JPS53114669A - Cutting method for semiconductor wafer - Google Patents
Cutting method for semiconductor waferInfo
- Publication number
- JPS53114669A JPS53114669A JP2858177A JP2858177A JPS53114669A JP S53114669 A JPS53114669 A JP S53114669A JP 2858177 A JP2858177 A JP 2858177A JP 2858177 A JP2858177 A JP 2858177A JP S53114669 A JPS53114669 A JP S53114669A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- cutting method
- laser beam
- cutting
- transmittable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laser Beam Processing (AREA)
- Dicing (AREA)
- Lasers (AREA)
Abstract
PURPOSE:To prevent inferior wafers from being taken place, by fixing a semiconductor wafer at the transparent holder through which laser beam is transmittable and by emitting and cutting a low output laser beam on the both sides up and down.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2858177A JPS53114669A (en) | 1977-03-17 | 1977-03-17 | Cutting method for semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2858177A JPS53114669A (en) | 1977-03-17 | 1977-03-17 | Cutting method for semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53114669A true JPS53114669A (en) | 1978-10-06 |
Family
ID=12252556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2858177A Pending JPS53114669A (en) | 1977-03-17 | 1977-03-17 | Cutting method for semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53114669A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS599915A (en) * | 1982-07-07 | 1984-01-19 | Taiyo Yuden Co Ltd | Forming method for transparent-film pattern |
JPS60206590A (en) * | 1984-03-30 | 1985-10-18 | Hitachi Cable Ltd | Production of semiconductor wafer |
JP2009248126A (en) * | 2008-04-04 | 2009-10-29 | Shibaura Mechatronics Corp | Laser machining device |
CN102655120A (en) * | 2011-03-04 | 2012-09-05 | 株式会社迪思科 | Laser processing method for wafer and laser processing device |
JP2012190977A (en) * | 2011-03-10 | 2012-10-04 | Disco Abrasive Syst Ltd | Laser processing device |
-
1977
- 1977-03-17 JP JP2858177A patent/JPS53114669A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS599915A (en) * | 1982-07-07 | 1984-01-19 | Taiyo Yuden Co Ltd | Forming method for transparent-film pattern |
JPS60206590A (en) * | 1984-03-30 | 1985-10-18 | Hitachi Cable Ltd | Production of semiconductor wafer |
JPH0146235B2 (en) * | 1984-03-30 | 1989-10-06 | Hitachi Cable | |
JP2009248126A (en) * | 2008-04-04 | 2009-10-29 | Shibaura Mechatronics Corp | Laser machining device |
CN102655120A (en) * | 2011-03-04 | 2012-09-05 | 株式会社迪思科 | Laser processing method for wafer and laser processing device |
JP2012186287A (en) * | 2011-03-04 | 2012-09-27 | Disco Abrasive Syst Ltd | Laser processing method and laser processing device for wafer |
JP2012190977A (en) * | 2011-03-10 | 2012-10-04 | Disco Abrasive Syst Ltd | Laser processing device |
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