JPS53114669A - Cutting method for semiconductor wafer - Google Patents

Cutting method for semiconductor wafer

Info

Publication number
JPS53114669A
JPS53114669A JP2858177A JP2858177A JPS53114669A JP S53114669 A JPS53114669 A JP S53114669A JP 2858177 A JP2858177 A JP 2858177A JP 2858177 A JP2858177 A JP 2858177A JP S53114669 A JPS53114669 A JP S53114669A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
cutting method
laser beam
cutting
transmittable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2858177A
Other languages
Japanese (ja)
Inventor
Susumu Yahagi
Tomoji Hishida
Masashi Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP2858177A priority Critical patent/JPS53114669A/en
Publication of JPS53114669A publication Critical patent/JPS53114669A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Lasers (AREA)

Abstract

PURPOSE:To prevent inferior wafers from being taken place, by fixing a semiconductor wafer at the transparent holder through which laser beam is transmittable and by emitting and cutting a low output laser beam on the both sides up and down.
JP2858177A 1977-03-17 1977-03-17 Cutting method for semiconductor wafer Pending JPS53114669A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2858177A JPS53114669A (en) 1977-03-17 1977-03-17 Cutting method for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2858177A JPS53114669A (en) 1977-03-17 1977-03-17 Cutting method for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS53114669A true JPS53114669A (en) 1978-10-06

Family

ID=12252556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2858177A Pending JPS53114669A (en) 1977-03-17 1977-03-17 Cutting method for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS53114669A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS599915A (en) * 1982-07-07 1984-01-19 Taiyo Yuden Co Ltd Forming method for transparent-film pattern
JPS60206590A (en) * 1984-03-30 1985-10-18 Hitachi Cable Ltd Production of semiconductor wafer
JP2009248126A (en) * 2008-04-04 2009-10-29 Shibaura Mechatronics Corp Laser machining device
CN102655120A (en) * 2011-03-04 2012-09-05 株式会社迪思科 Laser processing method for wafer and laser processing device
JP2012190977A (en) * 2011-03-10 2012-10-04 Disco Abrasive Syst Ltd Laser processing device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS599915A (en) * 1982-07-07 1984-01-19 Taiyo Yuden Co Ltd Forming method for transparent-film pattern
JPS60206590A (en) * 1984-03-30 1985-10-18 Hitachi Cable Ltd Production of semiconductor wafer
JPH0146235B2 (en) * 1984-03-30 1989-10-06 Hitachi Cable
JP2009248126A (en) * 2008-04-04 2009-10-29 Shibaura Mechatronics Corp Laser machining device
CN102655120A (en) * 2011-03-04 2012-09-05 株式会社迪思科 Laser processing method for wafer and laser processing device
JP2012186287A (en) * 2011-03-04 2012-09-27 Disco Abrasive Syst Ltd Laser processing method and laser processing device for wafer
JP2012190977A (en) * 2011-03-10 2012-10-04 Disco Abrasive Syst Ltd Laser processing device

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