DE19719174A1 - Multilayer ceramic electrical component with sintered monolithic body - Google Patents

Multilayer ceramic electrical component with sintered monolithic body

Info

Publication number
DE19719174A1
DE19719174A1 DE19719174A DE19719174A DE19719174A1 DE 19719174 A1 DE19719174 A1 DE 19719174A1 DE 19719174 A DE19719174 A DE 19719174A DE 19719174 A DE19719174 A DE 19719174A DE 19719174 A1 DE19719174 A1 DE 19719174A1
Authority
DE
Germany
Prior art keywords
layers
contact layers
electrical component
multilayer ceramic
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19719174A
Other languages
German (de)
Inventor
Kirsten Lutz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Siemens Matsushita Components GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Matsushita Components GmbH and Co KG filed Critical Siemens Matsushita Components GmbH and Co KG
Priority to DE19719174A priority Critical patent/DE19719174A1/en
Publication of DE19719174A1 publication Critical patent/DE19719174A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

The resistive body (1) of the component has a number of layers (2) of ceramic between interdigitated contact layers (3) extending into it from metallic electrodes (4,5) at opposite sides. Its manufacture begins with pulling or pressing of green sheets corresponding to the ceramic layers. The contact layers are made of aluminium-containing paste and the body is pressed and cut to the desired shape. Its final treatment consists of sintering with a corresponding temperature profile in a variable inert gaseous atmosphere.

Description

Die vorliegende Erfindung betrifft ein elektrisches Viel­ schichtbauelement nach dem Oberbegriff des Patentanspruchs.The present invention relates to an electrical lot Layer component according to the preamble of the claim.

Aus der US-PS 3 679 950 sind monolithische Kondensatoren be­ kannt, welche dünne Schichten aus dielektrischem Material und zwischen diesen befindliche Kontaktschichten aus leitendem Material aufweisen. Die Kontaktschichten aus leitendem Mate­ rial sind so ausgebildet, daß sie alternierend zu sich gegen­ überliegenden Endflachen des Kondensators verlaufen und durch metallische Elektroden ihre Enden elektrisch miteinander ver­ bunden sind.Monolithic capacitors are known from US Pat. No. 3,679,950 knows which thin layers of dielectric material and contact layers of conductive between them Have material. The contact layers made of conductive mate rial are designed so that they alternate against each other overlying end faces of the capacitor and through metallic electrodes ver verge their ends together are bound.

Bisher werden als Kontaktschichten insbesondere bei Viel­ schichtkondensatoren hauptsächlich Ag/Pd-Legierungen verwen­ det.So far, as contact layers, especially at Viel Layer capacitors mainly use Ag / Pd alloys det.

Die Herstellung von Kaltleitern in Vielschichttechnologie ge­ staltet sich schwieriger, da Edelmetalle für die Kontakt­ schichten nicht geeignet sind, da sie keinen ohmschen Kontakt zur Keramik aufbauen können.The production of PTC thermistors in multi-layer technology is more difficult because precious metals for the contact layers are not suitable since they have no ohmic contact can build up to ceramics.

Der vorliegenden Erfindung liegt die Aufgabe zugrunde, auch eine Möglichkeit zur Herstellung von Kaltleitern in Viel­ schichttechnologie zu schaffen.The present invention is based on the object, too a possibility for the production of PTC thermistors in a lot to create layer technology.

Diese Aufgabe wird bei einem elektrischen Vielschichtbauele­ ment in Form eines Vielschicht-Kaltleiters durch die Maßnahme des kennzeichnenden Teils des Patentanspruchs gelöst. Eine Weiterbildung der Erfindung ist Gegenstand eines Unteran­ spruchs. This task is done with an electrical multilayer component ment in the form of a multilayer PTC thermistor through the measure of the characterizing part of the claim. A Further development of the invention is the subject of a sub saying.  

Die Erfindung wird nachfolgenden anhand eines Ausführungsbei­ spiels gemäß der einzigen Figur der Zeichnung näher erläu­ tert, welche eine schematische Darstellung des generellen Aufbaus eines elektrischen Vielschichtbauelementes zeigt.The invention is illustrated below with the aid of an embodiment game according to the single figure of the drawing tert, which is a schematic representation of the general Structure of an electrical multilayer component shows.

Die Figur der Zeichnung zeigt in vergrößertem Maßstab ein mo­ nolithisches elektrisches Vielschichtwiderstandselement 1 mit Schichten 2 aus keramischem Material und Kontaktschichten 3 aus elektrisch leitendem Material zwischen den Schichten 2 aus keramischem Material. Die leitenden Kontaktschichten 3 sind so ausgebildet, daß sie alternierend zu sich gegenüber­ liegenden Endflächen des Vielschichtwiderstandselementes 1 verlaufen und an ihren Enden in an sich bekannter Weise durch metallische Elektroden 4 und 5 elektrisch miteinander verbun­ den sind. Durch die alternierende Anordnung der elektrisch leitenden Kontaktschichten 3 im oben beschriebenen Sinne ent­ stehen jeweils Bereiche 6 der Schichten 2 aus keramischem Ma­ terial, welche jeweils jede zweite Kontaktschicht 3 aus lei­ tendem Material von den metallischen Elektroden 4 und 5 tren­ nen. Die Herstellung eines derartigen Vielschichtwiderstand­ selementes kann wie folgt durchgeführt werden. Zunächst wer­ den durch Folienziehen oder Pressen Grünkörper entsprechend den Schichten 2 aus keramischem Material hergestellt. Sodann wird das Bauelement entsprechend der Figur der Zeichnung mit Aluminiumpaste für die Kontaktschichten hergestellt und der Körper durch Pressen und Schneiden in die gewünschte Form ge­ bracht. Schließlich wird der so geformte Körper durch Sintern mit entsprechendem Temperaturprofil und in variabler Gasatmo­ sphäre einer Endbehandlung unterworfen.The figure of the drawing shows on an enlarged scale a monolithic electrical multilayer resistance element 1 with layers 2 of ceramic material and contact layers 3 of electrically conductive material between the layers 2 of ceramic material. The conductive contact layers 3 are formed so that they are alternately extending to opposite end faces of the multilayer resistor element 1 and at its ends in known manner by metallic electrodes 4 and 5 are electrically verbun each other to. Due to the alternating arrangement of the electrically conductive contact layers 3 in the sense described above, areas 6 of the layers 2 made of ceramic material are formed, which separate each second contact layer 3 of conductive material from the metallic electrodes 4 and 5 . The production of such a multilayer resistor element can be carried out as follows. First, who the green body according to the layers 2 made of ceramic material by film or pressing. Then the component is made according to the figure of the drawing with aluminum paste for the contact layers and the body is brought into the desired shape by pressing and cutting. Finally, the body thus shaped is subjected to a final treatment by sintering with a corresponding temperature profile and in a variable gas atmosphere.

Versuche haben gezeigt, daß sich Aluminiumpaste oder alumini­ umhaltige Paste für die Kontaktschichten 3 besonders gut eig­ net. An Luft sind dabei Sintertemperaturen vollständiger Bau­ elemente bis oberhalb von 1200°C möglich. Die Sintertempera­ tur kann durch Verwendung einer Inertgasatmosphäre wie Stick­ stoff oder Edelgasen mit Sauerstoffrestgehalten kleiner als 10-5 atm noch gesteigert werden.Experiments have shown that aluminum paste or aluminum-containing paste for the contact layers 3 is particularly suitable. Sintering temperatures of complete components up to above 1200 ° C are possible in air. The sintering temperature can be increased by using an inert gas atmosphere such as nitrogen or noble gases with residual oxygen contents of less than 10 -5 atm.

Mit Aluminium für die Kontaktschichten 3 ist es prinzipiell möglich, Vielschicht-Kaltleiter herzustellen und die Ferti­ gungskosten für keramische Vielschichtbauelemente wie Viel­ schicht-Kondensatoren zu senken. Dabei ergibt sich der zu­ sätzliche Vorteil, daß kostengünstigeres Material für die Kontaktschichten 3 im Vergleich zu herkömmlichen Edelmetallen in Vielschichtbauelementen verwendbar ist.With aluminum for the contact layers 3 , it is in principle possible to produce multilayer PTC thermistors and to reduce the production costs for ceramic multilayer components such as multilayer capacitors. This has the additional advantage that less expensive material for the contact layers 3 can be used in comparison with conventional noble metals in multilayer components.

Claims (2)

1. Elektrisches Vielschichtbauelement mit einem gesinterten monolithischen Bauelementekörper (1), der eine Vielzahl von Schichten (2) aus keramischem Material aufweist, zwischen de­ nen elektrisch leitende alternierend zu jeweils bis zu einer Seitenfläche zweier sich gegenüberliegender Seitenfläche des Keramikkörpers (1) verlaufende Kontaktschichten (3) vorgese­ hen sind, die an den Seitenflächen durch jeweils eine metal­ lische Elektrode (4, 5) kontaktiert sind, dadurch gekennzeichnet, daß die Kontaktschichten (3) aus einer mindestens aluminium­ haltigen Paste hergestellt sind.1. Electrical multilayer component with a sintered monolithic component body ( 1 ), which has a multiplicity of layers ( 2 ) made of ceramic material, between the electrically conductive alternating contact layers (each extending up to one side face of two opposite side faces of the ceramic body ( 1 )) 3 ) are hen hen, which are contacted on the side surfaces by a metallic electrode ( 4 , 5 ), characterized in that the contact layers ( 3 ) are made of an at least aluminum-containing paste. 2. Bauelement nach Anspruch 1, dadurch gekennzeichnet, daß die Kontaktschichten (3) aus Aluminium-Paste hergestellt sind.2. Component according to claim 1, characterized in that the contact layers ( 3 ) are made of aluminum paste.
DE19719174A 1997-05-06 1997-05-06 Multilayer ceramic electrical component with sintered monolithic body Ceased DE19719174A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19719174A DE19719174A1 (en) 1997-05-06 1997-05-06 Multilayer ceramic electrical component with sintered monolithic body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19719174A DE19719174A1 (en) 1997-05-06 1997-05-06 Multilayer ceramic electrical component with sintered monolithic body

Publications (1)

Publication Number Publication Date
DE19719174A1 true DE19719174A1 (en) 1998-11-12

Family

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Country Status (1)

Country Link
DE (1) DE19719174A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19945641A1 (en) * 1999-09-23 2001-04-05 Abb Research Ltd Resistance element for an electrical network and/or an electronic component has a resistance body made of a ceramic interspersed with metal
DE10018377C1 (en) * 2000-04-13 2001-12-06 Epcos Ag Ceramic multilayered component used as a PTC resistance element comprises a stack of PTC ceramic layers with tungsten electrodes on both sides connected to a monolithic body
WO2002089160A2 (en) * 2001-04-26 2002-11-07 Epcos Ag Electrical multilayer component and method for the production thereof
WO2003092019A1 (en) * 2002-04-23 2003-11-06 Epcos Ag Positive temperature coefficient (ptc) component and method for the production thereof
US7154736B2 (en) 2001-05-08 2006-12-26 Epcos Ag Ceramic multi-layer element and a method for the production thereof
EP2306474A1 (en) 2009-09-30 2011-04-06 Murata Manufacturing Co., Ltd. Laminated ceramic electronic component and method for producing laminated ceramic electronic component
WO2013026660A1 (en) * 2011-08-19 2013-02-28 Siemens Aktiengesellschaft Piezoceramic multilayer component
WO2013037559A1 (en) 2011-09-15 2013-03-21 Epcos Ag Multi-layer component and method for producing same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54149715A (en) * 1978-05-17 1979-11-24 Tdk Electronics Co Ltd High dielectric porcelain composition
EP0734031A2 (en) * 1995-03-24 1996-09-25 TDK Corporation Multilayer varistor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54149715A (en) * 1978-05-17 1979-11-24 Tdk Electronics Co Ltd High dielectric porcelain composition
EP0734031A2 (en) * 1995-03-24 1996-09-25 TDK Corporation Multilayer varistor

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19945641A1 (en) * 1999-09-23 2001-04-05 Abb Research Ltd Resistance element for an electrical network and/or an electronic component has a resistance body made of a ceramic interspersed with metal
DE10018377C1 (en) * 2000-04-13 2001-12-06 Epcos Ag Ceramic multilayered component used as a PTC resistance element comprises a stack of PTC ceramic layers with tungsten electrodes on both sides connected to a monolithic body
WO2002089160A2 (en) * 2001-04-26 2002-11-07 Epcos Ag Electrical multilayer component and method for the production thereof
DE10120517A1 (en) * 2001-04-26 2002-11-21 Epcos Ag Electrical multilayer component and method for its production
WO2002089160A3 (en) * 2001-04-26 2003-07-17 Epcos Ag Electrical multilayer component and method for the production thereof
DE10120517B4 (en) * 2001-04-26 2013-06-06 Epcos Ag Electrical multilayer PTC thermistor and method for its production
US6898071B2 (en) 2001-04-26 2005-05-24 Epcos Ag Electrical multilayer component and method for the production thereof
US7154736B2 (en) 2001-05-08 2006-12-26 Epcos Ag Ceramic multi-layer element and a method for the production thereof
US7633374B2 (en) 2002-04-23 2009-12-15 Epcos Ag Positive temperature coefficient (PTC) component and method for the production thereof
WO2003092019A1 (en) * 2002-04-23 2003-11-06 Epcos Ag Positive temperature coefficient (ptc) component and method for the production thereof
EP2306474A1 (en) 2009-09-30 2011-04-06 Murata Manufacturing Co., Ltd. Laminated ceramic electronic component and method for producing laminated ceramic electronic component
EP2500919A1 (en) 2009-09-30 2012-09-19 Murata Manufacturing Co., Ltd. Laminated ceramic electronic component and method for producing laminated ceramic electronic component
US9129745B2 (en) 2009-09-30 2015-09-08 Murata Manufacturing Co., Ltd. Laminated ceramic electronic component and method for producing laminated ceramic electronic component
WO2013026660A1 (en) * 2011-08-19 2013-02-28 Siemens Aktiengesellschaft Piezoceramic multilayer component
WO2013037559A1 (en) 2011-09-15 2013-03-21 Epcos Ag Multi-layer component and method for producing same
DE102011113496A1 (en) 2011-09-15 2013-03-21 Epcos Ag Multi-layer component and method for its production
US9583262B2 (en) 2011-09-15 2017-02-28 Epcos Ag Multi-layer component and method for producing same

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8127 New person/name/address of the applicant

Owner name: EPCOS AG, 81541 MUENCHEN, DE

8131 Rejection