1095174C (en)
DE (1) DE19620446A1 (en)
MY (1) MY117983A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1160742C (en) * 1997-07-03 2004-08-04 松下电器产业株式会社 Resistor and method of producing the same
DE10120517B4 (en) * 2001-04-26 2013-06-06 Epcos Ag Electrical multilayer PTC thermistor and method for its production
EP1386334A1 (en) 2001-05-08 2004-02-04 Epcos Ag Ceramic multi-layer element and a method for the production thereof
JPWO2007032201A1 (en) * 2005-09-15 2009-03-19 パナソニック株式会社 Chip electronic components
US8031043B2 (en) * 2008-01-08 2011-10-04 Infineon Technologies Ag Arrangement comprising a shunt resistor and method for producing an arrangement comprising a shunt resistor
CN110277206A (en) * 2018-03-16 2019-09-24 新力应用材料有限公司 Conductive terminal material, resistor and its production method
CN109767885B (en) * 2019-02-28 2020-09-22 华南理工大学 Zinc oxide piezoresistor element of solder alloy layer electrode and preparation method thereof

Also Published As

Publication number Publication date
DE19620446A1 (en) 1996-11-28
KR960042780A (en) 1996-12-21
KR100212225B1 (en) 1999-08-02
CN1095174C (en) 2002-11-27
CN1147138A (en) 1997-04-09

Similar Documents

Publication Publication Date Title
GB2354112B (en) Ceramic electronic component
MY113149A (en) Method of manufacturing a printed circuit assembly
GB2327631B (en) Ceramic electronic part and method for producing the same
EP0101791A3 (en) Multi-layer circuitry
MY112657A (en) Multi-layer electronic part
SG71171A1 (en) Semiconductor device method of making the same and electronic device using the same
EP0299252A3 (en) Integrated circuit lead frame assembly containing voltage bussing and distribution to an integrated circuit die using tape automated bonding with two metal layers
EP1895587A3 (en) Semiconductor package substrate
TW243584B (en) Apparatus having inner layers supporting surface-mount components and a method of manufacturing the same
WO1997023897A3 (en) Opto-electronic sensor component
SG81960A1 (en) Semiconductor device, substrate for a semiconductor device, method of manufacture thereof, and electronic instrument
MY117368A (en) A resistor and its manufacturing method
WO2000004584A3 (en) Semiconductor component in a chip format and method for the production thereof
EP0362161A3 (en) Method of manufacturing a substrate for microwave integrated circuits
MY117983A (en) Electronic chip component and method of manufacturing the same
US5112648A (en) Method of manufacturing a printed circuit board
CA1249064A (en) Process for application of overlay conductors to surface of printed circuit board assemblies
TW347577B (en) Bottom electrode structure for integrated circuit capacitors and method of making the same
CA2200154A1 (en) LSI Package and Manufacturing Method Thereof
MY133863A (en) Passive component integrated circuit chip
EP0039160A3 (en) Methods for bonding conductive bumps to electronic circuitry
JPS63213301A (en) Printed wiring board with printed resistor
EP1043767A4 (en) Semiconductor device, method of manufacture thereof, circuit board and electronic device
US5219607A (en) Method of manufacturing printed circuit board
TW350077B (en) Chip-shaped electronic parts and the manufacturing method