EP1386334A1 - Ceramic multi-layer element and a method for the production thereof - Google Patents
Ceramic multi-layer element and a method for the production thereofInfo
- Publication number
- EP1386334A1 EP1386334A1 EP01940212A EP01940212A EP1386334A1 EP 1386334 A1 EP1386334 A1 EP 1386334A1 EP 01940212 A EP01940212 A EP 01940212A EP 01940212 A EP01940212 A EP 01940212A EP 1386334 A1 EP1386334 A1 EP 1386334A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- ceramic
- component
- electrodes
- electrode
- sintering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 82
- 238000000034 method Methods 0.000 title claims description 13
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 22
- 239000010937 tungsten Substances 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 8
- 238000005245 sintering Methods 0.000 claims description 20
- 239000011888 foil Substances 0.000 claims description 12
- 239000002003 electrode paste Substances 0.000 claims description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 239000011261 inert gas Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 150000003658 tungsten compounds Chemical class 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 57
- 239000002245 particle Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 239000007772 electrode material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000010970 precious metal Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 239000000370 acceptor Substances 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000013528 metallic particle Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/022—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances
- H01C7/023—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances containing oxides or oxidic compounds, e.g. ferrites
- H01C7/025—Perovskites, e.g. titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
Definitions
- the invention relates to a ceramic multilayer component according to the preamble of claim 1 and a method for producing the component.
- Such a component is for example from the
- EP 0734031A2 known. It comprises a monolithic ceramic component body made of a perovskite ceramic, which has a multilayer structure made of alternating ceramic and electrode layers. The internal electrodes based on nickel or nickel alloys are alternately connected to collecting electrodes attached to the outside of the component body. The component is designed as a varistor. +
- a ceramic multilayer component which can be used as a capacitor is known from US-3679950.
- This component also has alternating ceramic and electrode layers, the electrode layers being alternately contacted with two collecting electrodes attached to the side of the component body.
- the electrode layers are first prefabricated as porous ceramic intermediate layers and only subsequently impregnated with conductive material, for example with silver in a silver nitrate melt or in a melt of a BiPbSnCd alloy.
- a ceramic PTC thermistor in multi-layer construction which has electrode layers comprising aluminum. These form an ohmic contact with the ceramic and can be sintered at temperatures up to 1200 ° without damage.
- a disadvantage of this multilayer thermistor component is that the aluminum partially diffuses out of the electrode layers into the ceramic, thereby impairing the component properties in the medium or long term or even rendering the component unusable.
- a ceramic multilayer component comprising a stack connected to form a monolithic component body from a plurality of ceramic layers provided on both sides with electrodes, in which the electrode layers are alternately contacted with collecting electrodes attached to the side of the component, and wherein Material of the internal electrodes comprises tungsten.
- the object of the present invention is to provide a ceramic multilayer component with ceramic layers comprising PTC ceramic, which has internal electrodes which are stable with respect to sintering and which has long-term stable component properties.
- This object is achieved according to the invention by a ceramic multilayer component of the type mentioned at the beginning, in which the material comprises at least the internal electrodes tungsten and in which the ceramic layers comprise a PTC ceramic.
- tungsten is an inexpensive electrode material which, for example, is considerably less expensive than noble metals such as palladium or platinum, so that ceramic multilayer components according to the invention are less expensive to manufacture than those with electrodes containing noble metals.
- Essential to the invention is not the electrical conductivity of tungsten, but the degradation of the barrier layer to the thermistor material, which alone is achieved by the presence of a suitable amount of tungsten that makes good ohmic contact.
- the thickness of the individual ceramic layer also reduces its electrical resistance perpendicular to the main surface, that is, in the direction of the layer thickness, without the specific resistance of the ceramic having to be reduced.
- a further reduction in the resistance of the entire multilayer component results from the parallel connection of the individual PTC elements which, when stacked one above the other, result in the multilayer component. This also ensures a high current carrying capacity of the component.
- the properties of the overall component can be specifically influenced or varied by varying the parameters of the layer thickness and base area of the individual element and the number of individual layers stacked one on top of the other in the multilayer component.
- a given multilayer component can therefore be varied within wide limits in its properties, without the ceramic composition having to be changed.
- the component properties can often only be set by varying the component dimension or by varying the materials used for the component.
- a ceramic multilayer component according to the invention is therefore particularly suitable for use in SMD assembly technology, which requires a compact machine-processable or machine-compatible design. This can be varied as desired for the multilayer component, since the component properties can be set independently of this.
- FIG. 1 shows a perspective view of a ceramic green sheet printed with an electrode layer
- FIG. 2 shows a multilayer component according to the invention in a schematic cross section
- FIG. 3 shows a top view of a ceramic green sheet that can be divided into several components with active and passive areas
- Figure 4 shows a layer stack of ceramic green sheet in cross section.
- the ceramic starting material is finely ground and mixed homogeneously with a binder material.
- the film is then produced in a desired thickness by film drawing or film casting.
- Figure 1 shows such a green sheet 1 in perspective
- An electrode pair is now placed on a surface of the green sheet 1 in the area provided for the electrode. ste 2 applied.
- a number of in particular sealing layer processes are suitable for this, preferably printing, for example by means of screen printing.
- the electrode paste 2 consists of metallic, metallic tungsten or a tungsten compound comprising particles for producing the desired conductivity, optionally sinterable ceramic particles for adapting the shrinking properties of the electrode paste to that of the ceramic and a burnable organic binder in order to make the ceramic mass or one more malleable To ensure cohesion of the green bodies.
- Particles of pure tungsten, particles of tungsten alloy, tungsten compound or mixed particles of tungsten and other metals can be used.
- the proportion of tungsten can vary within wide ranges, with the sintering conditions possibly having to be adapted to the composition of the electrode paste.
- the barrier layer in PTC thermistor material is broken down regularly with tungsten contents of 3 or more percent by weight (based on the metallic particles).
- the printed green foils 9 are then stacked in a desired number in a stack of foils such that (green) ceramic layers 1 and electrode layers 2 are arranged alternately one above the other.
- the electrode layers are also connected alternately on different sides of the component to collecting electrodes in order to connect the egg electrodes in parallel.
- a uniform electrode geometry is preferably selected for this purpose, the first and second green film 9 differing in that they are rotated in the film stack against one another by 180 °.
- the film stack which is still elastic due to the binder, is brought into the desired external shape by pressing and, if necessary, cutting.
- the ceramic is then sintered, which can comprise a multistage process in an atmosphere which at least initially contains little oxygen.
- the final sintering in which the ceramic sinters together to complete or to the desired density, is usually between 1100 and 1500 ° C. If an oxygen-containing atmosphere is selected for this high-temperature sintering step (for example with an oxygen partial pressure of at least 1 hectopasqual), a maximum sintering temperature of 1200 ° C. is maintained. Above this temperature there is a risk that the tungsten contained in the electrodes will oxidize and thus the electrical conductivity will be reduced.
- FIG. 2 shows a finished multilayer component 8 according to the invention in a schematic cross section. Ceramic layers 4 and electrode layers 5 are alternately arranged one above the other in the component body. Collective electrodes 6, 6 ′ are now produced on two opposite sides of the component body, each of which is in electrical contact with every second electrode layer 5.
- a metallization usually made of silver, can first be produced on the ceramic, for example by electroless deposition. This can then be galvanically reinforced, e.g. by applying a layer sequence Ag / Ni / Sn. This improves the solderability on circuit boards.
- the component 8 shown in FIG. 2 has ceramic layers as closing layers on both main surfaces.
- an unprinted green film 1 can be installed in the film stack as the top layer before sintering, so that the stack does not end with an electrode layer 2.
- the top and bottom ceramic layers in the stack thicker than the other ceramic layers 4 in the stack.
- the bottom and top layers can have a plurality of unprinted green films 1 without an electrode layer. built and pressed and sintered together with the rest of the green film stack.
- FIG. 3 shows a green film printed with an electrode pattern 2, which enables division into several components, each with a smaller base area.
- the passive areas 3 not printed with electrode paste are arranged in such a way that the alternating offset of the electrodes in the stack, which is suitable for contacting, can be set by alternately stacking first and second green foils. This can be achieved if the first and second green foils are mutually opposed by e.g. Are rotated 180 °, or if generally first and second green foils have an electrode pattern offset from one another.
- the intersection lines 7, along which the green sheet or the layer stack produced therefrom can be separated into individual components, are identified by dashed lines.
- electrode patterns are also possible in which the cut guides can be laid out so that no electrode layer has to be cut through. However, every second electrode layer can then be contacted from the edge of the stack. If necessary, the stacks are separated after the separation and sintering before the application of the collecting electrodes 6, 6 'in order to expose the electrode layers to be contacted.
- FIG. 4 shows a layer stack produced in this way in a schematic cross section. It can be seen that when the layer stack is separated along the cutting lines 7 components are created, each of which has the desired offset of the
- Such a stack of films comprising a number of component floor plans is divided into individual film stacks of the desired component base area preferably after the film stack has been pressed, for example by cutting or punching.
- the film stacks are then sintered.
- a multilayer component according to the invention which can be used as a PTC element, consists of a barium titanate ceramic of the general composition (Ba, Ca, Sr, Pb) Ti0 3 , which is doped with donors and / or acceptors, for example with manganese and yttrium ,
- the component can comprise, for example, 5 to 20 ceramic layers together with the associated electrode layers, but at least two internal electrode layers.
- the ceramic layers usually each have a thickness of 30 to 200 ⁇ m. However, they can also have larger or smaller layer thicknesses.
- the outer dimension of a PTC thermistor component in the inventive multilayer construction can vary, but is usually in the range of a few millimeters for components that can be processed with SMD.
- a suitable size is, for example, the design 2220 known from capacitors.
- the PTC thermistor component can also be smaller.
- the manufacturing process for ceramic multi-layer components known apart from the choice of the electrode material could only be illustrated by way of example using the exemplary embodiment.
- the invention is therefore not limited to the exemplary embodiments and can still be modified as desired by varying most of the parameters.
- the invention has particular advantages for the thermistor components mentioned, which can be obtained with the invention for the first time as stable multilayer components with a small design and low resistance.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
Claims
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/DE2001/001736 WO2002091408A1 (en) | 2001-05-08 | 2001-05-08 | Ceramic multi-layer element and a method for the production thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1386334A1 true EP1386334A1 (en) | 2004-02-04 |
Family
ID=5648238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP01940212A Withdrawn EP1386334A1 (en) | 2001-05-08 | 2001-05-08 | Ceramic multi-layer element and a method for the production thereof |
Country Status (5)
Country | Link |
---|---|
US (1) | US7154736B2 (en) |
EP (1) | EP1386334A1 (en) |
JP (1) | JP4898080B2 (en) |
CN (1) | CN1319086C (en) |
WO (1) | WO2002091408A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4898080B2 (en) | 2001-05-08 | 2012-03-14 | エプコス アクチエンゲゼルシャフト | Ceramic multilayer device and manufacturing method thereof |
DE10218154A1 (en) | 2002-04-23 | 2003-11-13 | Epcos Ag | PTC component and method for its production |
TWI270195B (en) * | 2003-07-30 | 2007-01-01 | Innochips Technology | Complex laminated chip element |
KR100765180B1 (en) * | 2005-03-11 | 2007-10-15 | 삼성전기주식회사 | Multi-layer Ceramic Capacitor and Production Method Thereof |
WO2007139061A1 (en) * | 2006-05-31 | 2007-12-06 | Murata Manufacturing Co., Ltd. | Semiconductor ceramic, laminated semiconductor ceramic capacitor, method for fabricating semiconductor ceramic, and method for fabricating laminated semiconductor ceramic capacitor |
US8268452B2 (en) * | 2007-07-31 | 2012-09-18 | Baker Hughes Incorporated | Bonding agents for improved sintering of earth-boring tools, methods of forming earth-boring tools and resulting structures |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6473608A (en) * | 1987-09-14 | 1989-03-17 | Nec Corp | Laminated ceramic capacitor |
JPH08153605A (en) * | 1994-06-28 | 1996-06-11 | Teika Corp | Manufacture of laminated type semiconductor ceramic element |
WO2002089160A2 (en) * | 2001-04-26 | 2002-11-07 | Epcos Ag | Electrical multilayer component and method for the production thereof |
Family Cites Families (32)
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US3612963A (en) * | 1970-03-11 | 1971-10-12 | Union Carbide Corp | Multilayer ceramic capacitor and process |
US3679950A (en) * | 1971-04-16 | 1972-07-25 | Nl Industries Inc | Ceramic capacitors |
CA1264871A (en) * | 1986-02-27 | 1990-01-23 | Makoto Hori | Positive ceramic semiconductor device with silver/palladium alloy electrode |
JPH01233702A (en) * | 1988-03-14 | 1989-09-19 | Murata Mfg Co Ltd | V2o3 ceramic resistance element |
DE3830174A1 (en) | 1988-09-06 | 1990-03-15 | Geesthacht Gkss Forschung | CONDUCTIVE SURFACE LAYER |
JP2615977B2 (en) * | 1989-02-23 | 1997-06-04 | 松下電器産業株式会社 | Dielectric ceramic composition, multilayer ceramic capacitor using the same, and method of manufacturing the same |
JPH0650703B2 (en) * | 1989-07-17 | 1994-06-29 | 松下電器産業株式会社 | Paste composition and method for manufacturing laminated ceramic capacitor |
EP0476657A1 (en) * | 1990-09-21 | 1992-03-25 | Siemens Aktiengesellschaft | Thermistor with negative temperature coefficient produced by multilayer technology |
US5262920A (en) | 1991-05-16 | 1993-11-16 | Nec Corporation | Thin film capacitor |
JP2991527B2 (en) * | 1991-05-22 | 1999-12-20 | 第一工業製薬株式会社 | Conductor paste for ceramic capacitor electrodes |
JPH06302403A (en) * | 1993-04-16 | 1994-10-28 | Murata Mfg Co Ltd | Lamination type semiconductor ceramic element |
US5600533A (en) * | 1994-06-23 | 1997-02-04 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor having an anti-reducing agent |
DE69632659T2 (en) | 1995-03-24 | 2005-06-09 | Tdk Corp. | multilayer varistor |
DE19620446A1 (en) | 1995-05-25 | 1996-11-28 | Matsushita Electric Ind Co Ltd | Electronic chip component, e.g. resistor, capacitor, inductor |
US5879812A (en) * | 1995-06-06 | 1999-03-09 | Murata Manufacturing Co., Ltd. | Monolithic ceramic capacitor and method of producing the same |
JP3330836B2 (en) * | 1997-01-22 | 2002-09-30 | 太陽誘電株式会社 | Manufacturing method of laminated electronic components |
US6159267A (en) * | 1997-02-24 | 2000-12-12 | Superior Micropowders Llc | Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom |
DE19719174A1 (en) | 1997-05-06 | 1998-11-12 | Siemens Matsushita Components | Multilayer ceramic electrical component with sintered monolithic body |
US6359327B1 (en) * | 1998-03-05 | 2002-03-19 | Murata Manufacturing Co., Ltd. | Monolithic electronic element fabricated from semiconducting ceramic |
JP3341672B2 (en) | 1998-04-13 | 2002-11-05 | 株式会社村田製作所 | Method for manufacturing piezoelectric ceramic element |
CA2304030C (en) * | 1998-07-15 | 2003-12-30 | Toho Titanium Co., Ltd. | Metal powder |
JP3567759B2 (en) * | 1998-09-28 | 2004-09-22 | 株式会社村田製作所 | Dielectric ceramic composition and multilayer ceramic capacitor |
DE19902769A1 (en) | 1999-01-25 | 2000-07-27 | Philips Corp Intellectual Pty | Ceramic, passive component |
TW487742B (en) * | 1999-05-10 | 2002-05-21 | Matsushita Electric Ind Co Ltd | Electrode for PTC thermistor, manufacture thereof, and PTC thermistor |
JP3812268B2 (en) * | 1999-05-20 | 2006-08-23 | 株式会社村田製作所 | Multilayer semiconductor ceramic element |
JP2001023852A (en) * | 1999-07-06 | 2001-01-26 | Murata Mfg Co Ltd | Laminated ceramic electronic component |
DE19945011C1 (en) * | 1999-09-20 | 2001-05-03 | Epcos Ag | Production of a doped barium titanate ceramic used in the production of PTC resistors or multiple layered capacitors comprises adding a sintering aid to the starting materials and sintering at a maximum temperature |
JP2001126946A (en) * | 1999-10-28 | 2001-05-11 | Murata Mfg Co Ltd | Laminated ceramic electronic component and method for manufacturing the same |
WO2001033589A1 (en) | 1999-11-01 | 2001-05-10 | Tdk Corporation | Multilayer ceramic electronic component |
WO2001057885A1 (en) * | 2000-01-31 | 2001-08-09 | Toho Titanium Co., Ltd. | Nickel power dispersion, method of producing nickel power dispersion and method of producing conductive paste |
JP4898080B2 (en) | 2001-05-08 | 2012-03-14 | エプコス アクチエンゲゼルシャフト | Ceramic multilayer device and manufacturing method thereof |
DE60214243D1 (en) * | 2001-06-14 | 2006-10-05 | Toho Titanium Co Ltd | METHOD FOR PRODUCING METAL POWDER |
-
2001
- 2001-05-08 JP JP2002588576A patent/JP4898080B2/en not_active Expired - Fee Related
- 2001-05-08 WO PCT/DE2001/001736 patent/WO2002091408A1/en active Application Filing
- 2001-05-08 CN CNB01823237XA patent/CN1319086C/en not_active Expired - Fee Related
- 2001-05-08 US US10/474,492 patent/US7154736B2/en not_active Expired - Fee Related
- 2001-05-08 EP EP01940212A patent/EP1386334A1/en not_active Withdrawn
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Publication number | Priority date | Publication date | Assignee | Title |
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JPS6473608A (en) * | 1987-09-14 | 1989-03-17 | Nec Corp | Laminated ceramic capacitor |
JPH08153605A (en) * | 1994-06-28 | 1996-06-11 | Teika Corp | Manufacture of laminated type semiconductor ceramic element |
WO2002089160A2 (en) * | 2001-04-26 | 2002-11-07 | Epcos Ag | Electrical multilayer component and method for the production thereof |
Non-Patent Citations (1)
Title |
---|
See also references of WO02091408A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN1319086C (en) | 2007-05-30 |
JP2004521510A (en) | 2004-07-15 |
JP4898080B2 (en) | 2012-03-14 |
US20040108041A1 (en) | 2004-06-10 |
CN1507641A (en) | 2004-06-23 |
US7154736B2 (en) | 2006-12-26 |
WO2002091408A1 (en) | 2002-11-14 |
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